Eco-Friendly Crystalline Silica Powder Encapsulation Material

1. High Purity and Fine Particle Size
   Using natural quartz ore as the raw material, through processes such as iron-free grinding, acid washing and purification, and precise classification, it ensures that the content of silicon dioxide (SiO2) is ≥ 99%, and the content of heavy metals (such as Fe2O3 and Al2O3) is ≤ 0.003%. The particle size distribution can be precisely controlled, and the range of D50 (median particle size) is 0.5-20μm. Multi-peak distribution or narrow distribution can be customized according to customer needs.

2. Excellent Thermal Performance
   Low linear expansion coefficient (14×10-6/K): It highly matches the thermal expansion coefficient of the chip substrate (such as monocrystalline silicon), effectively reducing the thermal stress between the encapsulation material and the chip, and avoiding cracking or delamination.
   High thermal conductivity (12.6 W/(m.K)): By optimizing the particle grading and surface modification, the heat conduction efficiency is improved, ensuring the stability of the chip under high-power operation.

3. Excellent Electrical Insulation
   The dielectric constant is as low as 4.65 (1MHz), and the dielectric loss is ≤ 0.0018 (1MHz), which can significantly reduce the signal transmission loss and meet the stringent requirements of high-frequency and high-speed circuits for dielectric performance.

4. High Filling Rate and Fluidity
   The particles are in a near-spherical or rounded crystalline form, and the filling rate can reach 60%-90%, while maintaining good fluidity, which is suitable for narrow-gap encapsulation and the molding of complex structures.

1. Environmental Protection of the Production Process
   Clean Production: Adopting the iron-free grinding process and a closed water circulation system to reduce dust emissions and wastewater pollution. The wastewater is recycled after being treated by a sand settling tank, a neutralization reaction tank, etc., realizing the recycling of resources.
   Energy-saving Technology: The production equipment is equipped with a low-nitrogen combustion system and a waste heat recovery device to reduce energy consumption.

1. Semiconductor and Integrated Circuit Encapsulation
   As the core filler of epoxy molding compound (EMC) (accounting for 60%-90%), it is used for the encapsulation of discrete devices, memory chips, power devices, etc., improving the heat resistance, impact resistance, and long-term reliability of the material. Spherical silica micro powder is more suitable for large-scale integrated circuits and advanced encapsulation technologies (such as flip chips and underfill), which can reduce the encapsulation stress and increase the yield.

2. New Energy Vehicles and Power Batteries
   It is used for the encapsulation of battery module potting adhesives and in-vehicle electronic devices. With its characteristics of low expansion and high thermal conductivity, it ensures the stability of the battery in a high-temperature environment and meets the requirements of lightweight and high safety at the same time.

3. High-frequency and High-speed Copper Clad Laminates (CCL)
   When filled in the copper clad laminate, it can reduce the coefficient of thermal expansion (CTE) of the substrate and improve the dielectric performance (low Df/Dk), which is suitable for high-frequency and high-speed scenarios such as 5G communication base stations and high-speed servers.

4. Other Fields
   It can also be applied to electrical insulation materials, LED encapsulation, precision ceramics, high-temperature coatings, etc., giving full play to its advantages of high hardness, weather resistance, and chemical stability.

1. Core Processes
   Raw Material Selection: Select natural quartz ore with a purity of ≥ 99%, and remove impurities through magnetic separation and flotation.
   Ultra-fine Grinding: Adopt the air jet mill or wet ball mill process, combined with multi-stage classification technology, to achieve precise control of the particle size.
   Surface Modification: Through silane coupling agents or coating modification, the compatibility between the powder and the organic resin is improved, and the dispersibility and filling performance are enhanced.

2. Quality Control
   Impurity Detection: Use instruments such as ICP-MS and XRF to strictly control heavy metals and radioactive elements (such as the uranium content < 0.5ppb).
   Particle Size Analysis: Use a laser particle size analyzer to monitor parameters such as D50 and D90 in real time to ensure batch stability.

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Basic Parameters