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Product Overview
High-purity industrial-grade crystalline silica micro-powder is a functional powder material characterized by ultra-high purity and fine particle size. It is refined from high-purity quartz sand through specialized processes, offering exceptional chemical stability, high melting point, low thermal expansion coefficient, and superior electrical insulation properties. Widely used in electronic encapsulation, precision casting, high-end coatings, composite materials, and refractory applications.
Product Features
High Purity: SiO2 content ≥90% with extremely low impurities
Ultra-Fine Particle Size: D50 adjustable between 0.5-50μm, customizable grading available
Excellent Thermal Stability: Withstands temperatures exceeding 1600°C with low thermal expansion
High Insulation: Volume resistivity >10¹4 Ω·cm, ideal for electronic-grade applications
Chemical Inertness: Resistant to acid/alkali corrosion and oxidation
Typical Applications
Electronic Encapsulation: Filler for epoxy/silicone molding compounds to enhance performance
 Precision Casting: Improves surface finish of castings and reduces metal penetration
 High-End Coatings: Boosts wear resistance, weather resistance, and UV protection
 Composite Materials: Reinforcement modifier for ceramics, plastics, and rubber
Refractories: Enhances thermal shock resistance and mechanical strength of refractory products
Basic Parameters
 
| Item | Unit | Typical Values | 
| Exterior | / | white powder | 
| Density | kg/m³ | 2.65 ×103 | 
| Moh's hardness | / | 7 | 
| Coefficient of linear expansion | 1/k | 14×10-6 | 
| Pyroconductivity | w/k.m | 12.6 | 
| Refraction coefficient | / | 1.54 | 
Product Overview
High-purity industrial-grade crystalline silica micro-powder is a functional powder material characterized by ultra-high purity and fine particle size. It is refined from high-purity quartz sand through specialized processes, offering exceptional chemical stability, high melting point, low thermal expansion coefficient, and superior electrical insulation properties. Widely used in electronic encapsulation, precision casting, high-end coatings, composite materials, and refractory applications.
Product Features
High Purity: SiO2 content ≥90% with extremely low impurities
Ultra-Fine Particle Size: D50 adjustable between 0.5-50μm, customizable grading available
Excellent Thermal Stability: Withstands temperatures exceeding 1600°C with low thermal expansion
High Insulation: Volume resistivity >10¹4 Ω·cm, ideal for electronic-grade applications
Chemical Inertness: Resistant to acid/alkali corrosion and oxidation
Typical Applications
Electronic Encapsulation: Filler for epoxy/silicone molding compounds to enhance performance
 Precision Casting: Improves surface finish of castings and reduces metal penetration
 High-End Coatings: Boosts wear resistance, weather resistance, and UV protection
 Composite Materials: Reinforcement modifier for ceramics, plastics, and rubber
Refractories: Enhances thermal shock resistance and mechanical strength of refractory products
Basic Parameters
 
| Item | Unit | Typical Values | 
| Exterior | / | white powder | 
| Density | kg/m³ | 2.65 ×103 | 
| Moh's hardness | / | 7 | 
| Coefficient of linear expansion | 1/k | 14×10-6 | 
| Pyroconductivity | w/k.m | 12.6 | 
| Refraction coefficient | / | 1.54 |