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Ultra-High Purity: SiO2 ≥99%, low metal ion content, excellent insulation performance
 Adjustable Particle Size: D50 0.5μm-25μm (customizable for precision applications)
 Stable Crystalline Structure: High temperature resistance, low thermal expansion, suitable for harsh environments
 Professional Insulation Grade: Volume resistivity >1016Ω·cm, breakdown voltage >20 kV/mm
| Parameter | Specification | 
|---|---|
| Purity (SiO2) | ≥99% | 
| Particle Size (D50) | 0.5μm-25μm (customizable) | 
| Whiteness | ≥90% | 
| Moisture Content | ≤0.5% | 
| Loss on Ignition (1000°C) | ≤0.8% | 
| Volume Resistivity | >1016 Ω·cm | 
| Dielectric Constant (1MHz) | 3.8-4.2 | 
▸ Electronic Encapsulation: Filler for IC chips, LED epoxy resin packaging materials
▸ Insulating Materials: Additive for high-voltage electrical devices, insulators, ceramic substrates
▸ Polymer Composites: Enhances insulation & mechanical strength in silicone rubber/engineering plastics
▸ Coatings: Functional filler for weather-resistant anti-corrosion coatings
Strict QC: Pollution-free production, ISO 9001/14001 certified
 Batch Consistency: Laser particle size analyzer + ICP testing for uniform quality
 Technical Support: Customized solutions for R&D optimization
25kg/bag (multi-layer paper bag), customizable packaging available
 Free samples upon request
6+ years of expertise in silica powder R&D, National High-Tech Enterprise
Trusted by XX Electronics, XX Ceramics (replace with real clients)
 OEM/ODM support with free technical consultation
Ultra-High Purity: SiO2 ≥99%, low metal ion content, excellent insulation performance
 Adjustable Particle Size: D50 0.5μm-25μm (customizable for precision applications)
 Stable Crystalline Structure: High temperature resistance, low thermal expansion, suitable for harsh environments
 Professional Insulation Grade: Volume resistivity >1016Ω·cm, breakdown voltage >20 kV/mm
| Parameter | Specification | 
|---|---|
| Purity (SiO2) | ≥99% | 
| Particle Size (D50) | 0.5μm-25μm (customizable) | 
| Whiteness | ≥90% | 
| Moisture Content | ≤0.5% | 
| Loss on Ignition (1000°C) | ≤0.8% | 
| Volume Resistivity | >1016 Ω·cm | 
| Dielectric Constant (1MHz) | 3.8-4.2 | 
▸ Electronic Encapsulation: Filler for IC chips, LED epoxy resin packaging materials
▸ Insulating Materials: Additive for high-voltage electrical devices, insulators, ceramic substrates
▸ Polymer Composites: Enhances insulation & mechanical strength in silicone rubber/engineering plastics
▸ Coatings: Functional filler for weather-resistant anti-corrosion coatings
Strict QC: Pollution-free production, ISO 9001/14001 certified
 Batch Consistency: Laser particle size analyzer + ICP testing for uniform quality
 Technical Support: Customized solutions for R&D optimization
25kg/bag (multi-layer paper bag), customizable packaging available
 Free samples upon request
6+ years of expertise in silica powder R&D, National High-Tech Enterprise
Trusted by XX Electronics, XX Ceramics (replace with real clients)
 OEM/ODM support with free technical consultation