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High Thermal Conductivity Crystalline Silica Powder
High Thermal Conductivity Crystalline Silica Powder High Thermal Conductivity Crystalline Silica Powder

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High Thermal Conductivity Crystalline Silica Powder

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High Thermal Conductivity Crystalline Silica Powder is a high-purity, ultra-fine functional powder material with excellent thermal conductivity, insulation, and chemical stability. Produced from high-purity silicon raw materials through a specialized refining process, this product boasts a purity of ≥99% and uniform particle size distribution (adjustable D50: 0.5μm-25μm). It is widely used in electronic packaging, thermal conductive adhesives, ceramic composites, high-end coatings, and other fields, significantly enhancing thermal performance and mechanical strength.
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Product Overview


High Thermal Conductivity Crystalline Silica Powder is a high-purity, ultra-fine functional powder material with excellent thermal conductivity, insulation, and chemical stability. Produced from high-purity silicon raw materials through a specialized refining process, this product boasts a purity of ≥99% and uniform particle size distribution (adjustable D50: 0.5μm-25μm). It is widely used in electronic packaging, thermal conductive adhesives, ceramic composites, high-end coatings, and other fields, significantly enhancing thermal performance and mechanical strength.


Product Features


High Purity: SiO2 content ≥99%, with extremely low impurities, ensuring stable and reliable performance.
Superior Thermal Conductivity: Dense crystalline structure with high thermal conductivity, effectively improving heat management in composite materials.
Precise & Adjustable Particle Size: Customizable D50 range (0.5μm-25μm) to meet various filling and dispersion requirements.
Low Thermal Expansion: Excellent thermal stability, high-temperature resistance, and strong thermal shock resistance.
Outstanding Insulation: High volume resistivity, ideal for electronic insulation applications.
Chemical Inertness: Resistant to acid/alkali corrosion, with good compatibility with resins, plastics, and other substrates.


Technical Specifications


Parameter Value
Purity (SiO2) ≥99%
Particle Size (D50) 0.5μm-25μm (customizable)
Thermal Conductivity 10-30 W/(m·K)
Whiteness ≥90%
Moisture Content ≤0.5%
Loss on Ignition ≤0.8%


Applications


Electronic Packaging: Used in chip encapsulation and LED thermal interface materials to reduce operating temperatures.
Thermal Conductive Adhesives: Filler for silicone or epoxy resins to enhance heat dissipation.
Ceramic Composites: Reinforcing phase to improve thermal conductivity and mechanical strength.
High-Performance Coatings: Enhances thermal radiation in heat-resistant or anti-corrosion coatings.
Plastics & Rubber: Improves heat dissipation in engineering plastics, extending product lifespan.


Packaging & Storage


  • Packaging: 25kg/bag (kraft paper composite bag) or customized upon request.

  • Storage: Store in a sealed, cool, and dry environment to avoid moisture absorption.


Our Advantages


Strict QC: Batch testing ensures consistent particle size and purity.
Technical Support: Customized solutions and sample testing services.
Fast Response: Supports small trial orders and bulk deliveries with prompt lead times.


Contact Now: Visit our Made-in-China.com store for free samples or technical documents-we offer professional solutions tailored to your needs!

+8618936720888
+86-189-3672-0888

CONTACT US

Tel: +86-189-3672-0888
Emai: sales@silic-st.com
WhatsApp: +8618936720888
Add: No. 8-2, Zhenxing South Road, High-tech Development Zone, Donghai County, Jiangsu Province

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