| Availability: | |
|---|---|
| Quantity: | |
High Thermal Conductivity Crystalline Silica Powder is a high-purity, ultra-fine functional powder material with excellent thermal conductivity, insulation, and chemical stability. Produced from high-purity silicon raw materials through a specialized refining process, this product boasts a purity of ≥99% and uniform particle size distribution (adjustable D50: 0.5μm-25μm). It is widely used in electronic packaging, thermal conductive adhesives, ceramic composites, high-end coatings, and other fields, significantly enhancing thermal performance and mechanical strength.
High Purity: SiO2 content ≥99%, with extremely low impurities, ensuring stable and reliable performance.
 Superior Thermal Conductivity: Dense crystalline structure with high thermal conductivity, effectively improving heat management in composite materials.
 Precise & Adjustable Particle Size: Customizable D50 range (0.5μm-25μm) to meet various filling and dispersion requirements.
 Low Thermal Expansion: Excellent thermal stability, high-temperature resistance, and strong thermal shock resistance.
 Outstanding Insulation: High volume resistivity, ideal for electronic insulation applications.
 Chemical Inertness: Resistant to acid/alkali corrosion, with good compatibility with resins, plastics, and other substrates.
| Parameter | Value | 
|---|---|
| Purity (SiO2) | ≥99% | 
| Particle Size (D50) | 0.5μm-25μm (customizable) | 
| Thermal Conductivity | 10-30 W/(m·K) | 
| Whiteness | ≥90% | 
| Moisture Content | ≤0.5% | 
| Loss on Ignition | ≤0.8% | 
Electronic Packaging: Used in chip encapsulation and LED thermal interface materials to reduce operating temperatures.
 Thermal Conductive Adhesives: Filler for silicone or epoxy resins to enhance heat dissipation.
 Ceramic Composites: Reinforcing phase to improve thermal conductivity and mechanical strength.
 High-Performance Coatings: Enhances thermal radiation in heat-resistant or anti-corrosion coatings.
 Plastics & Rubber: Improves heat dissipation in engineering plastics, extending product lifespan.
Packaging: 25kg/bag (kraft paper composite bag) or customized upon request.
Storage: Store in a sealed, cool, and dry environment to avoid moisture absorption.
Strict QC: Batch testing ensures consistent particle size and purity.
 Technical Support: Customized solutions and sample testing services.
 Fast Response: Supports small trial orders and bulk deliveries with prompt lead times.
Contact Now: Visit our Made-in-China.com store for free samples or technical documents-we offer professional solutions tailored to your needs!
High Thermal Conductivity Crystalline Silica Powder is a high-purity, ultra-fine functional powder material with excellent thermal conductivity, insulation, and chemical stability. Produced from high-purity silicon raw materials through a specialized refining process, this product boasts a purity of ≥99% and uniform particle size distribution (adjustable D50: 0.5μm-25μm). It is widely used in electronic packaging, thermal conductive adhesives, ceramic composites, high-end coatings, and other fields, significantly enhancing thermal performance and mechanical strength.
High Purity: SiO2 content ≥99%, with extremely low impurities, ensuring stable and reliable performance.
 Superior Thermal Conductivity: Dense crystalline structure with high thermal conductivity, effectively improving heat management in composite materials.
 Precise & Adjustable Particle Size: Customizable D50 range (0.5μm-25μm) to meet various filling and dispersion requirements.
 Low Thermal Expansion: Excellent thermal stability, high-temperature resistance, and strong thermal shock resistance.
 Outstanding Insulation: High volume resistivity, ideal for electronic insulation applications.
 Chemical Inertness: Resistant to acid/alkali corrosion, with good compatibility with resins, plastics, and other substrates.
| Parameter | Value | 
|---|---|
| Purity (SiO2) | ≥99% | 
| Particle Size (D50) | 0.5μm-25μm (customizable) | 
| Thermal Conductivity | 10-30 W/(m·K) | 
| Whiteness | ≥90% | 
| Moisture Content | ≤0.5% | 
| Loss on Ignition | ≤0.8% | 
Electronic Packaging: Used in chip encapsulation and LED thermal interface materials to reduce operating temperatures.
 Thermal Conductive Adhesives: Filler for silicone or epoxy resins to enhance heat dissipation.
 Ceramic Composites: Reinforcing phase to improve thermal conductivity and mechanical strength.
 High-Performance Coatings: Enhances thermal radiation in heat-resistant or anti-corrosion coatings.
 Plastics & Rubber: Improves heat dissipation in engineering plastics, extending product lifespan.
Packaging: 25kg/bag (kraft paper composite bag) or customized upon request.
Storage: Store in a sealed, cool, and dry environment to avoid moisture absorption.
Strict QC: Batch testing ensures consistent particle size and purity.
 Technical Support: Customized solutions and sample testing services.
 Fast Response: Supports small trial orders and bulk deliveries with prompt lead times.
Contact Now: Visit our Made-in-China.com store for free samples or technical documents-we offer professional solutions tailored to your needs!