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High-temperature resistant crystalline silica micro powder is a high-purity, heat-resistant inorganic non-metallic powder material, refined from high-quality crystalline silicon through a specialized process. With characteristics such as high purity, uniform particle size distribution, and excellent thermal stability, it is widely used in electronic encapsulation, high-temperature coatings, ceramics, composite materials, and other fields, providing customers with high-performance powder solutions.
Purity: ≥99%
Particle Size (D50): 0.5μm-25μm (customizable particle size range available)
Appearance: White fine powder, excellent flowability
Density: 2.2-2.6 g/cm³
Melting Point: >1600°C
Thermal Expansion Coefficient: Low, outstanding thermal stability
Electrical Insulation: Excellent
High Purity: Purity ≥99%, extremely low impurity content, ensuring stable performance in high-end applications.
High-Temperature Resistance: Can withstand temperatures above 1600°C for extended periods, suitable for high-temperature sintering environments.
Controlled Particle Size: D50 range of 0.5μm-25μm, with uniform particle size distribution to meet various process requirements.
Chemical Inertness: Resistant to acid and alkali corrosion, compatible with most materials.
Performance Enhancement: As a filler, it improves the thermal conductivity, mechanical strength, and insulation properties of composite materials.
Electronic Encapsulation: Used in epoxy resin and silicone encapsulation materials to enhance thermal conductivity and heat resistance.
High-Temperature Coatings: Serves as a heat-resistant filler to improve the thermal shock resistance and wear resistance of coatings.
Ceramic Materials: Acts as a sintering aid for precision ceramics and structural ceramics, reducing sintering temperature.
Composite Materials: Enhances the mechanical properties and thermal stability of polymers such as plastics and rubber.
Other Fields: Refractory materials, aerospace, precision casting, etc.
Packaging: 25kg/bag (paper-plastic composite bag), or customized according to customer requirements.
Storage: Store in a cool, dry place, avoid moisture and high temperatures. It is recommended to use promptly after opening.
Strictly compliant with the ISO 9001 Quality Management System. Each batch undergoes testing via laser particle size analyzers, X-ray fluorescence spectrometers (XRF), etc., to ensure purity, particle size, and performance meet standards.
Customization Services: Adjustable particle size, surface treatment, and other parameters based on customer needs.
Stable Supply: Large-scale production ensures long-term, reliable delivery.
Technical Support: Professional application guidance and solutions provided.
Welcome Inquiries & Orders!
Click for a quote or contact our customer service for more product details and technical specifications!
High-temperature resistant crystalline silica micro powder is a high-purity, heat-resistant inorganic non-metallic powder material, refined from high-quality crystalline silicon through a specialized process. With characteristics such as high purity, uniform particle size distribution, and excellent thermal stability, it is widely used in electronic encapsulation, high-temperature coatings, ceramics, composite materials, and other fields, providing customers with high-performance powder solutions.
Purity: ≥99%
Particle Size (D50): 0.5μm-25μm (customizable particle size range available)
Appearance: White fine powder, excellent flowability
Density: 2.2-2.6 g/cm³
Melting Point: >1600°C
Thermal Expansion Coefficient: Low, outstanding thermal stability
Electrical Insulation: Excellent
High Purity: Purity ≥99%, extremely low impurity content, ensuring stable performance in high-end applications.
High-Temperature Resistance: Can withstand temperatures above 1600°C for extended periods, suitable for high-temperature sintering environments.
Controlled Particle Size: D50 range of 0.5μm-25μm, with uniform particle size distribution to meet various process requirements.
Chemical Inertness: Resistant to acid and alkali corrosion, compatible with most materials.
Performance Enhancement: As a filler, it improves the thermal conductivity, mechanical strength, and insulation properties of composite materials.
Electronic Encapsulation: Used in epoxy resin and silicone encapsulation materials to enhance thermal conductivity and heat resistance.
High-Temperature Coatings: Serves as a heat-resistant filler to improve the thermal shock resistance and wear resistance of coatings.
Ceramic Materials: Acts as a sintering aid for precision ceramics and structural ceramics, reducing sintering temperature.
Composite Materials: Enhances the mechanical properties and thermal stability of polymers such as plastics and rubber.
Other Fields: Refractory materials, aerospace, precision casting, etc.
Packaging: 25kg/bag (paper-plastic composite bag), or customized according to customer requirements.
Storage: Store in a cool, dry place, avoid moisture and high temperatures. It is recommended to use promptly after opening.
Strictly compliant with the ISO 9001 Quality Management System. Each batch undergoes testing via laser particle size analyzers, X-ray fluorescence spectrometers (XRF), etc., to ensure purity, particle size, and performance meet standards.
Customization Services: Adjustable particle size, surface treatment, and other parameters based on customer needs.
Stable Supply: Large-scale production ensures long-term, reliable delivery.
Technical Support: Professional application guidance and solutions provided.
Welcome Inquiries & Orders!
Click for a quote or contact our customer service for more product details and technical specifications!