High purity ultrafine quartz powder is a kind of powder material made of high quality natural quartz by special process, which has extremely high purity and controllable particle size distribution. This material is widely used in many high-tech fields because of its excellent chemical stability, acid and alkali resistance, large specific surface area, developed void structure, high temperature resistance and good insulation.
High purity, silica (SiO2) content can reach more than 99.99%.
Particle size control, typical particle size D50 in the range of 3-10 microns.
Whiteness greater than 94, with a very good color.
The thermal conductivity is better than other silicon powder.
Chemical stability, acid and alkali resistance.
The total content of impurities is controlled within 50ppm, which belongs to the domestic leading level and the international advanced
.
Application field:
Electronic packaging materials: Used in semiconductor integrated circuit packaging, providing support, protection, heat dissipation, insulation and interconnection functions.
Electronic ink: Used in electronic printing industry.
Optical fiber: Used to manufacture optical fiber.
Precision ceramics: Used to manufacture high-performance ceramics.
Optics: For precision grinding.
Silicone rubber: as a filler, improve wear resistance and weather resistance.
Optical glass: For the manufacture of high-grade optical glass.
Industrial ceramics: Used to manufacture high-performance ceramic products.
Preparation method:
Physical purification: including washing, scrubbing, magnetic separation and flotation.
Chemical purification: The use of acids (such as hydrochloric acid, sulfuric acid, nitric acid, hydrofluoric acid and oxalic acid) for acid leaching to remove impurities.
Ultrafine grinding: The use of stirring mill, vibration mill, air grinding and other equipment for ultrafine grinding.
Spherification process: including high frequency plasma melting method, DC plasma melting method, arc method, etc., to produce spherical quartz powder.
Processing technology:
Quartz powder through magnetic separation, flotation.
Ultrafine grinding to micron level.
Pickling removes impurities.
Acid removal cleaning.
Press filtration dehydration.
Dry.
After breaking up to get the finished product.
The preparation technology of high-purity ultra-fine quartz powder continues to improve, especially in the application of electronic packaging materials, and the requirements for fillers are becoming higher and higher, not only requiring ultra-fine and high-purity, but also requiring sphericity to improve the performance of packaging materials. With the development of the electronics industry, the demand for spherical quartz powder market is also growing
.
Project
Related indicators
Explain
Purity
SiO2 content
Optional Within 98% -99.9%
Ion Impurity
Na+, C1, etc
Can Be As Low As 3ppm Or Below
Particle Size Distribution
D50
Optional within 0.5um-20um
D100
Can be as low as 10um or less
Particle size distribution
Adjustments can be made based on typical distributions according to customer requirements, including multi-modal distributions
Appearance Characteristics
Whiteness, transparency, etc
Whiteness can be selected between 60-98 degrees, providing high transparency product distribution
Surface Characteristics
Hydrophobicity, oil absorption value, etc
Different treatment agents can be selected according to the requirements of customers, and flexible customization is available
Project
Unit
Typical Values
Appearance
/
White Powder
Density
kg/m³
2.65x103
Mohs Hardness
/
2
Dielectric Constant
er
4.65
Dielectric Loss
lgδ
0.0018
Linear Expansion Coefficient
1/K
14x10-6
Thermal Conductivity
W/K ·m
12.6
Refractive Index
/
1.54
Features:
High purity, silica (SiO2) content can reach more than 99.99%.
Particle size control, typical particle size D50 in the range of 3-10 microns.
Whiteness greater than 94, with a very good color.
The thermal conductivity is better than other silicon powder.
Chemical stability, acid and alkali resistance.
The total content of impurities is controlled within 50ppm, which belongs to the domestic leading level and the international advanced
.
Application field:
Electronic packaging materials: Used in semiconductor integrated circuit packaging, providing support, protection, heat dissipation, insulation and interconnection functions.
Electronic ink: Used in electronic printing industry.
Optical fiber: Used to manufacture optical fiber.
Precision ceramics: Used to manufacture high-performance ceramics.
Optics: For precision grinding.
Silicone rubber: as a filler, improve wear resistance and weather resistance.
Optical glass: For the manufacture of high-grade optical glass.
Industrial ceramics: Used to manufacture high-performance ceramic products.
Preparation method:
Physical purification: including washing, scrubbing, magnetic separation and flotation.
Chemical purification: The use of acids (such as hydrochloric acid, sulfuric acid, nitric acid, hydrofluoric acid and oxalic acid) for acid leaching to remove impurities.
Ultrafine grinding: The use of stirring mill, vibration mill, air grinding and other equipment for ultrafine grinding.
Spherification process: including high frequency plasma melting method, DC plasma melting method, arc method, etc., to produce spherical quartz powder.
Processing technology:
Quartz powder through magnetic separation, flotation.
Ultrafine grinding to micron level.
Pickling removes impurities.
Acid removal cleaning.
Press filtration dehydration.
Dry.
After breaking up to get the finished product.
The preparation technology of high-purity ultra-fine quartz powder continues to improve, especially in the application of electronic packaging materials, and the requirements for fillers are becoming higher and higher, not only requiring ultra-fine and high-purity, but also requiring sphericity to improve the performance of packaging materials. With the development of the electronics industry, the demand for spherical quartz powder market is also growing
.
Project
Related indicators
Explain
Purity
SiO2 content
Optional Within 98% -99.9%
Ion Impurity
Na+, C1, etc
Can Be As Low As 3ppm Or Below
Particle Size Distribution
D50
Optional within 0.5um-20um
D100
Can be as low as 10um or less
Particle size distribution
Adjustments can be made based on typical distributions according to customer requirements, including multi-modal distributions
Appearance Characteristics
Whiteness, transparency, etc
Whiteness can be selected between 60-98 degrees, providing high transparency product distribution
Surface Characteristics
Hydrophobicity, oil absorption value, etc
Different treatment agents can be selected according to the requirements of customers, and flexible customization is available
