This product is a soft composite silica micro-powder specially designed for high-end electronic packaging, featuring ultra-fine particle size, low coefficient of thermal expansion (CTE), high thermal conductivity, and excellent dielectric properties. With a special surface modification process, it significantly enhances compatibility with encapsulation materials such as epoxy resins and silicone, making it suitable for demanding application scenarios like advanced semiconductor packaging, high-density PCB substrates, and 5G communication modules.
This product is a soft composite silica micro-powder specially designed for high-end electronic packaging, featuring ultra-fine particle size, low coefficient of thermal expansion (CTE), high thermal conductivity, and excellent dielectric properties. With a special surface modification process, it significantly enhances compatibility with encapsulation materials such as epoxy resins and silicone, making it suitable for demanding application scenarios like advanced semiconductor packaging, high-density PCB substrates, and 5G communication modules.
Core Application Areas
High-End Semiconductor Packaging: Filler for advanced packaging materials such as Flip-Chip, BGA, and CSP High-Density Substrates: Reinforcing filler for high-frequency PCB substrates like ABF and BT resins 5G/6G Communication Modules: Millimeter-wave antenna packaging and thermal management materials for RF devices Power Electronics: Insulating and thermally conductive media for IGBT and SiC modules Flexible Electronics: Soft packaging for wearable devices and flexible displays
Core Product Advantages
Ultra-Low CTE: Matches chip thermal expansion to reduce the risk of packaging stress cracking.
High Thermal Conductivity + Low Dielectric Loss: Optimizes high-frequency signal transmission and enhances heat dissipation efficiency.
Soft Composite Structure: Special surface treatment ensures no brittleness in flexible substrates.
High Purity & Low Impurities: Na+ and K+ contents < 5ppm, meeting semiconductor-grade requirements.
Customized Services: Supports customization of particle size, surface modification, and compounding processes.
Technical Certifications & Standards Compliant
Why Choose Us?
Electronic-Grade Expertise: Years of focus on semiconductor packaging materials, serving multiple leading enterprises in the industry. Stringent Quality Control: Dust-free production throughout the process, with batch consistency > 99%. Technical Support: Provides optimization solutions for packaging material formulations.
Project
Unit
Typical values
Appearance
/
White powder
Density
kg/m3
2.59×103
Mohs hardness
/
five
Dielectric constant
/
5.0（1MHz）
Dielectric loss
/
0.003（1MHz）
Linear expansion coefficient
1/K
3.8×10-6
Soft composite silicon micro powder can be classified into specifications and matched according to customer requirements based on the following characteristics:
Project
Related indicators
Explain
Chemical Composition
SiO2 content, etc
Having a stable chemical composition to ensure consistent performance
Ion Impurity
Na+, Cl -, etc
Can be as low as 5ppm or below
Particle Size Distribution
D50
D50=0.5-10 µ m optional
Particle size distribution
Adjustments can be made based on typical distributions as required, including multimodal distributions, narrow distributions, etc
Surface Characteristics
Hydrophobicity, oil absorption value, etc
Different functional treatment agents can be selected according to customer requirements
Product Description
This product is a soft composite silica micro-powder specially designed for high-end electronic packaging, featuring ultra-fine particle size, low coefficient of thermal expansion (CTE), high thermal conductivity, and excellent dielectric properties. With a special surface modification process, it significantly enhances compatibility with encapsulation materials such as epoxy resins and silicone, making it suitable for demanding application scenarios like advanced semiconductor packaging, high-density PCB substrates, and 5G communication modules.
Core Application Areas
High-End Semiconductor Packaging: Filler for advanced packaging materials such as Flip-Chip, BGA, and CSP High-Density Substrates: Reinforcing filler for high-frequency PCB substrates like ABF and BT resins 5G/6G Communication Modules: Millimeter-wave antenna packaging and thermal management materials for RF devices Power Electronics: Insulating and thermally conductive media for IGBT and SiC modules Flexible Electronics: Soft packaging for wearable devices and flexible displays
Core Product Advantages
Ultra-Low CTE: Matches chip thermal expansion to reduce the risk of packaging stress cracking.
High Thermal Conductivity + Low Dielectric Loss: Optimizes high-frequency signal transmission and enhances heat dissipation efficiency.
Soft Composite Structure: Special surface treatment ensures no brittleness in flexible substrates.
High Purity & Low Impurities: Na+ and K+ contents < 5ppm, meeting semiconductor-grade requirements.
Customized Services: Supports customization of particle size, surface modification, and compounding processes.
Technical Certifications & Standards Compliant
Why Choose Us?
Electronic-Grade Expertise: Years of focus on semiconductor packaging materials, serving multiple leading enterprises in the industry. Stringent Quality Control: Dust-free production throughout the process, with batch consistency > 99%. Technical Support: Provides optimization solutions for packaging material formulations.
Project
Unit
Typical values
Appearance
/
White powder
Density
kg/m3
2.59×103
Mohs hardness
/
five
Dielectric constant
/
5.0（1MHz）
Dielectric loss
/
0.003（1MHz）
Linear expansion coefficient
1/K
3.8×10-6
Soft composite silicon micro powder can be classified into specifications and matched according to customer requirements based on the following characteristics:
Project
Related indicators
Explain
Chemical Composition
SiO2 content, etc
Having a stable chemical composition to ensure consistent performance
Ion Impurity
Na+, Cl -, etc
Can be as low as 5ppm or below
Particle Size Distribution
D50
D50=0.5-10 µ m optional
Particle size distribution
Adjustments can be made based on typical distributions as required, including multimodal distributions, narrow distributions, etc
Surface Characteristics
Hydrophobicity, oil absorption value, etc
Different functional treatment agents can be selected according to customer requirements
