Availability: | |
---|---|
Quantity: | |
This adjustable particle size soft composite silica powder is manufactured using specialized processes, featuring tunable particle size (D50 0.5-10μm), low hardness, and excellent dispersibility. Ideal for advanced electronic packaging, thermal interface materials, and flexible composites, it significantly enhances mechanical flexibility and thermal management performance.
Key Advantages:
Precise particle size control (customizable 0.5-10μm)
Low hardness & minimal abrasion (Mohs hardness ≤5, equipment-friendly)
High loading capacity & low viscosity (improves processing efficiency)
Superior dielectric properties (for high-frequency electronic materials)
Electronic Packaging: Chip encapsulation, EMC (epoxy molding compounds) - improves flowability and filler loading
Thermal Materials: Filler for thermal greases/gels - enhances heat dissipation
Flexible Composites: Flexible PCBs (FPC), wearable devices
Coatings & Adhesives: Improves coating flexibility, reduces settling
Precision Ceramics: Low-temperature sintering ceramics - minimizes cracking
Customizable: Adjustable particle size, surface modification (silane coupling agent treatment)
Low-wear: Soft particles reduce equipment abrasion
High compatibility: Works with epoxy, silicone, polyurethane systems
Eco-friendly: Complies with RoHS & REACH standards
Verified Made-in-China supplier with reliable quality
Technical customization & application solutions available
Stable supply chain: Supports sample trials & bulk orders
Standard: 25kg/bag (customizable)
Samples available (application details required)
Project | Unit | Typical values |
Appearance | / | White powder |
Density | kg/m3 | 2.59×103 |
Mohs hardness | / | five |
Dielectric constant | / | 5.0(1MHz) |
Dielectric loss | / | 0.003(1MHz) |
Linear expansion coefficient | 1/K | 3.8×10-6 |
Soft composite silicon micro powder can be classified into specifications and matched according to customer requirements based on the following characteristics:
Project | Related indicators | Explain |
Chemical Composition | SiO2 content, etc | Having a stable chemical composition to ensure consistent performance |
Ion Impurity | Na+, Cl -, etc | Can be as low as 5ppm or below |
Particle Size Distribution | D50 | D50=0.5-10 µ m optional |
Particle size distribution | Adjustments can be made based on typical distributions as required, including multimodal distributions, narrow distributions, etc | |
Surface Characteristics | Hydrophobicity, oil absorption value, etc | Different functional treatment agents can be selected according to customer requirements |
This adjustable particle size soft composite silica powder is manufactured using specialized processes, featuring tunable particle size (D50 0.5-10μm), low hardness, and excellent dispersibility. Ideal for advanced electronic packaging, thermal interface materials, and flexible composites, it significantly enhances mechanical flexibility and thermal management performance.
Key Advantages:
Precise particle size control (customizable 0.5-10μm)
Low hardness & minimal abrasion (Mohs hardness ≤5, equipment-friendly)
High loading capacity & low viscosity (improves processing efficiency)
Superior dielectric properties (for high-frequency electronic materials)
Electronic Packaging: Chip encapsulation, EMC (epoxy molding compounds) - improves flowability and filler loading
Thermal Materials: Filler for thermal greases/gels - enhances heat dissipation
Flexible Composites: Flexible PCBs (FPC), wearable devices
Coatings & Adhesives: Improves coating flexibility, reduces settling
Precision Ceramics: Low-temperature sintering ceramics - minimizes cracking
Customizable: Adjustable particle size, surface modification (silane coupling agent treatment)
Low-wear: Soft particles reduce equipment abrasion
High compatibility: Works with epoxy, silicone, polyurethane systems
Eco-friendly: Complies with RoHS & REACH standards
Verified Made-in-China supplier with reliable quality
Technical customization & application solutions available
Stable supply chain: Supports sample trials & bulk orders
Standard: 25kg/bag (customizable)
Samples available (application details required)
Project | Unit | Typical values |
Appearance | / | White powder |
Density | kg/m3 | 2.59×103 |
Mohs hardness | / | five |
Dielectric constant | / | 5.0(1MHz) |
Dielectric loss | / | 0.003(1MHz) |
Linear expansion coefficient | 1/K | 3.8×10-6 |
Soft composite silicon micro powder can be classified into specifications and matched according to customer requirements based on the following characteristics:
Project | Related indicators | Explain |
Chemical Composition | SiO2 content, etc | Having a stable chemical composition to ensure consistent performance |
Ion Impurity | Na+, Cl -, etc | Can be as low as 5ppm or below |
Particle Size Distribution | D50 | D50=0.5-10 µ m optional |
Particle size distribution | Adjustments can be made based on typical distributions as required, including multimodal distributions, narrow distributions, etc | |
Surface Characteristics | Hydrophobicity, oil absorption value, etc | Different functional treatment agents can be selected according to customer requirements |