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Ultra-Fine Soft Composite Silica Micro-Powder

This product is a high-purity ultra-fine soft composite silica micro-powder prepared by special processes, featuring small particle size (D50 0.5-10μm), low hardness, good fluidity, and excellent dispersibility. It is suitable for high-end electronic packaging, thermal interface materials, precision ceramics, coatings, and polymer composites, significantly enhancing the processing performance of materials and end-product properties.

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Product Description

Product Description

This product is a high-purity ultra-fine soft composite silica micro-powder prepared by special processes, featuring small particle size (D50 0.5-5μm), low hardness, good fluidity, and excellent dispersibility. It is suitable for high-end electronic packaging, thermal interface materials, precision ceramics, coatings, and polymer composites, significantly enhancing the processing performance of materials and end-product properties.

Project	Unit	Typical values
Appearance	/	White powder
Density	kg/m3	2.59×103
Mohs hardness	/	five
Dielectric constant	/	5.0（1MHz）
Dielectric loss	/	0.003（1MHz）
Linear expansion coefficient	1/K	3.8×10-6

Soft composite silicon micro powder can be classified into specifications and matched according to customer requirements based on the following characteristics:

Project	Related indicators	Explain
Chemical Composition	SiO2 content, etc	Having a stable chemical composition to ensure consistent performance
Ion Impurity	Na+, Cl -, etc	Can be as low as 5ppm or below
Particle Size Distribution	D50	D50=0.5-10 µ m optional
Particle Size Distribution	Particle size distribution	Adjustments can be made based on typical distributions as required, including multimodal distributions, narrow distributions, etc
Surface Characteristics	Hydrophobicity, oil absorption value, etc	Different functional treatment agents can be selected according to customer requirements

Product Advantages

Ultra-Fine Particle Size: D50 0.5-10μm, suitable for high-precision applications.
Low-Hardness Soft Structure: Reduces equipment wear and extends service life.
Excellent Dispersibility: Easily mixed with substrates like resins and rubbers without agglomeration.
High Chemical Stability: Acid/alkali resistant, suitable for harsh environments.
Customizable: Particle size and surface modification (e.g., silane coupling agent treatment) available.

Application Areas

Electronic Packaging: Used in epoxy resin and silicone packaging materials to improve thermal conductivity and fluidity.
Thermal Interface Materials (TIM): As filler for thermal greases and thermal pads.
Precision Ceramics: Lowers sintering temperature and enhances compactness.
Coatings & Inks: Improves coating smoothness, wear resistance, and weather resistance.
Polymer Composites: Enhances mechanical properties and processing fluidity of plastics and rubbers.

Packaging & Storage

Packaging: 25kg/bag (anti-static aluminum foil bags can be customized as required).
Storage: Store in a cool, dry place, avoiding moisture and high temperatures.

Why Choose Our Product?

High purity & low impurities, meeting electronic-grade application requirements.
Ultra-fine & soft structure, reducing equipment wear and improving processing efficiency.
Customizable services to meet needs of different industries.
Strict QC control to ensure batch stability.