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Electronic Grade Flexible Composite Silica Powder

This product is an electronic-grade soft composite silica micro-powder specially designed for precision applications such as high-end electronic packaging, semiconductor packaging, and thermal interface materials (TIM). Composed of high-purity silica micro-powder and special flexible materials through composite processing, it features low stress, high fluidity, and excellent thermal conductivity, significantly enhancing the heat dissipation performance and long-term reliability of electronic devices. It is suitable for cutting-edge fields such as 5G communication, AI chips, and advanced packaging (e.g., Fan-out, 3D IC).

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Product Description

Product Description

This product is an electronic-grade soft composite silica micro-powder specially designed for precision applications such as high-end electronic packaging, semiconductor packaging, and thermal interface materials (TIM). Composed of high-purity silica micro-powder and special flexible materials through composite processing, it features low stress, high fluidity, and excellent thermal conductivity, significantly enhancing the heat dissipation performance and long-term reliability of electronic devices. It is suitable for cutting-edge fields such as 5G communication, AI chips, and advanced packaging (e.g., Fan-out, 3D IC).

Core Advantages

Low Stress & High Flexibility: Special composite technology reduces brittleness and minimizes the risk of stress cracking in chip packaging.
High Thermal Conductivity & Low Dielectric Loss: Optimizes heat dissipation for electronic devices while maintaining stable signal transmission.
Ultra-Fine & High Fluidity: Suitable for microelectronics processing technologies like precision dispensing and printing.
Low Ion Contamination: Complies with electronic-grade material standards.
Customizable: Supports parameter adjustment for particle size, thermal conductivity, surface modification, etc.

Typical Applications

Advanced Semiconductor Packaging: Filler for Fan-out WLP, 3D IC, and Chiplet packaging.
Thermal Interface Materials (TIM): Reinforcing filler for CPU/GPU thermal pastes and thermal pads.
High-Frequency Substrate Materials: High-frequency copper-clad laminates (CCL) for 5G antennas and millimeter-wave radars.
Flexible Electronics: Packaging materials for wearable devices and flexible displays.
Electronic Adhesives: Low-stress conductive adhesives and underfill materials.

Why Choose Our Product?

Strict Quality Control: Full-process rigorous production compliant with ISO 9001.
Technical Customization: Custom compounding based on customer requirements.
Rapid Response: Supports small-batch trial production to large-scale supply.
Global Supply: Stable delivery capabilities.

Packaging & Specifications

Standard Packaging: 25kg/bag (anti-static aluminum foil bags can be customized as required).
Storage Conditions: Store in a cool, dry place, avoiding moisture and static electricity.
Minimum Order Quantity: Supports 1kg sample trials.

Project	Unit	Typical values
Appearance	/	White powder
Density	kg/m3	2.59×103
Mohs hardness	/	five
Dielectric constant	/	5.0（1MHz）
Dielectric loss	/	0.003（1MHz）
Linear expansion coefficient	1/K	3.8×10-6

Soft composite silicon micro powder can be classified into specifications and matched according to customer requirements based on the following characteristics:

Project	Related indicators	Explain
Chemical Composition	SiO2 content, etc	Having a stable chemical composition to ensure consistent performance
Ion Impurity	Na+, Cl -, etc	Can be as low as 5ppm or below
Particle Size Distribution	D50	D50=0.5-10 µ m optional
Particle Size Distribution	Particle size distribution	Adjustments can be made based on typical distributions as required, including multimodal distributions, narrow distributions, etc
Surface Characteristics	Hydrophobicity, oil absorption value, etc	Different functional treatment agents can be selected according to customer requirements