This product is a soft composite silica micro-powder specially developed for the adhesive industry, featuring low hardness, high dispersibility, and excellent fluidity. It significantly enhances the flexibility, bonding strength, and anti-aging performance of adhesives. With a special surface treatment process, it ensures good compatibility with various resins (epoxy, polyurethane, acrylic, etc.), suitable for high-demand bonding applications.
This product is a soft composite silica micro-powder specially developed for the adhesive industry, featuring low hardness, high dispersibility, and excellent fluidity. It significantly enhances the flexibility, bonding strength, and anti-aging performance of adhesives. With a special surface treatment process, it ensures good compatibility with various resins (epoxy, polyurethane, acrylic, etc.), suitable for high-demand bonding applications.
Project
Unit
Typical values
Appearance
/
White powder
Density
kg/m3
2.59×103
Mohs hardness
/
five
Dielectric constant
/
5.0(1MHz)
Dielectric loss
/
0.003(1MHz)
Linear expansion coefficient
1/K
3.8×10-6
Soft composite silicon micro powder can be classified into specifications and matched according to customer requirements based on the following characteristics:
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Related indicators
Explain
Chemical Composition
SiO2 content, etc
Having a stable chemical composition to ensure consistent performance
Ion Impurity
Na+, Cl -, etc
Can be as low as 5ppm or below
Particle Size Distribution
D50
D50=0.5-10 µ m optional
Particle size distribution
Adjustments can be made based on typical distributions as required, including multimodal distributions, narrow distributions, etc
Surface Characteristics
Hydrophobicity, oil absorption value, etc
Different functional treatment agents can be selected according to customer requirements
Core Advantages
Soft Structure: Low hardness (Mohs hardness 5) reduces wear on mixing and coating equipment. Enhanced Flexibility: Optimizes internal stress of adhesives to improve crack resistance. High Dispersibility: Surface modification prevents agglomeration and ensures uniform distribution. Bonding Enhancement: Increases mechanical strength of adhesive layers, improving initial adhesion and durability. Temperature & Weather Resistance: Stable at -40°C~200°C, anti-yellowing, and extends adhesive service life.
Typical Applications
Electronic Adhesives: For PCB packaging, chip bonding, and flexible circuit board (FPC) reinforcement. Industrial Adhesives: Structural adhesives, sealants, and composite material bonding. Automotive Adhesives: Windshield bonding and interior material lamination. Construction Adhesives: Silicone sealants, MS sealants, and epoxy caulking agents. Medical Adhesives: Low-irritation wound dressings and medical pressure-sensitive adhesives.
Why Choose Our Product?
Customized Services: Adjust particle size and surface treatment agents (silane, titanate, etc.) according to customer needs. Strict Quality Control: Compliant with ISO 9001 quality management system, ensuring high batch stability. Environmental Safety: Free of heavy metals, meeting RoHS/REACH regulations. Technical Support: Provides formulation optimization advice to solve issues like adhesive sedimentation and fluidity.
Packaging & Storage
Packaging: 25kg/bag or as required. Storage: Store in a cool, dry place to avoid moisture; shelf life is 12 months.
Inquiry Tips
For sample testing or technical data sheets (TDS), please contact us and provide:
Your specific application scenarios (e.g., epoxy adhesive, UV adhesive, etc.).
Special requirements for particle size and surface treatment.