Flexible Composite Silica Powder for Epoxy Resin Systems
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Specially engineered for epoxy resin formulations, our flexible composite silica powder features low stress, high filling capacity, and excellent dispersibility. It significantly enhances the mechanical properties, thermal stability, and processing fluidity of epoxy resins. Ideal for electronic encapsulation, adhesives, and composite materials, it effectively reduces curing shrinkage while improving product reliability.
Specially engineered for epoxy resin formulations, our flexible composite silica powder features low stress, high filling capacity, and excellent dispersibility. It significantly enhances the mechanical properties, thermal stability, and processing fluidity of epoxy resins. Ideal for electronic encapsulation, adhesives, and composite materials, it effectively reduces curing shrinkage while improving product reliability.
Project
Unit
Typical values
Appearance
/
White powder
Density
kg/m3
2.59×103
Mohs hardness
/
five
Dielectric constant
/
5.0（1MHz）
Dielectric loss
/
0.003（1MHz）
Linear expansion coefficient
1/K
3.8×10-6
Soft composite silicon micro powder can be classified into specifications and matched according to customer requirements based on the following characteristics:
Project
Related indicators
Explain
Chemical Composition
SiO2 content, etc
Having a stable chemical composition to ensure consistent performance
Ion Impurity
Na+, Cl -, etc
Can be as low as 5ppm or below
Particle Size Distribution
D50
D50=0.5-10 µ m optional
Particle size distribution
Adjustments can be made based on typical distributions as required, including multimodal distributions, narrow distributions, etc
Surface Characteristics
Hydrophobicity, oil absorption value, etc
Different functional treatment agents can be selected according to customer requirements
Key Advantages
Low-Stress Design: Optimized surface treatment minimizes internal curing stress, preventing cracking High Loading Capacity: High packing density enables >70% filler content without compromising flowability Enhanced Toughness: Unique flexible structure improves epoxy's impact resistance Processing-Friendly: Pre-dispersed treatment reduces agglomeration for easier mixing Excellent Thermal Resistance: Stable performance at temperatures ≥300°C, suitable for high-temperature curing systems
Typical Applications
Electronic Encapsulation: IC packaging, LED potting, power module encapsulation Adhesives: Thermally conductive structural adhesives, conductive pastes, UV-curable resins Composite Materials: PCB substrates, insulating materials, 3D printing resins Coatings: Wear-resistant floor paints, electronic protective coatings
Why Choose Us?
Customization Service: Adjustable particle size and surface treatments (silane coupling agents, etc.) Strict Quality Control: ISO 9001 certified with excellent batch-to-batch consistency Technical Support: Formula optimization guidance and resin compatibility solutions
Storage: Keep in cool, dry conditions (recommended humidity ≤60%)
Product Description
Specially engineered for epoxy resin formulations, our flexible composite silica powder features low stress, high filling capacity, and excellent dispersibility. It significantly enhances the mechanical properties, thermal stability, and processing fluidity of epoxy resins. Ideal for electronic encapsulation, adhesives, and composite materials, it effectively reduces curing shrinkage while improving product reliability.
Project
Unit
Typical values
Appearance
/
White powder
Density
kg/m3
2.59×103
Mohs hardness
/
five
Dielectric constant
/
5.0（1MHz）
Dielectric loss
/
0.003（1MHz）
Linear expansion coefficient
1/K
3.8×10-6
Soft composite silicon micro powder can be classified into specifications and matched according to customer requirements based on the following characteristics:
Project
Related indicators
Explain
Chemical Composition
SiO2 content, etc
Having a stable chemical composition to ensure consistent performance
Ion Impurity
Na+, Cl -, etc
Can be as low as 5ppm or below
Particle Size Distribution
D50
D50=0.5-10 µ m optional
Particle size distribution
Adjustments can be made based on typical distributions as required, including multimodal distributions, narrow distributions, etc
Surface Characteristics
Hydrophobicity, oil absorption value, etc
Different functional treatment agents can be selected according to customer requirements
Key Advantages
Low-Stress Design: Optimized surface treatment minimizes internal curing stress, preventing cracking High Loading Capacity: High packing density enables >70% filler content without compromising flowability Enhanced Toughness: Unique flexible structure improves epoxy's impact resistance Processing-Friendly: Pre-dispersed treatment reduces agglomeration for easier mixing Excellent Thermal Resistance: Stable performance at temperatures ≥300°C, suitable for high-temperature curing systems
Typical Applications
Electronic Encapsulation: IC packaging, LED potting, power module encapsulation Adhesives: Thermally conductive structural adhesives, conductive pastes, UV-curable resins Composite Materials: PCB substrates, insulating materials, 3D printing resins Coatings: Wear-resistant floor paints, electronic protective coatings
Why Choose Us?
Customization Service: Adjustable particle size and surface treatments (silane coupling agents, etc.) Strict Quality Control: ISO 9001 certified with excellent batch-to-batch consistency Technical Support: Formula optimization guidance and resin compatibility solutions
