Ultrafine Flexible Composite Silica Powder for IC Packaging
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This product is a high-performance ultrafine flexible composite silica powder specially designed for integrated circuit (IC) packaging. It features excellent flowability, low stress, high filling rate, and low coefficient of thermal expansion (CTE), significantly enhancing the reliability and thermal performance of packaging materials. With special surface treatment technology, it ensures high compatibility with epoxy resins and other packaging materials, making it suitable for advanced packaging technologies (e.g., FC-BGA, CSP, SiP).
This product is a high-performance ultrafine flexible composite silica powder specially designed for integrated circuit (IC) packaging. It features excellent flowability, low stress, high filling rate, and low coefficient of thermal expansion (CTE), significantly enhancing the reliability and thermal performance of packaging materials. With special surface treatment technology, it ensures high compatibility with epoxy resins and other packaging materials, making it suitable for advanced packaging technologies (e.g., FC-BGA, CSP, SiP).
Applications
Advanced IC Packaging: FC-BGA, CSP, SiP, Fan-Out, etc. Electronic Adhesives: High thermal conductivity, low-stress encapsulants PCB Substrate Materials: Filler for high-frequency/high-speed substrates LED Packaging: Improves heat dissipation and reduces thermal resistance Power Device Packaging: IGBT, MOSFET, and other high-power devices
Key Advantages
Ultrafine Particle Size: 0.5-10μm ensures high filling rate and reduces void formation Low Thermal Expansion: Matches silicon chips, minimizing packaging stress and improving reliability Low Dielectric Loss: Ideal for high-frequency/high-speed applications Customizable: Tailored particle size and surface treatment available
Packaging & Storage
Packaging: 25kg/bag (customizable)
Storage: Store in a cool, dry place; avoid moisture. Shelf life: 12 months
Compliance Standards
RoHS/REACH compliant
Why Choose Our Product?
Professional Electronic-Grade Material: Optimized for IC packaging, ensuring high reliability and stability
Technical Support: Customized solutions for diverse packaging requirements
Contact Us: Request samples or technical consultation!
Project
Unit
Typical values
Appearance
/
White powder
Density
kg/m3
2.59×103
Mohs hardness
/
five
Dielectric constant
/
5.0（1MHz）
Dielectric loss
/
0.003（1MHz）
Linear expansion coefficient
1/K
3.8×10-6
Soft composite silicon micro powder can be classified into specifications and matched according to customer requirements based on the following characteristics:
Project
Related indicators
Explain
Chemical Composition
SiO2 content, etc
Having a stable chemical composition to ensure consistent performance
Ion Impurity
Na+, Cl -, etc
Can be as low as 5ppm or below
Particle Size Distribution
D50
D50=0.5-10 µ m optional
Particle size distribution
Adjustments can be made based on typical distributions as required, including multimodal distributions, narrow distributions, etc
Surface Characteristics
Hydrophobicity, oil absorption value, etc
Different functional treatment agents can be selected according to customer requirements
Product Description
This product is a high-performance ultrafine flexible composite silica powder specially designed for integrated circuit (IC) packaging. It features excellent flowability, low stress, high filling rate, and low coefficient of thermal expansion (CTE), significantly enhancing the reliability and thermal performance of packaging materials. With special surface treatment technology, it ensures high compatibility with epoxy resins and other packaging materials, making it suitable for advanced packaging technologies (e.g., FC-BGA, CSP, SiP).
Applications
Advanced IC Packaging: FC-BGA, CSP, SiP, Fan-Out, etc. Electronic Adhesives: High thermal conductivity, low-stress encapsulants PCB Substrate Materials: Filler for high-frequency/high-speed substrates LED Packaging: Improves heat dissipation and reduces thermal resistance Power Device Packaging: IGBT, MOSFET, and other high-power devices
Key Advantages
Ultrafine Particle Size: 0.5-10μm ensures high filling rate and reduces void formation Low Thermal Expansion: Matches silicon chips, minimizing packaging stress and improving reliability Low Dielectric Loss: Ideal for high-frequency/high-speed applications Customizable: Tailored particle size and surface treatment available
Packaging & Storage
Packaging: 25kg/bag (customizable)
Storage: Store in a cool, dry place; avoid moisture. Shelf life: 12 months
Compliance Standards
RoHS/REACH compliant
Why Choose Our Product?
Professional Electronic-Grade Material: Optimized for IC packaging, ensuring high reliability and stability
Technical Support: Customized solutions for diverse packaging requirements
Contact Us: Request samples or technical consultation!
Project
Unit
Typical values
Appearance
/
White powder
Density
kg/m3
2.59×103
Mohs hardness
/
five
Dielectric constant
/
5.0（1MHz）
Dielectric loss
/
0.003（1MHz）
Linear expansion coefficient
1/K
3.8×10-6
Soft composite silicon micro powder can be classified into specifications and matched according to customer requirements based on the following characteristics:
Project
Related indicators
Explain
Chemical Composition
SiO2 content, etc
Having a stable chemical composition to ensure consistent performance
Ion Impurity
Na+, Cl -, etc
Can be as low as 5ppm or below
Particle Size Distribution
D50
D50=0.5-10 µ m optional
Particle size distribution
Adjustments can be made based on typical distributions as required, including multimodal distributions, narrow distributions, etc
Surface Characteristics
Hydrophobicity, oil absorption value, etc
Different functional treatment agents can be selected according to customer requirements
