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Low-Expansion Flexible Composite Silica Powder Material

This product is a low-expansion, highly flexible composite silica micro-powder material specially designed for high-end applications such as precision electronic packaging, high-frequency substrates, and flexible circuits (FPC). It features excellent thermal stability, low dielectric constant, and outstanding mechanical flexibility, effectively reducing the risk of stress cracking due to temperature changes and enhancing the long-term reliability of electronic devices.

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Product Description

Product Description

This product is a low-expansion, highly flexible composite silica micro-powder material specially designed for high-end applications such as precision electronic packaging, high-frequency substrates, and flexible circuits (FPC). It features excellent thermal stability, low dielectric constant, and outstanding mechanical flexibility, effectively reducing the risk of stress cracking due to temperature changes and enhancing the long-term reliability of electronic devices.

Core Characteristics

Ultra-Low Coefficient of Thermal Expansion (CTE): Matches chip and substrate materials to reduce thermal stress.
Highly Flexible Structure: Adapts to dynamic application scenarios like bending and folding.
Low Dielectric Loss: Suitable for high-frequency signal transmission (5G/millimeter waves).
High Purity & Low Impurities: Meets semiconductor-grade packaging requirements.

Application Areas

Advanced Packaging:

Chip Scale Packaging (CSP/WLCSP)
2.5D/3D TSV packaging via hole-filling materials

High-Frequency Electronics:

5G base station antenna substrates
Millimeter-wave radar dielectric materials

Flexible Electronics:

Flexible display (OLED/Flexible OLED) substrates
Wearable device circuit packaging

High-Reliability Scenarios:

Automotive electronics (ADAS sensor packaging)
Aerospace electronic components

Product Advantages

Low-Stress Design: Adjustable CTE for perfect matching with Si/glass/organic substrates.
Process Compatibility: Compatible with common packaging materials like epoxy resins and silicone.
Customized Services: Supports particle size and surface modification (silane coupling agent treatment).
Environmental Compliance: Complies with RoHS 2.0 and REACH regulations.

Packaging & Storage

Packaging Specifications: 25kg/bag (customizable).
Storage Conditions: Store in a cool, dry place to avoid moisture (recommended humidity ≤60%).

Why Choose Us?

Precision Manufacturing: Uses advanced processes to ensure particle uniformity.
Strict Quality Control: Provides ICP-MS purity reports and particle size distribution test data for each batch.
Global Supply: Supports OEM/ODM with rapid response to customization needs.

Project	Unit	Typical values
Appearance	/	White powder
Density	kg/m3	2.59×103
Mohs hardness	/	five
Dielectric constant	/	5.0（1MHz）
Dielectric loss	/	0.003（1MHz）
Linear expansion coefficient	1/K	3.8×10-6

Soft composite silicon micro powder can be classified into specifications and matched according to customer requirements based on the following characteristics:

Project	Related indicators	Explain
Chemical Composition	SiO2 content, etc	Having a stable chemical composition to ensure consistent performance
Ion Impurity	Na+, Cl -, etc	Can be as low as 5ppm or below
Particle Size Distribution	D50	D50=0.5-10 µ m optional
Particle Size Distribution	Particle size distribution	Adjustments can be made based on typical distributions as required, including multimodal distributions, narrow distributions, etc
Surface Characteristics	Hydrophobicity, oil absorption value, etc	Different functional treatment agents can be selected according to customer requirements