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Sprayable Industrial Soft Composite Silica Powder for Electronic Encapsulation

This innovative soft composite silica powder is specifically engineered for electronic encapsulation applications. Utilizing advanced sprayable technology and specialized surface modification, it offers exceptional flowability and uniform dispersion. The material can be directly sprayed onto precision electronic components to form highly reliable insulating protective layers or thermal interfaces, significantly improving encapsulation efficiency and device performance stability.

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Product Description

Product Description
This innovative soft composite silica powder is specifically engineered for electronic encapsulation applications. Utilizing advanced sprayable technology and specialized surface modification, it offers exceptional flowability and uniform dispersion. The material can be directly sprayed onto precision electronic components to form highly reliable insulating protective layers or thermal interfaces, significantly improving encapsulation efficiency and device performance stability.

Product Features

High Sprayability

Ultra-fine particle size and low viscosity enable compatibility with airless/electrostatic spraying for micron-level uniform coating.

Flexible Composite Structure

Organic-inorganic hybrid system provides crack-resistant flexibility to accommodate thermal expansion of components.

Superior Insulation

Forms dense protective barriers against moisture, dust and EMI to ensure long-term device reliability.

Eco-Friendly

Solvent-free formulation with zero VOC emissions, compliant with RoHS and electronics industry standards.

Rapid Curing

Low-temperature curing (80-120°C) reduces energy consumption and prevents thermal damage to sensitive components.

Product Advantages

Process Innovation: Simplifies traditional encapsulation by enabling direct integration with automated production lines
Precision Compatibility: Perfectly conforms to complex surfaces of chips, sensors and microcircuits
Balanced Performance: Optimizes insulation, thermal conductivity and mechanical strength
Wide Compatibility: Works with epoxy, silicone and polyimide encapsulation matrices

Application Fields

Semiconductor: Chip surface insulation, wafer-level packaging
Consumer Electronics: Mobile device PCB protection, wearable waterproofing
Automotive Electronics: ECU thermal interfaces, vehicle sensors
5G Communications: EMI shielding for high-frequency PCBs, RF thermal management
New Energy Equipment: PV inverter insulation, battery module protection

Project	Unit	Typical values
Appearance	/	White powder
Density	kg/m3	2.59×103
Mohs hardness	/	five
Dielectric constant	/	5.0（1MHz）
Dielectric loss	/	0.003（1MHz）
Linear expansion coefficient	1/K	3.8×10-6

Soft composite silicon micro powder can be classified into specifications and matched according to customer requirements based on the following characteristics:

Project	Related indicators	Explain
Chemical Composition	SiO2 content, etc	Having a stable chemical composition to ensure consistent performance
Ion Impurity	Na+, Cl -, etc	Can be as low as 5ppm or below
Particle Size Distribution	D50	D50=0.5-10 µ m optional
Particle Size Distribution	Particle size distribution	Adjustments can be made based on typical distributions as required, including multimodal distributions, narrow distributions, etc
Surface Characteristics	Hydrophobicity, oil absorption value, etc	Different functional treatment agents can be selected according to customer requirements