Spherical Alumina Filler for Advanced Packaging

This high-purity electronic-grade spherical alumina filler is specifically designed for advanced semiconductor packaging applications (e.g., FC-BGA, Chiplet, 3D IC). Manufactured using precision spheroidization technology, it features:

• High purity (≥99.5%)

• Low alpha-ray emission

• Excellent thermal conductivity (≥30 W/m·K)

It significantly enhances the thermal management performance and mechanical strength of packaging materials, making it ideal for high-density, high-reliability electronic packaging.

Advanced Semiconductor Packaging:

• FC-BGA (Flip-Chip Ball Grid Array)

• 2.5D/3D IC (Silicon Interposer, TSV Filling)

• Chiplet Integration

High-Thermal-Conductivity Packaging Materials:

• Epoxy Molding Compound (EMC) Filler

• Thermal Gel/Adhesive Reinforcement

5G/High-Frequency Electronics:

• Millimeter-Wave RF Device Packaging

• Power Module (IGBT/SiC) Heat Dissipation

Key Advantages

High Purity: 99.5% purity minimizes ionic contamination, ensuring chip reliability
Low Alpha-Ray: Meets low-radiation requirements for advanced memory chips (DRAM/NAND)
Optimized Thermal Management: High thermal conductivity (≥30 W/m·K) reduces thermal resistance
Precise Particle Size Control: Adjustable 0.5-20μm for diverse packaging processes
High Sphericity: Reduces stress concentration and improves flowability/filling rate

Why Choose Us?

Specialization in Electronic-Grade Materials: Complies with international standards
Customization Services: Tailored particle size and surface modification (e.g., silane coupling)
Stable Supply: 200-ton monthly capacity with high batch consistency
Technical Support: Thermal simulation and formulation optimization available

Packaging & Shipping

• Packaging: 25kg/bag (customizable)

• Shipping: Moisture-proof and shock-resistant, global logistics supported

Ideal for: Semiconductor packaging material manufacturers, EMC suppliers, 5G device makers
RFQ Note: Please specify required particle size, purity, and surface treatment