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Product Introduction
Thermally conductive composite powder can build a complete thermal conductivity path in the adhesive, endow the adhesive with good heat dissipation characteristics, and can also provide new heat dissipation solutions for some electronic components and heating components in the service terminal.
Product Technical Parameters
Product Name | Model | Appearance | Average particle size (um) | Oil absorption value (g/100g) | Volatile matter percentage at 105 ℃ |
Thermal conductive composite powder | TFP-100Y | White powder | 18.34 | 8.6 | 0.33 |
TFP-150Y | White powder | 9.29 | 10.2 | 0.35 | |
TFP-200Y | White powder | 12.55 | 13.4 | 0.37 |
Electronics Thermal Management
Thermal interface materials (TIMs), epoxy encapsulants, PCB substrates.
LED & Semiconductor Packaging
Heat spreaders, LED phosphor coatings.
Electric Vehicles (EV) & Batteries
Battery thermal pads, power module potting compounds.
High-Performance Plastics & Coatings
Thermally conductive plastics for housings, heat-resistant coatings.
5G & Telecommunications
Base station components, RF amplifier cooling.
✔ Higher filler loading without sacrificing viscosity – Enables better thermal pathways.
✔ Superior mechanical strength – Reduces cracking in cured composites.
✔ Customizable formulations – Tailored for specific conductivity or viscosity needs.
Proven performance in demanding thermal management applications.
Cost-effective compared to pure metallic or ceramic alternatives.
Scalable production with consistent quality control.
For detailed datasheets or custom requirements, please consult technical support.
Product Introduction
Thermally conductive composite powder can build a complete thermal conductivity path in the adhesive, endow the adhesive with good heat dissipation characteristics, and can also provide new heat dissipation solutions for some electronic components and heating components in the service terminal.
Product Technical Parameters
Product Name | Model | Appearance | Average particle size (um) | Oil absorption value (g/100g) | Volatile matter percentage at 105 ℃ |
Thermal conductive composite powder | TFP-100Y | White powder | 18.34 | 8.6 | 0.33 |
TFP-150Y | White powder | 9.29 | 10.2 | 0.35 | |
TFP-200Y | White powder | 12.55 | 13.4 | 0.37 |
Electronics Thermal Management
Thermal interface materials (TIMs), epoxy encapsulants, PCB substrates.
LED & Semiconductor Packaging
Heat spreaders, LED phosphor coatings.
Electric Vehicles (EV) & Batteries
Battery thermal pads, power module potting compounds.
High-Performance Plastics & Coatings
Thermally conductive plastics for housings, heat-resistant coatings.
5G & Telecommunications
Base station components, RF amplifier cooling.
✔ Higher filler loading without sacrificing viscosity – Enables better thermal pathways.
✔ Superior mechanical strength – Reduces cracking in cured composites.
✔ Customizable formulations – Tailored for specific conductivity or viscosity needs.
Proven performance in demanding thermal management applications.
Cost-effective compared to pure metallic or ceramic alternatives.
Scalable production with consistent quality control.
For detailed datasheets or custom requirements, please consult technical support.