Key Advantages
High Thermal Conductivity - 30-35 W/(m·K), significantly improving heat dissipation efficiency
High Sphericity (≥95%) - Excellent flowability, high packing density, and reduced system viscosity
High Purity (≥99.5%) - Low impurities, suitable for high-end electronic packaging
Customizable Particle Size (2-50μm) - Meets diverse application requirements
Low Oil Absorption (≤15ml/100g) - Reduces resin usage and lowers costs
Chemically Inert - High-temperature resistant (melting point 2050°C), oxidation-resistant, long-term stability
Typical Applications
Electronic Packaging - IC encapsulation, chip thermal materials, power modules
Thermal Interface Materials (TIM) - Thermal grease, thermal pads, thermal adhesives
5G Communications - Base station cooling, high-frequency PCB thermal filler
LED Heat Dissipation - LED packaging, COB light source thermal management
New Energy Vehicles - Power battery cooling, electric control system thermal conduction
Precision Ceramics - High thermal conductivity ceramic substrates, electronic ceramics
Why Choose Our Spherical Alumina Filler?
Strict Quality Control - High-purity raw materials ensure batch consistency
Customization Services - Tailored particle sizes and surface modification options
Cost-Effective - Optimized production process reduces customer costs
Technical Support - Provides application solutions for heat dissipation challenges
Packaging & Storage
Packaging - 25g/bag (moisture-proof aluminum foil bag) or customized packaging
Storage - Store in a cool, dry place to avoid moisture
Compliance & Certifications
Contact Us - Request samples or technical consultation anytime!
