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Ultrafine Spherical Alumina Powder (D50 2-50μ m) - Electronic Grade
Ultrafine Spherical Alumina Powder (D50 2-50μ m) - Electronic Grade Ultrafine Spherical Alumina Powder (D50 2-50μ m) - Electronic Grade

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Ultrafine Spherical Alumina Powder (D50 2-50μ m) - Electronic Grade

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This product is a high-purity electronic-grade ultrafine spherical alumina powder, manufactured using advanced plasma melting technology. It features perfect sphericity, ultra-fine particle size (controllable D50 2-50μm), as well as excellent flowability, dispersibility, and thermal conductivity. Suitable for high-end electronic packaging, thermal interface materials (TIM), 5G communication substrates, LED encapsulation, and other fields, it significantly enhances the thermal management performance and reliability of materials.
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Product Description:

This product is a high-purity electronic-grade ultrafine spherical alumina powder, manufactured using advanced plasma melting technology. It features perfect sphericity, ultra-fine particle size (controllable D50 2-50μm), as well as excellent flowability, dispersibility, and thermal conductivity. Suitable for high-end electronic packaging, thermal interface materials (TIM), 5G communication substrates, LED encapsulation, and other fields, it significantly enhances the thermal management performance and reliability of materials.


Applications


Electronic Packaging: Used in IC packaging and LED phosphor coatings to improve heat dissipation
Thermal Interface Materials (TIM): Fills thermal greases/gels to enhance thermal conductivity (5-15 W/m·K)
5G High-Frequency Substrates: Reduces dielectric loss and improves signal transmission stability
Precision Ceramics: Acts as a sintering aid to increase densification
Lithium Battery Separator Coatings: Enhances thermal stability and prevents thermal runaway


Product Advantages


Ultra-Fine Particle Size + High Sphericity: Excellent flowability, high packing density, and reduced stress concentration
Ultra-High Purity (4N Grade): Low sodium/silicon content, ideal for high-reliability electronic components
Superior Thermal Conductivity: Thermal conductivity up to 30 W/m·K (theoretical value)
Customizable Particle Size: Adjustable within 2-50μm to meet diverse application needs
Surface Modification Available: Silane coupling agent treatment improves compatibility with resins/polymers


Packaging & Storage


Packaging: 25kg/bag or customized upon request
Storage: Store in a sealed, cool, and dry environment to avoid moisture absorption


Why Choose Our Product?


Strict Quality Control: Each batch comes with test reports
Stable Supply: Monthly production capacity of 200 tons supports bulk orders
Technical Support: Free application optimization consulting


Contact Us: Request free samples or customized solutions!
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Project

Related indicators

Explain

Purity

A1.03

More than 99%

Impurities

Na,0

Can be as low as below 300ppm

Appearance

0-A1z03 content

Up to 90% or more
Particle Size Distribution D50 Optional within 2um-50um

Di₀0

Can be as low as 10um or less

Particle size distribution Adjustments can be made based on the typical distribution according to the requirements of the palace household, including multi-modal distribution and narrow distribution


Project

Unit

Typical values

Appearance

/

White pink wood

Particle Shaped Ni

/ Spherical

Density

kg/m³ 3.7×103

Mohs Hardness

/ 6-9

Dielectric Constant

Er 9

Dielectric Loss

lgδ 0.0003
Linear expansion coefficient 1/K 0.7x10-6
Thermal conductivity W/Kam 30


+8618936720888
+86-189-3672-0888

CONTACT US

Tel: +86-189-3672-0888
Emai: sales@silic-st.com
WhatsApp: +8618936720888
Add: No. 8-2, Zhenxing South Road, High-tech Development Zone, Donghai County, Jiangsu Province

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