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Electronic Packaging: Used in IC packaging and LED phosphor coatings to improve heat dissipation
 Thermal Interface Materials (TIM): Fills thermal greases/gels to enhance thermal conductivity (5-15 W/m·K)
 5G High-Frequency Substrates: Reduces dielectric loss and improves signal transmission stability
 Precision Ceramics: Acts as a sintering aid to increase densification
 Lithium Battery Separator Coatings: Enhances thermal stability and prevents thermal runaway
Ultra-Fine Particle Size + High Sphericity: Excellent flowability, high packing density, and reduced stress concentration
 Ultra-High Purity (4N Grade): Low sodium/silicon content, ideal for high-reliability electronic components
 Superior Thermal Conductivity: Thermal conductivity up to 30 W/m·K (theoretical value)
 Customizable Particle Size: Adjustable within 2-50μm to meet diverse application needs
 Surface Modification Available: Silane coupling agent treatment improves compatibility with resins/polymers
Packaging: 25kg/bag or customized upon request
 Storage: Store in a sealed, cool, and dry environment to avoid moisture absorption
Strict Quality Control: Each batch comes with test reports
 Stable Supply: Monthly production capacity of 200 tons supports bulk orders
 Technical Support: Free application optimization consulting
Contact Us: Request free samples or customized solutions!
(Add company contact details or website link here)
| Project | Related indicators | Explain | 
| Purity | A1.03 | More than 99% | 
| Impurities | Na,0 | Can be as low as below 300ppm | 
| Appearance | 0-A1z03 content | Up to 90% or more | 
| Particle Size Distribution | D50 | Optional within 2um-50um | 
| Di₀0 | Can be as low as 10um or less | |
| Particle size distribution | Adjustments can be made based on the typical distribution according to the requirements of the palace household, including multi-modal distribution and narrow distribution | 
| Project | Unit | Typical values | 
| Appearance | / | White pink wood | 
| Particle Shaped Ni | / | Spherical | 
| Density | kg/m³ | 3.7×103 | 
| Mohs Hardness | / | 6-9 | 
| Dielectric Constant | Er | 9 | 
| Dielectric Loss | lgδ | 0.0003 | 
| Linear expansion coefficient | 1/K | 0.7x10-6 | 
| Thermal conductivity | W/Kam | 30 | 
Electronic Packaging: Used in IC packaging and LED phosphor coatings to improve heat dissipation
 Thermal Interface Materials (TIM): Fills thermal greases/gels to enhance thermal conductivity (5-15 W/m·K)
 5G High-Frequency Substrates: Reduces dielectric loss and improves signal transmission stability
 Precision Ceramics: Acts as a sintering aid to increase densification
 Lithium Battery Separator Coatings: Enhances thermal stability and prevents thermal runaway
Ultra-Fine Particle Size + High Sphericity: Excellent flowability, high packing density, and reduced stress concentration
 Ultra-High Purity (4N Grade): Low sodium/silicon content, ideal for high-reliability electronic components
 Superior Thermal Conductivity: Thermal conductivity up to 30 W/m·K (theoretical value)
 Customizable Particle Size: Adjustable within 2-50μm to meet diverse application needs
 Surface Modification Available: Silane coupling agent treatment improves compatibility with resins/polymers
Packaging: 25kg/bag or customized upon request
 Storage: Store in a sealed, cool, and dry environment to avoid moisture absorption
Strict Quality Control: Each batch comes with test reports
 Stable Supply: Monthly production capacity of 200 tons supports bulk orders
 Technical Support: Free application optimization consulting
Contact Us: Request free samples or customized solutions!
(Add company contact details or website link here)
| Project | Related indicators | Explain | 
| Purity | A1.03 | More than 99% | 
| Impurities | Na,0 | Can be as low as below 300ppm | 
| Appearance | 0-A1z03 content | Up to 90% or more | 
| Particle Size Distribution | D50 | Optional within 2um-50um | 
| Di₀0 | Can be as low as 10um or less | |
| Particle size distribution | Adjustments can be made based on the typical distribution according to the requirements of the palace household, including multi-modal distribution and narrow distribution | 
| Project | Unit | Typical values | 
| Appearance | / | White pink wood | 
| Particle Shaped Ni | / | Spherical | 
| Density | kg/m³ | 3.7×103 | 
| Mohs Hardness | / | 6-9 | 
| Dielectric Constant | Er | 9 | 
| Dielectric Loss | lgδ | 0.0003 | 
| Linear expansion coefficient | 1/K | 0.7x10-6 | 
| Thermal conductivity | W/Kam | 30 |