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Electronic Packaging: Used in IC packaging and LED phosphor coatings to improve heat dissipation
Thermal Interface Materials (TIM): Fills thermal greases/gels to enhance thermal conductivity (5-15 W/m·K)
5G High-Frequency Substrates: Reduces dielectric loss and improves signal transmission stability
Precision Ceramics: Acts as a sintering aid to increase densification
Lithium Battery Separator Coatings: Enhances thermal stability and prevents thermal runaway
Ultra-Fine Particle Size + High Sphericity: Excellent flowability, high packing density, and reduced stress concentration
Ultra-High Purity (4N Grade): Low sodium/silicon content, ideal for high-reliability electronic components
Superior Thermal Conductivity: Thermal conductivity up to 30 W/m·K (theoretical value)
Customizable Particle Size: Adjustable within 2-50μm to meet diverse application needs
Surface Modification Available: Silane coupling agent treatment improves compatibility with resins/polymers
Packaging: 25kg/bag or customized upon request
Storage: Store in a sealed, cool, and dry environment to avoid moisture absorption
Strict Quality Control: Each batch comes with test reports
Stable Supply: Monthly production capacity of 200 tons supports bulk orders
Technical Support: Free application optimization consulting
Contact Us: Request free samples or customized solutions!
(Add company contact details or website link here)
Project | Related indicators | Explain |
Purity | A1.03 | More than 99% |
Impurities | Na,0 | Can be as low as below 300ppm |
Appearance | 0-A1z03 content | Up to 90% or more |
Particle Size Distribution | D50 | Optional within 2um-50um |
Di₀0 | Can be as low as 10um or less | |
Particle size distribution | Adjustments can be made based on the typical distribution according to the requirements of the palace household, including multi-modal distribution and narrow distribution |
Project | Unit | Typical values |
Appearance | / | White pink wood |
Particle Shaped Ni | / | Spherical |
Density | kg/m³ | 3.7×103 |
Mohs Hardness | / | 6-9 |
Dielectric Constant | Er | 9 |
Dielectric Loss | lgδ | 0.0003 |
Linear expansion coefficient | 1/K | 0.7x10-6 |
Thermal conductivity | W/Kam | 30 |
Electronic Packaging: Used in IC packaging and LED phosphor coatings to improve heat dissipation
Thermal Interface Materials (TIM): Fills thermal greases/gels to enhance thermal conductivity (5-15 W/m·K)
5G High-Frequency Substrates: Reduces dielectric loss and improves signal transmission stability
Precision Ceramics: Acts as a sintering aid to increase densification
Lithium Battery Separator Coatings: Enhances thermal stability and prevents thermal runaway
Ultra-Fine Particle Size + High Sphericity: Excellent flowability, high packing density, and reduced stress concentration
Ultra-High Purity (4N Grade): Low sodium/silicon content, ideal for high-reliability electronic components
Superior Thermal Conductivity: Thermal conductivity up to 30 W/m·K (theoretical value)
Customizable Particle Size: Adjustable within 2-50μm to meet diverse application needs
Surface Modification Available: Silane coupling agent treatment improves compatibility with resins/polymers
Packaging: 25kg/bag or customized upon request
Storage: Store in a sealed, cool, and dry environment to avoid moisture absorption
Strict Quality Control: Each batch comes with test reports
Stable Supply: Monthly production capacity of 200 tons supports bulk orders
Technical Support: Free application optimization consulting
Contact Us: Request free samples or customized solutions!
(Add company contact details or website link here)
Project | Related indicators | Explain |
Purity | A1.03 | More than 99% |
Impurities | Na,0 | Can be as low as below 300ppm |
Appearance | 0-A1z03 content | Up to 90% or more |
Particle Size Distribution | D50 | Optional within 2um-50um |
Di₀0 | Can be as low as 10um or less | |
Particle size distribution | Adjustments can be made based on the typical distribution according to the requirements of the palace household, including multi-modal distribution and narrow distribution |
Project | Unit | Typical values |
Appearance | / | White pink wood |
Particle Shaped Ni | / | Spherical |
Density | kg/m³ | 3.7×103 |
Mohs Hardness | / | 6-9 |
Dielectric Constant | Er | 9 |
Dielectric Loss | lgδ | 0.0003 |
Linear expansion coefficient | 1/K | 0.7x10-6 |
Thermal conductivity | W/Kam | 30 |