High Reliability Spherical Alumina Powder

This electronic-grade high-reliability spherical alumina powder features high purity, excellent sphericity, superior thermal conductivity, and stable chemical properties, specially designed for demanding applications including advanced electronic packaging, semiconductor thermal management, and 5G communication materials. Produced through advanced plasma melting technology, it guarantees ≥95% sphericity with smooth, defect-free surfaces, significantly enhancing the thermal management performance and mechanical strength of composite materials.

Applications

Advanced Electronic Packaging: For IC packaging, LED heat dissipation substrates, improving thermal conductivity and reliability
5G Communication Materials: Suitable for high-frequency substrates and RF device cooling
Thermal Interface Materials (TIM): Enhances thermal grease/paste heat dissipation efficiency
Precision Ceramics: Used in high thermal conductivity ceramic substrates and insulation components
New Energy Vehicle Electronics: Battery management systems (BMS), power module cooling

Key Advantages

High purity (≥99.5%) with ultra-low metallic impurities, ensuring electronic-grade reliability
Excellent sphericity (≥95%) for superior flowability, higher filling rates, and better processability
Outstanding thermal conductivity (30-35 W/m·K) for significantly improved heat dissipation
Strong chemical stability, resistant to high temperatures and corrosion, suitable for harsh environments
Customizable particle size (2-50μm) to meet diverse application requirements

Why Choose Our Product?

Strict QC: Batch-by-batch testing ensures consistent performance
Technical Support: Professional application consultation and customization services
Global Supply Chain: Stable supply with bulk order support

Packaging

• Standard: 25kg/bag (customizable upon request)

Compliance Standards

• RoHS/REACH compliant

• ISO 9001 certified quality management system

Contact Us: Request samples or technical consultation anytime!