Product Description This product is high-purity and high-sphericity electronic-grade spherical aluminum oxide powder (α-Al2O3), specifically designed for high-end electronic packaging applications. It offers excellent thermal conductivity, insulation, and filling performance, significantly enhancing the heat dissipation efficiency and reliability of electronic components such as semiconductor packages, LEDs, and power modules.
Application Fields
Semiconductor Packaging: Used as packaging materials for chips such as CPU, GPU, and IGBT to improve heat dissipation performance.
LED Packaging: Serves as a phosphor carrier or thermal conductive filler to extend LED lifespan.
5G Communication Modules: Enhances thermal management capabilities of high-frequency substrates.
Power Electronics: Suitable for high-temperature applications in new energy vehicles, photovoltaic inverters, etc.
High Thermal Conductivity Adhesives/Pastes: Optimizes thermal conductivity efficiency of thermal interface materials (TIM).
Product Advantages
Ultra-high Purity: Low metal impurity content meets semiconductor-grade requirements.
High Sphericity (≥95%): Excellent fluidity and high filling rate reduce resin usage.
Superior Thermal Conductivity: Thermal conductivity reaches 30-35 W/(m·K), significantly lowering device operating temperatures.
Reliable Insulation: Stable dielectric constant suitable for high-frequency circuit environments.
Customizable Particle Size: Supports particle size adjustment from 0.5-50μm to adapt to different packaging processes.
Packaging and Storage
Why Choose Us?
Electronic-grade Dedicated Production: Production lines comply with ISO 9001/14001 standards, ensuring stable and controllable purity.
Technical Support: Provides customized services for particle size distribution, surface modification, etc.
Global Supply: Long-term cooperative clients include renowned packaging material manufacturers.
