High Thermal Conductive Insulating Spherical Alumina Powder

Our electronic-grade spherical alumina powder is manufactured using advanced high-temperature melting technology, featuring:

• High sphericity (≥95%)

• Exceptional purity (≥99.5%)

• Ultra-low sodium content (≤50ppm)

• Outstanding thermal conductivity (25-30 W/m·K)

• Excellent electrical insulation (Volume resistivity ≥10¹⁴ Ω·cm)

Ideal for demanding applications requiring superior thermal management in advanced electronics.

Applications

5G Communications: Heat dissipation filler for high-frequency substrates & RF devices
Power Electronics: Thermal interface material for IGBT/MOSFET modules
LED Packaging: Enhances chip heat dissipation and lifespan
New Energy Vehicles: Insulating thermal layer for BMS
High-end CCL: Improves thermal conductivity while reducing CTE

Competitive Advantages

Superior Thermal Conductivity: Single-crystal α-phase structure outperforms angular alumina
Perfect Insulation: Volume resistivity >10¹⁴ Ω·cm ensures circuit safety
Low Ionic Impurities: Na⁺/K⁺ <100ppm meets semiconductor requirements
High Packing Density: Spherical morphology enables >80% filling ratio
Customizable Sizing: 2-50μm particle size tailoring for different systems

Packaging & Storage

• Packaging: 25kg/bag (Customizable options available)

• Storage: Keep in cool & dry environment (Recommended RH<60%)

Why Choose Us?

Electronic-Grade Purity - ICP test reports provided
Industry-Leading Sphericity - Verified by laser particle analyzer & SEM
Technical Support - Formula optimization assistance