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Spherical Alumina Powder
Spherical alumina is calcined from ordinary irregular-shaped Al2O3 through high-temperature melt spraying, and then undergoes screening, purification and other processes to obtain the final product. Due to its unique properties such as high thermal conductivity and good fluidity, this product is widely used as thermal interface materials, thermally conductive engineering plastics and thermal fillers for aluminum-based copper-clad laminates.
Product Application:
● Thermal interface materials: thermally conductive silicone gaskets, thermally conductive silicone grease, thermally conductive potting glue, thermally conductive double-sided tape, thermally conductive phase change materials, etc.;
● Thermal conductive engineering plastics: LED lampshades, switch casings, notebook casings, mobile phone casings, water tanks, motor coil skeletons, etc.;
● High thermal conductivity aluminum base copper clad laminate (AI Base CCL): high-power LED lighting, power circuits, LED TV, etc.;
● Alumina ceramic substrate surface spraying: potentiometer, chip resistor, etc.
Project | Related indicators | Explain |
Purity | A1.03 | More than 99% |
Impurities | Na,0 | Can be as low as below 300ppm |
Appearance | 0-A1z03 content | Up to 90% or more |
Particle Size Distribution | D50 | Optional within 2um-50um |
Di₀0 | Can be as low as 10um or less | |
Particle size distribution | Adjustments can be made based on the typical distribution according to the requirements of the palace household, including multi-modal distribution and narrow distribution |
Project | Unit | Typical values |
Appearance | / | White pink wood |
Particle Shaped Ni | / | Spherical |
Density | kg/m³ | 3.7×103 |
Mohs Hardness | / | 6-9 |
Dielectric Constant | Er | 9 |
Dielectric Loss | lgδ | 0.0003 |
Linear expansion coefficient | 1/K | 0.7x10-6 |
Thermal conductivity | W/Kam | 30 |
Spherical Alumina Powder
Spherical alumina is calcined from ordinary irregular-shaped Al2O3 through high-temperature melt spraying, and then undergoes screening, purification and other processes to obtain the final product. Due to its unique properties such as high thermal conductivity and good fluidity, this product is widely used as thermal interface materials, thermally conductive engineering plastics and thermal fillers for aluminum-based copper-clad laminates.
Product Application:
● Thermal interface materials: thermally conductive silicone gaskets, thermally conductive silicone grease, thermally conductive potting glue, thermally conductive double-sided tape, thermally conductive phase change materials, etc.;
● Thermal conductive engineering plastics: LED lampshades, switch casings, notebook casings, mobile phone casings, water tanks, motor coil skeletons, etc.;
● High thermal conductivity aluminum base copper clad laminate (AI Base CCL): high-power LED lighting, power circuits, LED TV, etc.;
● Alumina ceramic substrate surface spraying: potentiometer, chip resistor, etc.
Project | Related indicators | Explain |
Purity | A1.03 | More than 99% |
Impurities | Na,0 | Can be as low as below 300ppm |
Appearance | 0-A1z03 content | Up to 90% or more |
Particle Size Distribution | D50 | Optional within 2um-50um |
Di₀0 | Can be as low as 10um or less | |
Particle size distribution | Adjustments can be made based on the typical distribution according to the requirements of the palace household, including multi-modal distribution and narrow distribution |
Project | Unit | Typical values |
Appearance | / | White pink wood |
Particle Shaped Ni | / | Spherical |
Density | kg/m³ | 3.7×103 |
Mohs Hardness | / | 6-9 |
Dielectric Constant | Er | 9 |
Dielectric Loss | lgδ | 0.0003 |
Linear expansion coefficient | 1/K | 0.7x10-6 |
Thermal conductivity | W/Kam | 30 |