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High Thermal Conductive Spherical Alumina Powder
High Thermal Conductive Spherical Alumina Powder High Thermal Conductive Spherical Alumina Powder

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High Thermal Conductive Spherical Alumina Powder

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Product Description
This product is high-purity spherical aluminum oxide powder (Al2O3), designed for high-end applications such as electronic packaging, thermal interface materials (TIM), and LED heat dissipation. It features ultra-high thermal conductivity, excellent insulation, and a high filling rate. Using an advanced plasma melting spheroidization process, it ensures high particle sphericity and uniform particle size distribution, significantly enhancing the thermal conductivity of composite materials while maintaining good fluidity and processability.
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Product Description

This product is high-purity spherical aluminum oxide powder (Al2O3), designed for high-end applications such as electronic packaging, thermal interface materials (TIM), and LED heat dissipation. It features ultra-high thermal conductivity, excellent insulation, and a high filling rate. Using an advanced plasma melting spheroidization process, it ensures high particle sphericity and uniform particle size distribution, significantly enhancing the thermal conductivity of composite materials while maintaining good fluidity and processability.


Core Advantages
Ultra-High Thermal Conductivity - Thermal conductivity reaches 30-40 W/(m·K), significantly improving heat dissipation efficiency.
High Purity (≥99.5%) - Low sodium and chlorine content, suitable for precision electronic packaging.
Perfect Sphericity (≥95%) - Increases filling rate and reduces viscosity of composite materials.
Customizable Particle Size (1-50μm) - Meets the needs of different thermal conductive materials.
Excellent Insulation - Insulation resistance ≥10 14 Ω·cm, ensuring the safety of electronic devices.
Low Oil Absorption Value - Optimizes the processing performance of resin systems.

Typical Applications
Thermal Interface Materials (TIM): Thermal grease, thermal gel, thermal pads
LED Packaging: Improves heat dissipation performance of LED chips and extends service life
5G Communication Materials: Heat dissipation fillers for high-frequency substrates and RF devices
Semiconductor Packaging: Chip bonding materials, EMC (epoxy molding compounds)
New Energy Batteries: Thermal and insulating coatings for power batteries

Why Choose Us?
Advanced Spheroidization Process - Prepared by plasma melting method, particles are non-angular with excellent fluidity.
Strict Quality Control - Compliant with RoHS and REACH standards, suitable for high-end electronics industry.
Technical Support - Provides surface modification (silane coupling agent treatment) to optimize dispersibility.
Stable Supply - Supports customized particle size distribution.

Packaging and Transportation
Standard Packaging: 25kg/bag, customizable options available.
Transportation: Sea/air freight, global logistics support.

Inquiry Tips
For sample testing or technical data sheets (TDS/MSDS), please contact us!
Supports OEM/ODM, product specifications can be adjusted according to customer requirements.




Project

Related indicators

Explain

Purity

A1.03

More than 99%

Impurities

Na,0

Can be as low as below 300ppm

Appearance

0-A1z03 content

Up to 90% or more
Particle Size Distribution D50 Optional within 2um-50um

Di₀0

Can be as low as 10um or less

Particle size distribution Adjustments can be made based on the typical distribution according to the requirements of the palace household, including multi-modal distribution and narrow distribution


Project

Unit

Typical values

Appearance

/

White pink wood

Particle Shaped Ni

/ Spherical

Density

kg/m³ 3.7×103

Mohs Hardness

/ 6-9

Dielectric Constant

Er 9

Dielectric Loss

lgδ 0.0003
Linear expansion coefficient 1/K 0.7x10-6
Thermal conductivity W/Kam 30


+8618168153275
+86-181-6815-3275

CONTACT US

Tel: +86-181-6815-3275
Emai: sales@silic-st.com
WhatsApp: +8618168153275
Add: No. 8-2, Zhenxing South Road, High-tech Development Zone, Donghai County, Jiangsu Province

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