Microelectronic Packaging Spherical Alumina Powder

Product Description:

This high-purity electronic-grade spherical alumina powder is specifically designed for microelectronic packaging and advanced semiconductor applications. Featuring excellent sphericity (≥95%), high thermal conductivity (≥30 W/m·K), and low alpha radiation (≤0.01 cph/cm²), it significantly enhances the thermal performance and reliability of packaging materials. Ideal for high-density integrated circuits (ICs), power modules, LED devices, and 5G component packaging.

Applications

Semiconductor Packaging: Advanced packaging processes including BGA, CSP, and Flip-Chip
Power Electronics: Thermal filler for IGBT and MOSFET modules
LED Packaging: Improves heat dissipation and light efficiency of LED devices
5G Communications: High-frequency substrates and high-power RF component packaging
Electronic Ceramics: HTCC/LTCC substrates and insulation layers

Key Advantages

High Purity: 99.5% purity with ultra-low metal impurities, meeting semiconductor-grade requirements
Perfect Sphericity: ≥95% sphericity for improved packing density and flowability
Superior Thermal Conductivity: ≥30 W/m·K thermal conductivity for effective chip junction temperature reduction
Low Alpha Radiation: ≤0.01 cph/cm² to prevent soft errors and enhance device reliability
Adjustable Particle Size: 2-50μm options available to suit various packaging processes

Packaging & Storage

• Packaging: 25kg/bag (customizable)

• Storage: Store in cool, dry conditions away from moisture and contaminants

Why Choose Us?

Electronic-Grade Specialization: 15 years of expertise in high-purity electronic materials
Strict Quality Control: ISO 9001/IATF 16949 certified
Customization Service: Tailored particle size and surface modification options
Global Supply: Serving 100+ semiconductor industry clients