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High Thermal Conductivity Spherical Alumina Powder for Efficient Heat Dissipation of Electronic Devices
High thermal conductivity spherical alumina powder is a high - performance material designed for efficient heat dissipation of electronic devices. Its unique spherical structure endows the product with many excellent properties and makes it perform outstandingly in the field of electronic heat dissipation.
Product Advantages
Ultra - high thermal conductivity: It has excellent heat conduction performance, which can quickly conduct the heat generated by electronic devices, effectively reduce the device temperature and ensure its stable operation. Compared with ordinary heat dissipation materials, the heat conduction efficiency is greatly improved.
Spherical structure: The spherical particles are closely packed, which can form a better heat conduction path, reduce thermal resistance and improve the heat dissipation effect. At the same time, this structure makes the powder have better dispersibility when mixed with other materials, and is easier to process.
Chemical stability: It has stable chemical properties and is not easy to react with other substances in electronic devices. It can play a heat dissipation role reliably for a long time and extend the service life of the device.
Uniform particle size: The product has a uniform particle size distribution, ensuring stable and efficient heat dissipation performance in different application scenarios.
Application Scenarios
Widely used in various electronic devices, such as computer CPU heat sinks, mobile phone back cover heat dissipation layers, LED lamp heat dissipation modules, power modules, etc. It can significantly improve the heat dissipation efficiency of these devices, optimize the device performance and reduce malfunctions caused by overheating.
Usage Method
According to different application requirements, high thermal conductivity spherical alumina powder can be mixed with corresponding matrix materials (such as silica gel, epoxy resin, etc.) in a certain proportion to make heat dissipation products such as heat paste and heat sink composite materials, and then applied to the heating parts of electronic devices.
Project
Related indicators
Explain
Purity
A1.03
More than 99%
Impurities
Na,0
Can be as low as below 300ppm
Appearance
0-A1z03 content
Up to 90% or more
Particle Size Distribution
D50
Optional within 2um-50um
Di₀0
Can be as low as 10um or less
Particle size distribution
Adjustments can be made based on the typical distribution according to the requirements of the palace household, including multi-modal distribution and narrow distribution
Project
Unit
Typical values
Appearance
/
White pink wood
Particle Shaped Ni
/
Spherical
Density
kg/m³
3.7×103
Mohs Hardness
/
6-9
Dielectric Constant
Er
9
Dielectric Loss
lgδ
0.0003
Linear expansion coefficient
1/K
0.7x10-6
Thermal conductivity
W/Kam
30
Product Introduction
High thermal conductivity spherical alumina powder is a high - performance material designed for efficient heat dissipation of electronic devices. Its unique spherical structure endows the product with many excellent properties and makes it perform outstandingly in the field of electronic heat dissipation.
Product Advantages
Ultra - high thermal conductivity: It has excellent heat conduction performance, which can quickly conduct the heat generated by electronic devices, effectively reduce the device temperature and ensure its stable operation. Compared with ordinary heat dissipation materials, the heat conduction efficiency is greatly improved.
Spherical structure: The spherical particles are closely packed, which can form a better heat conduction path, reduce thermal resistance and improve the heat dissipation effect. At the same time, this structure makes the powder have better dispersibility when mixed with other materials, and is easier to process.
Chemical stability: It has stable chemical properties and is not easy to react with other substances in electronic devices. It can play a heat dissipation role reliably for a long time and extend the service life of the device.
Uniform particle size: The product has a uniform particle size distribution, ensuring stable and efficient heat dissipation performance in different application scenarios.
Application Scenarios
Widely used in various electronic devices, such as computer CPU heat sinks, mobile phone back cover heat dissipation layers, LED lamp heat dissipation modules, power modules, etc. It can significantly improve the heat dissipation efficiency of these devices, optimize the device performance and reduce malfunctions caused by overheating.
Usage Method
According to different application requirements, high thermal conductivity spherical alumina powder can be mixed with corresponding matrix materials (such as silica gel, epoxy resin, etc.) in a certain proportion to make heat dissipation products such as heat paste and heat sink composite materials, and then applied to the heating parts of electronic devices.
Project
Related indicators
Explain
Purity
A1.03
More than 99%
Impurities
Na,0
Can be as low as below 300ppm
Appearance
0-A1z03 content
Up to 90% or more
Particle Size Distribution
D50
Optional within 2um-50um
Di₀0
Can be as low as 10um or less
Particle size distribution
Adjustments can be made based on the typical distribution according to the requirements of the palace household, including multi-modal distribution and narrow distribution
