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Thermal Greases/Gels: Improves thermal conductivity and reduces thermal resistance
Thermally Conductive Plastics/Engineering Plastics: Enhances heat dissipation for LED and 5G devices
Ceramic Substrates/Electronic Packaging: Optimizes heat diffusion and improves reliability
Battery Thermal Management Materials: Used in new energy battery cooling systems
High Thermal Conductivity Coatings: Boosts heat dissipation efficiency in coatings
High Loading Rate: Optimized particle gradation enables >85% filling rate, significantly improving thermal conductivity
High Sphericity (≥95%): Excellent flowability for easy processing and dispersion
Low Impurities (Na/K/Fe ≤50ppm): Suitable for high-reliability electronic packaging
Customizable Particle Size (2-50μm): Meets diverse application requirements
High Thermal Conductivity (30-40 W/(m·K)): Effectively enhances heat dissipation
Packaging: 20kg/bag (moisture-proof aluminum foil bag + carton)
Storage: Keep in a cool, dry place to avoid moisture
Strict Quality Control: Complies with electronic-grade material standards
Customizable Particle Size & Surface Modification: Adaptable to various applications
Cost-Effective: Ideal for bulk procurement
Technical Support: Provides formulation optimization recommendations
Electronic Packaging (ICs, LEDs, power devices)
New Energy (EV batteries, energy storage systems)
5G Communications (base station cooling, high-frequency PCBs)
Automotive Electronics (motor control systems, charging piles)
Contact us for customized solutions!
Project | Related indicators | Explain |
Purity | A1.03 | More than 99% |
Impurities | Na,0 | Can be as low as below 300ppm |
Appearance | 0-A1z03 content | Up to 90% or more |
Particle Size Distribution | D50 | Optional within 2um-50um |
Di₀0 | Can be as low as 10um or less | |
Particle size distribution | Adjustments can be made based on the typical distribution according to the requirements of the palace household, including multi-modal distribution and narrow distribution |
Project | Unit | Typical values |
Appearance | / | White pink wood |
Particle Shaped Ni | / | Spherical |
Density | kg/m³ | 3.7×103 |
Mohs Hardness | / | 6-9 |
Dielectric Constant | Er | 9 |
Dielectric Loss | lgδ | 0.0003 |
Linear expansion coefficient | 1/K | 0.7x10-6 |
Thermal conductivity | W/Kam | 30 |
Thermal Greases/Gels: Improves thermal conductivity and reduces thermal resistance
Thermally Conductive Plastics/Engineering Plastics: Enhances heat dissipation for LED and 5G devices
Ceramic Substrates/Electronic Packaging: Optimizes heat diffusion and improves reliability
Battery Thermal Management Materials: Used in new energy battery cooling systems
High Thermal Conductivity Coatings: Boosts heat dissipation efficiency in coatings
High Loading Rate: Optimized particle gradation enables >85% filling rate, significantly improving thermal conductivity
High Sphericity (≥95%): Excellent flowability for easy processing and dispersion
Low Impurities (Na/K/Fe ≤50ppm): Suitable for high-reliability electronic packaging
Customizable Particle Size (2-50μm): Meets diverse application requirements
High Thermal Conductivity (30-40 W/(m·K)): Effectively enhances heat dissipation
Packaging: 20kg/bag (moisture-proof aluminum foil bag + carton)
Storage: Keep in a cool, dry place to avoid moisture
Strict Quality Control: Complies with electronic-grade material standards
Customizable Particle Size & Surface Modification: Adaptable to various applications
Cost-Effective: Ideal for bulk procurement
Technical Support: Provides formulation optimization recommendations
Electronic Packaging (ICs, LEDs, power devices)
New Energy (EV batteries, energy storage systems)
5G Communications (base station cooling, high-frequency PCBs)
Automotive Electronics (motor control systems, charging piles)
Contact us for customized solutions!
Project | Related indicators | Explain |
Purity | A1.03 | More than 99% |
Impurities | Na,0 | Can be as low as below 300ppm |
Appearance | 0-A1z03 content | Up to 90% or more |
Particle Size Distribution | D50 | Optional within 2um-50um |
Di₀0 | Can be as low as 10um or less | |
Particle size distribution | Adjustments can be made based on the typical distribution according to the requirements of the palace household, including multi-modal distribution and narrow distribution |
Project | Unit | Typical values |
Appearance | / | White pink wood |
Particle Shaped Ni | / | Spherical |
Density | kg/m³ | 3.7×103 |
Mohs Hardness | / | 6-9 |
Dielectric Constant | Er | 9 |
Dielectric Loss | lgδ | 0.0003 |
Linear expansion coefficient | 1/K | 0.7x10-6 |
Thermal conductivity | W/Kam | 30 |