LED Packaging Special Spherical Alumina Powder

Product Description:

This high-purity electronic-grade spherical alumina powder is specifically engineered for LED encapsulation processes. Manufactured using advanced flame spheroidization technology, it features perfect sphericity, high thermal conductivity, and excellent insulation properties. Significantly enhances LED devices' heat dissipation efficiency and luminous stability while extending service life.

Key Advantages:

Superior Thermal Management: Spherical structure enables tighter packing for efficient heat transfer pathways
Enhanced Light Efficiency: Reduces light scattering, improves LED luminous efficiency by 10-15%
High Reliability: Ultra-low ion content prevents chip corrosion risks
Process Compatibility: Excellent fluidity and epoxy resin compatibility for dispensing/molding processes
Custom Solutions: Adjustable particle size and surface modifications (silane/titanate coupling agents)

Typical Applications:

High-power LED packaging: COB/SMD/CSP encapsulation silicone/epoxy filler
UV LED devices: Anti-UV aging additive for encapsulation materials
Mini/Micro LED: Ultra-fine particle size solutions (1-5μm)
LED driver modules: Key filler for thermally conductive potting compounds

Quality Control:

▸ ISO 9001/14001 certified
▸ Complies with ROHS 2.0 & REACH regulations
▸ Batch-specific ICP elemental analysis reports provided

Packaging & Storage:

• Available sizes: /25kg customizable packaging

• Storage: Keep in cool, dry conditions (moisture-proof)
  
  

Why Choose Us?

Trusted supplier for global top 5 LED packaging manufacturers
Free samples and technical support available