Spherical Alumina Powder for IC Packaging

Product Description:

Our high-purity electronic-grade spherical alumina powder is specifically designed for integrated circuit (IC) packaging, offering exceptional thermal conductivity, insulation, and high filling capacity. Produced through advanced high-temperature melting and spheroidization processes, it features superior sphericity (≥95%) and uniform particle size distribution (adjustable D50 2-50μm). This product significantly enhances the thermal management performance and mechanical strength of packaging materials, making it ideal for demanding applications such as high-end semiconductor packaging, 5G communication modules, and power devices.

Applications

Semiconductor Packaging: Used in epoxy molding compounds (EMC), underfill materials, etc., to improve heat dissipation
5G Communication Modules: Suitable for high-frequency substrates and RF device packaging, reducing signal loss
Power Electronics: IGBT and MOSFET packaging, enhancing high-temperature stability
Advanced Packaging Technologies: Fan-out, SiP, and other high-end packaging solutions

Product Advantages

Ultra-high purity (≥99.5%), meeting electronic-grade standards to avoid circuit performance interference from impurities
High sphericity (≥95%), excellent flowability enabling high filling rates (85%+), reducing resin consumption
Outstanding thermal conductivity (30-35 W/m·K), effectively lowering chip junction temperature and improving device reliability
Low dielectric constant (9-10), minimizing high-frequency signal loss for 5G/6G applications
Customizable particle size (2-50μm), adaptable to various packaging process requirements

Packaging & Certifications

Packaging: 10kg/bag (moisture-proof aluminum foil bag + carton), or customized upon request
Certifications: RoHS, REACH, ISO 9001 compliant; ICP test reports available

Why Choose Us?

Specialization in Electronic-Grade Materials: 10+ years of R&D experience in spherical alumina, stable supply to global semiconductor companies
Strict Quality Control: Dust-free production with batch testing to ensure consistency
Technical Support: Provides optimization recommendations to enhance packaging performance

Ideal for Customers Who Need:

High thermal conductivity packaging materials for IC design
5G/automotive electronics module development
Cost-effective alternatives to aluminum nitride (AlN)

(Samples available for testing-contact us today! )

Note: Surface modification (e.g., silane coupling agent treatment) is available upon request to improve resin interfacial bonding.