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High-Frequency Compatibility
Ultra-low dielectric loss (tanδ ≤ 0.0005), minimizing signal attenuation
Stable dielectric properties (ε < 9.8 @ 10GHz), ensuring signal integrity
Superior Thermal Performance
Thermal conductivity ≥30 W/(m·K), effectively reducing heat buildup
High packing density design improves substrate heat dissipation
Precision Manufacturing
Sphericity ≥ 95%, reducing porosity and optimizing flow properties
Adjustable particle size (2-50μm) for diverse substrate processing needs
Rigorous Quality Standards
Purity ≥ 99.5%, heavy metal content ≤10ppm
Compliant with ROHS & ISO 9001, meeting electronic-grade material requirements
5G Communications
High-frequency PCB fillers, antenna substrates, RF module packaging
Automotive Electronics
Millimeter-wave radar substrates, vehicle-mounted high-frequency sensors
Premium Consumer Electronics
Smartphone AiP antennas, Wi-Fi 6/7 modules
Aerospace
Satellite communication devices, high-reliability electronic systems
Custom Solutions: Tailored particle sizes & surface treatments (e.g., silane coupling)
Technical Support: Formula optimization for high-frequency substrates
Stable Supply: 200-ton monthly capacity with batch-to-batch consistency
Standard: 25kg/bag (customizable)
Shipping: Moisture-proof & shock-resistant packaging, global logistics support
Inquiry Tip: Contact us for free samples or Technical Data Sheet (TDS)!
Project | Related indicators | Explain |
Purity | A1.03 | More than 99% |
Impurities | Na,0 | Can be as low as below 300ppm |
Appearance | 0-A1z03 content | Up to 90% or more |
Particle Size Distribution | D50 | Optional within 2um-50um |
Di₀0 | Can be as low as 10um or less | |
Particle size distribution | Adjustments can be made based on the typical distribution according to the requirements of the palace household, including multi-modal distribution and narrow distribution |
Project | Unit | Typical values |
Appearance | / | White pink wood |
Particle Shaped Ni | / | Spherical |
Density | kg/m³ | 3.7×103 |
Mohs Hardness | / | 6-9 |
Dielectric Constant | Er | 9 |
Dielectric Loss | lgδ | 0.0003 |
Linear expansion coefficient | 1/K | 0.7x10-6 |
Thermal conductivity | W/Kam | 30 |
High-Frequency Compatibility
Ultra-low dielectric loss (tanδ ≤ 0.0005), minimizing signal attenuation
Stable dielectric properties (ε < 9.8 @ 10GHz), ensuring signal integrity
Superior Thermal Performance
Thermal conductivity ≥30 W/(m·K), effectively reducing heat buildup
High packing density design improves substrate heat dissipation
Precision Manufacturing
Sphericity ≥ 95%, reducing porosity and optimizing flow properties
Adjustable particle size (2-50μm) for diverse substrate processing needs
Rigorous Quality Standards
Purity ≥ 99.5%, heavy metal content ≤10ppm
Compliant with ROHS & ISO 9001, meeting electronic-grade material requirements
5G Communications
High-frequency PCB fillers, antenna substrates, RF module packaging
Automotive Electronics
Millimeter-wave radar substrates, vehicle-mounted high-frequency sensors
Premium Consumer Electronics
Smartphone AiP antennas, Wi-Fi 6/7 modules
Aerospace
Satellite communication devices, high-reliability electronic systems
Custom Solutions: Tailored particle sizes & surface treatments (e.g., silane coupling)
Technical Support: Formula optimization for high-frequency substrates
Stable Supply: 200-ton monthly capacity with batch-to-batch consistency
Standard: 25kg/bag (customizable)
Shipping: Moisture-proof & shock-resistant packaging, global logistics support
Inquiry Tip: Contact us for free samples or Technical Data Sheet (TDS)!
Project | Related indicators | Explain |
Purity | A1.03 | More than 99% |
Impurities | Na,0 | Can be as low as below 300ppm |
Appearance | 0-A1z03 content | Up to 90% or more |
Particle Size Distribution | D50 | Optional within 2um-50um |
Di₀0 | Can be as low as 10um or less | |
Particle size distribution | Adjustments can be made based on the typical distribution according to the requirements of the palace household, including multi-modal distribution and narrow distribution |
Project | Unit | Typical values |
Appearance | / | White pink wood |
Particle Shaped Ni | / | Spherical |
Density | kg/m³ | 3.7×103 |
Mohs Hardness | / | 6-9 |
Dielectric Constant | Er | 9 |
Dielectric Loss | lgδ | 0.0003 |
Linear expansion coefficient | 1/K | 0.7x10-6 |
Thermal conductivity | W/Kam | 30 |