Microelectronic Packaging Spherical Alumina Pulvis

Product Description :

Hic summus puritatis electronic gradus alumina sphaerica pulveris specialiter destinatur ad applicationes microelectronic pacandas et semiconductores promovendas. Praeclaram sphaericitatem (≥95%), alta conductivity scelerisque (≥30 W/m·K), et radiorum alpha humile (≤0.01 cph/cm²), signanter auget thermopolium perficiendi et fidem sarcinarum materiarum. Specimen pro altitudinis densitatis ambitus (ICs), potentiae modulorum, ductus machinarum, et 5G fasciculorum componentium.

Applications

Semiconductor Packaging : Processus pacandi provectus inter BGA, CSP, et Flip-Chip
Power Electronics : Thermal filler pro IGBT et MOSFET modulorum
DUCTUS Packaging : Improves caloris dissipationem et levem efficientiam machinarum LED
5G Communicationum : Substrates summus frequentia et summus potentiae RF componentium fasciculorum
Electronic Ceramica : HTCC/LTCC substrationes et insulationes stratorum electronicarum

Clavis Commoda

: ≥95%
Sphaericitas perfecta sphaericitas ad meliorem sarcinis densitatis et fluabilitatis
Superior Thermal Conductivity : ≥30 W/m·K scelerisque conductivity ad efficaciorem juncturae temperaturae reductionem
Minimum Alpha Radiation : ≤μ0.01 cph/cm² ad praecavendas errores molles et augendas
particulis processusvarias fabricas aptas et augendae

Packaging & Storage

• Packaging : 25kg/peram (customizable)

• Repono : Copia in frigidis, siccis conditionibus ab humore et contaminantibus

Quid nos elige?

Electronic-Grade Specialisatio : XV annos peritia in materia alta puritate electronic
Strict Quality Control : ISO 9001/IATF 16949 certified
Customization Service : Tailored particulae magnitudo et superficies modificationis optiones
Global Supple : Serviens 100+ semiconductor industriae clientium