Products

Hic es: Home » Products » Mollis composita Silica pulveris » Electronic Grade Flexibile Compositum Silica Powder
Electronic Grade Flexibile Compositum Silica Powder
Electronic Grade Flexibile Compositum Silica Powder Electronic Grade Flexibile Compositum Silica Powder

loading

Electronic Grade Flexibile Compositum Silica Powder

Share to:
facebook sharing button
Twitter sharing button
linea participatio puga
wechat sharing button
sharingin button sharing
pinterest sharing button
whatsapp sharing button
sharethis sharing button
Hoc productum est electronic-gradus molle compositum silicae Micro-pulveris proprie ad curationem applicationum destinata ut summus finis fasciculus electronicus, fasciculus semiconductor, et materia instrumentorum thermarum (TIM). Composuit ex alto puritatis silicae micro-pulveris et materiae flexibiles speciales per processus compositos, humilis accentus, alta fluiditas, et optima conductivity scelerisque, signanter augens calorem dissipationis perficiendi et diuturnum fidem electronicarum machinarum. Apta ad marginem agri ut communicationis 5G, AI chippis, ad sarcinas promovendas (eg, Fan-e, 3D IC).
Availability:
Quantity:

Product Description

Hoc productum est electronic-gradus molle compositum silicae Micro-pulveris proprie ad curationem applicationum destinata ut summus finis fasciculus electronicus, fasciculus semiconductor, et materia instrumentorum thermarum (TIM). Composuit ex alto puritatis silicae micro-pulveris et materiae flexibiles speciales per processus compositos, humilis accentus, alta fluiditas, et optima conductivity scelerisque, signanter augens calorem dissipationis perficiendi et diuturnum fidem electronicarum machinarum. Apta ad marginem agri ut communicationis 5G, AI chippis, ad sarcinas promovendas (eg, Fan-e, 3D IC).


Core Commoda


Humilis vis & summa flexibilitas: Specialis composita technologia minuit fragilitatem et minimizes periculum accentus crepuit in chip packaging.
Maximum Thermal Conductivity & Low Dielectric Damnum: Optimizatio caloris dissipationis pro electronicis cogitationibus firmum signum tradendi servans.
Ultra-Fine & Fluiditas High: Apta microelectronics technologias expediendi tanquam praecisio dispensandi et excudendi.
Humilis Ion Contaminatio: obsequitur cum signis materialibus electronic-gradus.
Mos: subsidia parametri commensurationem pro particula magnitudinis, conductivity scelerisque, modificatione superficiei, etc.

Typical Applications


Provectus semiconductor packaging: Filler pro Fan-e WLP, 3D IC, et Chiplet packaging.
Scelerisque materias interface (TIM): supplementum filler pro CPU/GPU pastes scelerisque et pads scelerisque.
Summus Frequentia Materiae Substratae: Alta frequentia laminarum cupri-arum (CCL) pro 5G antennarum et radarorum millimetris undarum.
Flexibile Electronics: materias packaging ad machinas gestabiles et ostentationes flexibiles.
Electronic Adhesiva: Adhaesiones low-accentus conductivus et materiae underfill.

Cur Product nostrum elige?


Quality Strict Control: Full-process rigorous production obsequens with ISO 9001.
Technical Customization: Custom composition based on customer requirements.
Celeri Responsio: parvas massas sustinet productio iudicii ad copiam magnam scalam.
Global Supple: Facultates partus stabilis.

Packaging & Specifications


  • Vexillum Packaging: 25kg/sacculum (sacculi anti-statici aluminii ffoyle nativus ut requiritur).

  • Condiciones repono: Copia in loco frigido, sicco, humorem evitans et electricitatem staticam.

  • Minimum Order Quantity: Supports 1kg sample trials.



Project

Unitas

Typical values

Aspectus

/

Pulvis albus

Density

kg/m3

2.59×103

Mohs duritia

/

quinque

Dielectric constant

/

5.0(1MHz)

Dielectric damnum

/

0.003(1MHz)

Expansio linearis coefficiens 1/K 3.8×10-6


Pii mollis compositio micro pulveris in specificationes collocari potest et congruere secundum exigentias emptorum quae in his notis habentur:

Project

Indicatores Related

Explicare

Compositio chemica

SiO2 contentus, etc

Habens firmum chemica compositio ut consistent perficientur

Ion immunditia

Na+, Cl -, etc

Potest esse ut humilis ut 5ppm vel infra

Particula Size Distributio

D50

D50=0.5-10 µ m ad libitum

Magnitudo particula distribution

Adaequationes fieri possunt secundum distributiones typicas secundum exigentiam, inter distributiones multimodas, distributiones angustas, etc
Superficies Characteres Hydrophobicity, effusio olei, valoris, etc Diversi agentes functiones functiones eligi possunt secundum mos requisita


+86 18936720888
+86-189-3672-0888

Contact Us

Tel: +86-189-3672-0888
Emai: sales@silic-st.com
whatsapp: LXXXVI 18936720888
Add: No. 8-2, Zhenxing Meridionalis Via, High-tech Development Zonam, Donghai Comitatus, Jiangsu Provinciae

ORIGINAL LINKS

PRODUCTS CATEGORY

PRAECIPIO CONTRACTO
Copyright © 2024 Jiangsu Shengtian Nova Materia Co., Ltd. All Rights Reserved SitemapPrivacy Policy