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Spreyable Industrial mollis compositum Silica pulveris pro Electronic Encapsulation

Spreyable Industrial mollis compositum Silica pulveris pro Electronic Encapsulation

Hoc innovative mollis compositum Silica pulveris est specie machinatum pro electronic encapsulation applications. Utrobsing Advanced Spreyable Technology et Specialized Superficiem immutatio, offert eximia flas et uniformis dispersionem. In materia potest esse directe sprayed onto praecisione electronic components ad formam altus certa insulating tutela layers vel scelerisque interfaces, significantly improving encapsulation efficientiam et fabrica perficientur stabilitatem.

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Product Description

Product Description
hoc innovative mollis compositum Silica pulveris est specie machinatum pro electronic encapsulation applications. Utrobsing Advanced Spreyable Technology et Specialized Superficiem immutatio, offert eximia flas et uniformis dispersionem. In materia potest esse directe sprayed onto praecisione electronic components ad formam altus certa insulating tutela layers vel scelerisque interfaces, significantly improving encapsulation efficientiam et fabrica perficientur stabilitatem.

Product Features

High Spreyability

Ultra-denique particula magnitudine et humilis viscosity enable compatibility cum airless / electrostatic RESPERSIO for Micron-gradu uniformis coating.

Flexibile compositum structuram

Organicum-inorganicis Hybrid system providet resistens flexibilitate ad accommodare scelerisque expansion components.

Superior

Forms dense tutela claustra contra humorem, pulvis et emi ut diu-term fabrica reliability.

ECO amica

Solvent, liberum formula cum nulla vocatur, obsequia cum Rohs et electronics industria signa.

Curre

Minimum-temperatus curing (80-120 ° C) reduces industria consummatio et prohibet scelerisque damnum ad sensitivo components.

Productum commoda

Processus innovation : Simplifies traditum encapsulation per enabling recta integration cum automated productio lineae
Precisione compatibility : perfecte conformis ad universa superficies chips, sensoriis et microcircuitits
Bus libratum euismod : Optimizes velit, scelerisque conductivity et mechanica vires
Wide Compatibility : Works cum epoxy, Silicone et polyimide encapsulation matrices

Applicationem agri

Semiconductor : Chip Superficies Vallis, Wafer-Level Packaging
Consumer Electronics : mobile fabrica PCB praesidio, wearable waterproofing
Automotive Electronics : eco scelerisque interfaces, lorem sensoriis
5G Communications : PCI scutum enim summus frequency PCBBs, RF scelerisque Management
Novum Energy Equipment : PV inverter Vallum, Pugna Module Donec

Project	Unitas	Typical values
Species	/	Alba pulveris
Densitas	kg / m3	2.59 × CIII
Mohs duritiam	/	quinque
Dielectric constant	/	5.0 (1mhz)
Differtur Differt	/	0.003 (1mhz)
Linearibus expansion coefficientem	I / k	3,8 × 10-6

Mollis compositum Silicon microfer potest classificatis in cubits et matched secundum Lorem requisitis secundum sequentes characteres:

Project	Related Indicatores	Explano
Chemical compositionem	Sio2 contentus, etc.	Habens stabile chemical compositionem ut consistent perficientur
Ion impuritas	Na +, Cl -, etc.	Potest esse humilis ut 5PPM vel infra
Particula magnitudine distribution	D50	D50 = 0.5-10 μ M libitum
Particula magnitudine distribution	Particula magnitudine distribution	Referendo potest fieri secundum typicam distributiones quod requiritur, inter multimodal distributiones, angusta distributiones, etc.
Superficies characteres	Hydrophobicity, oleum effusio valorem, etc.	Diversis muneris curatio agentia potest electus secundum elit requisita