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High-Purity Fused Silica Powder for Semiconductors

This product is a high-purity fused silica powder specifically designed for advanced electronics industries such as semiconductors and integrated circuits. Manufactured from high-purity quartz raw materials through high-temperature fusion, ultra-fine grinding, and precision classification processes, it features a purity of ≥99%, controllable particle size distribution (D50 0.5μm-50μm, customizable), low thermal expansion coefficient, excellent insulation properties, and superior chemical stability. It is widely used in critical applications such as semiconductor packaging, ceramic substrates, and electronic adhesives.

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Product Description

Product Overview
041004 This product is a high-purity fused silica powder specifically designed for advanced electronics industries such as semiconductors and integrated circuits. Manufactured from high-purity quartz raw materials through high-temperature fusion, ultra-fine grinding, and precision classification processes, it features a purity of ≥99%, controllable particle size distribution (D50 0.5μm-50μm, customizable), low thermal expansion coefficient, excellent insulation properties, and superior chemical stability. It is widely used in critical applications such as semiconductor packaging, ceramic substrates, and electronic adhesives.

Product Parameters

Item	Specification
Purity	≥99%
Particle Size (D50)	0.5μm-50μm (customizable)
Density	2.2 g/cm³
Melting Point	≈1700ºC
Thermal Expansion Coefficient	0.5×10^-6/ºC (20-300ºC)
Dielectric Constant	3.8-4.2 (1MHz)
Moisture Content	≤0.1%

Product Features

Ultra-High Purity: Extremely low impurity levels (Na, K, Fe, and other metal ions ≤50ppm), meeting stringent semiconductor process requirements.
Precise Particle Size Control: Customizable D50 range of 0.5μm-50μm through advanced classification technology to suit various applications.
Stable Performance: Low thermal expansion and high insulation ensure reliability in high-temperature and high-frequency environments.
Excellent Dispersion: Surface-treated for superior compatibility with epoxy resins, silicone, and other substrates, preventing agglomeration.

Applications

Semiconductor Packaging: Used as a filler in epoxy molding compounds (EMC) to enhance thermal conductivity and mechanical strength.
Electronic Substrates: Acts as a reinforcing phase in ceramic substrates (e.g., AlN, Al₂O₃), reducing sintering temperatures.
Adhesives/Coatings: Functional filler in high-thermal-conductivity insulating adhesives and anti-static coatings.
Precision Ceramics: Additive for high-frequency devices and optical glass.

Packaging & Storage

Packaging: 25 kg/bag, or customized per customer requirements.
Storage: Store in a cool, dry place to avoid moisture absorption. Recommended shelf life: 12 months.

Quality Assurance

Complies with SEMI and RoHS standards, with test reports provided.
Supports sample testing and customized technical solutions to ensure seamless integration with your processes.

Contact us for samples or technical consultation!