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Product Introduction
High-purity spherical silica powder for integrated circuit (IC) packaging is a functional powder material with exceptional purity and sphericity, specifically designed for advanced electronic packaging applications. Produced from high-quality quartz via an advanced flame fusion process, this product boasts purity ≥99.6% and sphericity ≥97%, significantly enhancing the thermal conductivity, flowability, and mechanical strength of IC packaging materials. It is an ideal filler for semiconductor packaging, epoxy molding compounds (EMC), copper-clad laminates (CCL), and related fields.
Product Details
Key Parameters
Purity: ≥99.6% (low sodium, low heavy metal impurities)
Sphericity: ≥97% (smooth surface, excellent flowability)
Particle Size Distribution: D50 5-30μm (customizable)
Dielectric Constant: 3.8-4.2 (@1MHz)
Coefficient of Thermal Expansion (CTE): 0.5×10-6/ºC (matched to silicon chips)
Mohs Hardness: 6-7 (low equipment abrasion)
Key Features
High Reliability: Low α-ray emission (<0.01 cph/cm²), preventing chip soft errors.
Superior Packing Density: Spherical particles minimize voids and enhance encapsulation density.
Thermal Management: High thermal conductivity (1.2-1.5 W/m·K) supports efficient heat dissipation.
Chemical Stability: Resistant to acids, alkalis, and moisture, suitable for harsh processing environments.
Typical Applications
Semiconductor Packaging: EMC, underfill materials, ABF films
Electronic Substrates: High-frequency CCL, ceramic substrates
3D Printing: Additive manufacturing of precision electronic components
High-End Coatings: Wave-transparent coatings for 5G antennas
Quality Control
Certified under ISO 9001/14001
Compliant with ROHS and UL standards
Batch traceability with test reports provided
Service Advantages
Custom Solutions: Tailored particle size and surface modification (e.g., silane coupling agent)
Stable Supply: Reliable production capacity, lead time ≤15 days
Technical Support: Expert advice on packaging material formulation optimization
Company Information:
Jiangsu Shengtian New Materials Co., Ltd. has a technical research and development team focusing on ultra-fine powder materials, and has strong strength in the research and development and production of ultra-fine functional materials, composite materials and related applications,and has become a more influential high-tech enterprise in the ultra-fine functional powder industry.
The company's products include crystalline silicon powder, molten silicon powder, soft composite silicon powder, spherical silicon powder, aluminum oxide powder, ceramic powder, glass powder and other ten categories, nearly 100 kinds of different specifications of products, and has a strong modification, compounding and other follow-up deep processing technology and capabilities. The products are processed by special technology, the production technology is leading and innovative, and the introduction of international technical standards for similar products, widely used in electronic packaging, copper clad plate, ink coating, adhesive, ceramics, precision casting, glass fiber, plastic rubber and other industries, giving its functionality while helping customers reduce costs. And provide the overall application of technology solutions.The company has more than 20 different types of production lines, more than 100 sets of domestic advanced equipment, with an annual output of 50,000 tons. The company adopts professional production and testing equipment and formulates strict production quality control system to conduct all-round control of product quality. All products of the company have passed SGS environmental protection testing, in line with the EU ROHS green environmental protection standards. The company took the lead in the silicon powder industry through the ISO9001 quality management system certification and ISO14001 environmental management system certification, has passed the high-tech product identification. The company's products and solutions have been applied to more than 160 enterprises around the world, including more than 80 customers with stable cooperation for more than 10 years.

Product Introduction
High-purity spherical silica powder for integrated circuit (IC) packaging is a functional powder material with exceptional purity and sphericity, specifically designed for advanced electronic packaging applications. Produced from high-quality quartz via an advanced flame fusion process, this product boasts purity ≥99.6% and sphericity ≥97%, significantly enhancing the thermal conductivity, flowability, and mechanical strength of IC packaging materials. It is an ideal filler for semiconductor packaging, epoxy molding compounds (EMC), copper-clad laminates (CCL), and related fields.
Product Details
Key Parameters
Purity: ≥99.6% (low sodium, low heavy metal impurities)
Sphericity: ≥97% (smooth surface, excellent flowability)
Particle Size Distribution: D50 5-30μm (customizable)
Dielectric Constant: 3.8-4.2 (@1MHz)
Coefficient of Thermal Expansion (CTE): 0.5×10-6/ºC (matched to silicon chips)
Mohs Hardness: 6-7 (low equipment abrasion)
Key Features
High Reliability: Low α-ray emission (<0.01 cph/cm²), preventing chip soft errors.
Superior Packing Density: Spherical particles minimize voids and enhance encapsulation density.
Thermal Management: High thermal conductivity (1.2-1.5 W/m·K) supports efficient heat dissipation.
Chemical Stability: Resistant to acids, alkalis, and moisture, suitable for harsh processing environments.
Typical Applications
Semiconductor Packaging: EMC, underfill materials, ABF films
Electronic Substrates: High-frequency CCL, ceramic substrates
3D Printing: Additive manufacturing of precision electronic components
High-End Coatings: Wave-transparent coatings for 5G antennas
Quality Control
Certified under ISO 9001/14001
Compliant with ROHS and UL standards
Batch traceability with test reports provided
Service Advantages
Custom Solutions: Tailored particle size and surface modification (e.g., silane coupling agent)
Stable Supply: Reliable production capacity, lead time ≤15 days
Technical Support: Expert advice on packaging material formulation optimization
Company Information:
Jiangsu Shengtian New Materials Co., Ltd. has a technical research and development team focusing on ultra-fine powder materials, and has strong strength in the research and development and production of ultra-fine functional materials, composite materials and related applications,and has become a more influential high-tech enterprise in the ultra-fine functional powder industry.
The company's products include crystalline silicon powder, molten silicon powder, soft composite silicon powder, spherical silicon powder, aluminum oxide powder, ceramic powder, glass powder and other ten categories, nearly 100 kinds of different specifications of products, and has a strong modification, compounding and other follow-up deep processing technology and capabilities. The products are processed by special technology, the production technology is leading and innovative, and the introduction of international technical standards for similar products, widely used in electronic packaging, copper clad plate, ink coating, adhesive, ceramics, precision casting, glass fiber, plastic rubber and other industries, giving its functionality while helping customers reduce costs. And provide the overall application of technology solutions.The company has more than 20 different types of production lines, more than 100 sets of domestic advanced equipment, with an annual output of 50,000 tons. The company adopts professional production and testing equipment and formulates strict production quality control system to conduct all-round control of product quality. All products of the company have passed SGS environmental protection testing, in line with the EU ROHS green environmental protection standards. The company took the lead in the silicon powder industry through the ISO9001 quality management system certification and ISO14001 environmental management system certification, has passed the high-tech product identification. The company's products and solutions have been applied to more than 160 enterprises around the world, including more than 80 customers with stable cooperation for more than 10 years.
