Products

You are here: Home » Products » Fused Silica Powder » High-Purity Spherical Silica Powder for IC Packaging
High-Purity Spherical Silica Powder for IC Packaging
High-Purity Spherical Silica Powder for IC Packaging High-Purity Spherical Silica Powder for IC Packaging

loading

High-Purity Spherical Silica Powder for IC Packaging

Share to:
facebook sharing button
twitter sharing button
line sharing button
wechat sharing button
linkedin sharing button
pinterest sharing button
whatsapp sharing button
sharethis sharing button
High-purity spherical silica powder for integrated circuit (IC) packaging is a functional powder material with exceptional purity and sphericity, specifically designed for advanced electronic packaging applications. Produced from high-quality quartz via an advanced flame fusion process, this product boasts purity ≥99.6% and sphericity ≥97%, significantly enhancing the thermal conductivity, flowability, and mechanical strength of IC packaging materials. It is an ideal filler for semiconductor packaging, epoxy molding compounds (EMC), copper-clad laminates (CCL), and related fields.
Availability:
Quantity:

Product Introduction

High-purity spherical silica powder for integrated circuit (IC) packaging is a functional powder material with exceptional purity and sphericity, specifically designed for advanced electronic packaging applications. Produced from high-quality quartz via an advanced flame fusion process, this product boasts purity ≥99.6% and sphericity ≥97%, significantly enhancing the thermal conductivity, flowability, and mechanical strength of IC packaging materials. It is an ideal filler for semiconductor packaging, epoxy molding compounds (EMC), copper-clad laminates (CCL), and related fields.

Product Details

Key Parameters


  • Purity: ≥99.6% (low sodium, low heavy metal impurities)

  • Sphericity: ≥97% (smooth surface, excellent flowability)

  • Particle Size Distribution: D50 5-30μm (customizable)

  • Dielectric Constant: 3.8-4.2 (@1MHz)

  • Coefficient of Thermal Expansion (CTE): 0.5×10-6/ºC (matched to silicon chips)

  • Mohs Hardness: 6-7 (low equipment abrasion)


Key Features


  • High Reliability: Low α-ray emission (<0.01 cph/cm²), preventing chip soft errors.

  • Superior Packing Density: Spherical particles minimize voids and enhance encapsulation density.

  • Thermal Management: High thermal conductivity (1.2-1.5 W/m·K) supports efficient heat dissipation.

  • Chemical Stability: Resistant to acids, alkalis, and moisture, suitable for harsh processing environments.


Typical Applications


  • Semiconductor Packaging: EMC, underfill materials, ABF films

  • Electronic Substrates: High-frequency CCL, ceramic substrates

  • 3D Printing: Additive manufacturing of precision electronic components

  • High-End Coatings: Wave-transparent coatings for 5G antennas


Quality Control


  • Certified under ISO 9001/14001

  • Compliant with ROHS and UL standards

  • Batch traceability with test reports provided

Service Advantages

Custom Solutions: Tailored particle size and surface modification (e.g., silane coupling agent)
Stable Supply: Reliable production capacity, lead time ≤15 days
Technical Support: Expert advice on packaging material formulation optimization





1d23f7996729dafa8e35afec1cbb4f1Company Information:

Jiangsu Shengtian New Materials Co., Ltd. has a technical research and development team focusing on ultra-fine powder materials, and has strong strength in the research and development and production of ultra-fine functional materials, composite materials and related applications,and has become a more influential high-tech enterprise in the ultra-fine functional powder industry.

The company's products include crystalline silicon powder, molten silicon powder, soft composite silicon powder, spherical silicon powder, aluminum oxide powder, ceramic powder, glass powder and other ten categories, nearly 100 kinds of different specifications of products, and has a strong modification, compounding and other follow-up deep processing technology and capabilities. The products are processed by special technology, the production technology is leading and innovative, and the introduction of international technical standards for similar products, widely used in electronic packaging, copper clad plate, ink coating, adhesive, ceramics, precision casting, glass fiber, plastic rubber and other industries, giving its functionality while helping customers reduce costs. And provide the overall application of technology solutions.The company has more than 20 different types of production lines, more than 100 sets of domestic advanced equipment, with an annual output of 50,000 tons. The company adopts professional production and testing equipment and formulates strict production quality control system to conduct all-round control of product quality. All products of the company have passed SGS environmental protection testing, in line with the EU ROHS green environmental protection standards. The company took the lead in the silicon powder industry through the ISO9001 quality management system certification and ISO14001 environmental management system certification, has passed the high-tech product identification. The company's products and solutions have been applied to more than 160 enterprises around the world, including more than 80 customers with stable cooperation for more than 10 years.


Best-Solution4   Best-Solution-1    Best-Solution2


+8618936720888
+86-189-3672-0888

CONTACT US

Tel: +86-189-3672-0888
Emai: sales@silic-st.com
WhatsApp: +8618936720888
Add: No. 8-2, Zhenxing South Road, High-tech Development Zone, Donghai County, Jiangsu Province

QUICK LINKS

PRODUCTS CATEGORY

GET IN TOUCH
Copyright © 2024 Jiangsu Shengtian New Materials Co., Ltd. All Rights Reserved.| SitemapPrivacy Policy