Product Overview
This product is manufactured from high-purity quartz sand through high-temperature fusion and ultra-fine grinding processes. It features a purity of ≥99%, low thermal expansion coefficient, excellent insulation properties, and outstanding chemical stability. Widely used in high-end applications such as electronic packaging, coatings, adhesives, and ceramics, it significantly enhances the performance of composite materials.
Key Specifications
| Parameter | Specification/Feature |
| Purity | ≥99% |
| Particle Size (D50) | 0.5μm-50μm (customizable) |
| Morphology | Angular |
| Mohs Hardness | 7 |
| Density | 2.2 g/cm³ |
| Dielectric Constant | 3.7-3.9 (1MHz) |
Product Advantages
Ultra-High Purity - Extremely low impurity content, suitable for demanding applications in semiconductors and photovoltaics.
Controllable Particle Size - D50 range from 0.5μm to 50μm, customizable grading to meet different process requirements.
Stable Performance - High-temperature resistance (>1600°C), low thermal conductivity, and excellent chemical corrosion resistance.
Surface Modifiable - Optional silane coupling agent treatment to enhance compatibility with resins/rubbers.
Typical Applications
Electronic Materials - IC packaging epoxy molding compounds, copper-clad laminate fillers.
Coatings - Wear-resistant coatings, anti-corrosion coating functional fillers.
Adhesives - Thickening and reinforcing agent for silicone/epoxy adhesives.
Advanced Ceramics - High-frequency ceramic substrates, structural ceramic additives.
Packaging & Shipping
Standard Packaging - 25kg/bag (moisture-proof composite bag).
Shipping - Handled as non-hazardous goods, global logistics supported.
Why Choose Us?
Made-in-China Certified Supplier - Factory-direct sales with quality assurance.
Free Samples & Technical Solutions - Available upon request.
Compliant with RoHS/REACH - Environmentally friendly standards.
Request a Quote Now! Custom particle size solutions available. OEM/ODM cooperation welcomed!
