This product is high-purity spherical silica powder produced using advanced flame fusion technology. It features a purity of ≥99.6%, sphericity ≥97%, and controllable particle size distribution (D50 customizable from 0.5μm to 50μm). It is widely used in high-end electronic packaging, semiconductor encapsulation, 5G communication materials, specialty ceramics, coatings, and other fields, enhancing the performance and reliability of composite materials.
Engineered for advanced electronics manufacturers, precision ceramic fabricators, and specialty material engineers, our high-purity spherical silica powder is a top-tier functional filler produced via state-of-the-art flame fusion technology. With a minimum SiO2 purity of 99.6%, sphericity ≥97%, and fully customizable median particle size (D50 0.5μm to 50μm), this advanced powder is designed to enhance the performance, reliability, and processing efficiency of high-end composite materials. Tailored for demanding industrial environments, our spherical silica powder for electronic packaging and semiconductor applications delivers consistent batch-to-batch quality, meeting the strictest requirements of the global advanced materials industry.
Product Specifications
Indicator
Standard Value
Testing Standard
SiO2 Purity
≥99.6%
GB/T 20020-2013
Sphericity
≥97%
ISO 9276-1:1998
Median Particle Size (D50)
0.5μm-50μm (customizable)
ISO 13320:2009
Density
2.2-2.4 g/cm³
GB/T 5162-2021
Specific Surface Area
1-30 m²/g (adjustable by particle size)
BET Method
Moisture Content
≤0.1%
GB/T 6284-2016
Loss on Ignition
≤0.5%
GB/T 6284-2016
Melting Point
≥1600°C
/
Soluble Metal Ions (Na+, K+)
≤5ppm
/
Key Advantages of Our High-Purity Spherical Silica Powder
Semiconductor-Grade High Purity with Ultra-Low Impurities
Our semiconductor grade spherical silica powder boasts a minimum SiO2 purity of 99.6%, with ultra-low soluble metal ion content (Na+, K+ ≤5ppm) to eliminate signal interference and material degradation in sensitive electronic applications. This ultra-high purity meets the strict material requirements of semiconductor and microelectronic manufacturing, ensuring long-term reliability of end products.
Superior Spherical Structure for Enhanced Processing Performance
With a sphericity rate of ≥97%, our powder delivers exceptional flowability and packing density, significantly reducing the viscosity of polymer and resin systems during processing. The perfect spherical shape minimizes internal stress in composite materials, reduces wear on processing equipment, and enables higher filler loading rates without compromising processing efficiency.
Precision Customizable Particle Size Control
Every batch is strictly graded via laser particle size analysis, with fully customizable D50 particle sizes ranging from 0.5μm to 50μm, and adjustable specific surface area to match your unique application requirements. This precision control ensures consistent performance across prototype development, small-batch production, and large-scale industrial manufacturing.
Exceptional Thermal & Chemical Stability
Our high-purity spherical silica features outstanding thermal stability with a melting point ≥1600°C, low hygroscopicity, and excellent resistance to acid and alkali corrosion. It maintains stable physical and chemical properties in harsh high-temperature, high-humidity, and chemically aggressive environments, making it ideal for demanding industrial applications.
Industrial Applications
Advanced Electronic & Semiconductor Packaging
As the industry-leading spherical silica powder for electronic packaging, it is the core filler for epoxy molding compounds (EMC), chip encapsulants, and underfill materials, reducing the thermal expansion coefficient of composites and improving thermal conductivity and dimensional stability for semiconductor devices.
5G Communication & High-Frequency PCB Substrates
Widely used as a functional filler for high-frequency PCB substrates in 5G communication equipment, it optimizes dielectric properties, reduces signal loss, and improves the thermal stability of substrate materials, ensuring stable high-speed signal transmission in 5G and next-generation communication systems.
LTCC & HTCC Precision Ceramic Manufacturing
It serves as a critical sintering aid and functional filler for Low Temperature Co-fired Ceramic (LTCC) and High Temperature Co-fired Ceramic (HTCC) products, enhancing densification, improving mechanical strength, and optimizing the dielectric properties of precision ceramic components for electronics and automotive applications.
High-Performance Industrial Coatings
Used in high-end anti-corrosion, wear-resistant, and weather-resistant industrial coatings, it improves coating hardness, leveling performance, and scratch resistance, extending the service life of coated surfaces in harsh industrial and marine environments.
FAQ
What is the sphericity rate of your high-purity spherical silica powder?
Our standard high-purity spherical silica powder has a minimum sphericity rate of 97%, with higher sphericity grades available upon request for ultra-high-precision electronic and semiconductor applications.
Can you customize the particle size distribution for specific applications?
Yes, we offer fully customizable D50 particle sizes ranging from 0.5μm to 50μm, with adjustable specific surface area and particle size grading to match your unique formulation, processing, and end-use requirements.
What purity and impurity controls are available for semiconductor-grade applications?
Our semiconductor-grade material features a minimum SiO2 purity of 99.6%, with soluble metal ion content (Na+, K+) controlled to ≤5ppm, and we can provide tighter impurity control specifications for ultra-high-sensitivity microelectronic applications.
How does spherical silica powder improve high-frequency PCB performance?
Our spherical silica powder for 5G substrates optimizes the dielectric constant and dielectric loss of PCB materials, reduces thermal expansion coefficient to improve dimensional stability, and enhances thermal conductivity to dissipate heat generated during high-frequency operation, ensuring stable signal transmission.
Engineered for advanced electronics manufacturers, precision ceramic fabricators, and specialty material engineers, our high-purity spherical silica powder is a top-tier functional filler produced via state-of-the-art flame fusion technology. With a minimum SiO2 purity of 99.6%, sphericity ≥97%, and fully customizable median particle size (D50 0.5μm to 50μm), this advanced powder is designed to enhance the performance, reliability, and processing efficiency of high-end composite materials. Tailored for demanding industrial environments, our spherical silica powder for electronic packaging and semiconductor applications delivers consistent batch-to-batch quality, meeting the strictest requirements of the global advanced materials industry.
Product Specifications
Indicator
Standard Value
Testing Standard
SiO2 Purity
≥99.6%
GB/T 20020-2013
Sphericity
≥97%
ISO 9276-1:1998
Median Particle Size (D50)
0.5μm-50μm (customizable)
ISO 13320:2009
Density
2.2-2.4 g/cm³
GB/T 5162-2021
Specific Surface Area
1-30 m²/g (adjustable by particle size)
BET Method
Moisture Content
≤0.1%
GB/T 6284-2016
Loss on Ignition
≤0.5%
GB/T 6284-2016
Melting Point
≥1600°C
/
Soluble Metal Ions (Na+, K+)
≤5ppm
/
Key Advantages of Our High-Purity Spherical Silica Powder
Semiconductor-Grade High Purity with Ultra-Low Impurities
Our semiconductor grade spherical silica powder boasts a minimum SiO2 purity of 99.6%, with ultra-low soluble metal ion content (Na+, K+ ≤5ppm) to eliminate signal interference and material degradation in sensitive electronic applications. This ultra-high purity meets the strict material requirements of semiconductor and microelectronic manufacturing, ensuring long-term reliability of end products.
Superior Spherical Structure for Enhanced Processing Performance
With a sphericity rate of ≥97%, our powder delivers exceptional flowability and packing density, significantly reducing the viscosity of polymer and resin systems during processing. The perfect spherical shape minimizes internal stress in composite materials, reduces wear on processing equipment, and enables higher filler loading rates without compromising processing efficiency.
Precision Customizable Particle Size Control
Every batch is strictly graded via laser particle size analysis, with fully customizable D50 particle sizes ranging from 0.5μm to 50μm, and adjustable specific surface area to match your unique application requirements. This precision control ensures consistent performance across prototype development, small-batch production, and large-scale industrial manufacturing.
Exceptional Thermal & Chemical Stability
Our high-purity spherical silica features outstanding thermal stability with a melting point ≥1600°C, low hygroscopicity, and excellent resistance to acid and alkali corrosion. It maintains stable physical and chemical properties in harsh high-temperature, high-humidity, and chemically aggressive environments, making it ideal for demanding industrial applications.
Industrial Applications
Advanced Electronic & Semiconductor Packaging
As the industry-leading spherical silica powder for electronic packaging, it is the core filler for epoxy molding compounds (EMC), chip encapsulants, and underfill materials, reducing the thermal expansion coefficient of composites and improving thermal conductivity and dimensional stability for semiconductor devices.
5G Communication & High-Frequency PCB Substrates
Widely used as a functional filler for high-frequency PCB substrates in 5G communication equipment, it optimizes dielectric properties, reduces signal loss, and improves the thermal stability of substrate materials, ensuring stable high-speed signal transmission in 5G and next-generation communication systems.
LTCC & HTCC Precision Ceramic Manufacturing
It serves as a critical sintering aid and functional filler for Low Temperature Co-fired Ceramic (LTCC) and High Temperature Co-fired Ceramic (HTCC) products, enhancing densification, improving mechanical strength, and optimizing the dielectric properties of precision ceramic components for electronics and automotive applications.
High-Performance Industrial Coatings
Used in high-end anti-corrosion, wear-resistant, and weather-resistant industrial coatings, it improves coating hardness, leveling performance, and scratch resistance, extending the service life of coated surfaces in harsh industrial and marine environments.
FAQ
What is the sphericity rate of your high-purity spherical silica powder?
Our standard high-purity spherical silica powder has a minimum sphericity rate of 97%, with higher sphericity grades available upon request for ultra-high-precision electronic and semiconductor applications.
Can you customize the particle size distribution for specific applications?
Yes, we offer fully customizable D50 particle sizes ranging from 0.5μm to 50μm, with adjustable specific surface area and particle size grading to match your unique formulation, processing, and end-use requirements.
What purity and impurity controls are available for semiconductor-grade applications?
Our semiconductor-grade material features a minimum SiO2 purity of 99.6%, with soluble metal ion content (Na+, K+) controlled to ≤5ppm, and we can provide tighter impurity control specifications for ultra-high-sensitivity microelectronic applications.
How does spherical silica powder improve high-frequency PCB performance?
Our spherical silica powder for 5G substrates optimizes the dielectric constant and dielectric loss of PCB materials, reduces thermal expansion coefficient to improve dimensional stability, and enhances thermal conductivity to dissipate heat generated during high-frequency operation, ensuring stable signal transmission.
