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For electronic component manufacturers, advanced material formulators and industrial production enterprises, our Hydrophilic Fused Silica Powder is a high-performance functional filler with industry-leading modification technology. Produced from high-purity quartz sand through high-temperature fusion, ultra-fine grinding and professional surface hydrophilic modification, this product features a purity of ≥99%, fully controllable particle size distribution, high surface activity and excellent dispersibility. It is a core raw material for high-end electronic packaging, high-performance coatings, industrial adhesives and advanced ceramics, providing reliable material support for global industrial enterprises to improve product performance and optimize production processes.
Parameter | Unit | Standard Value |
Silicon Dioxide (SiO₂) Content | % | ≥99 |
Particle Size (D50) | μm | 0.5-50 (customizable) |
Appearance | / | White ultra-fine powder |
Density | g/cm³ | 2.2 |
Moh's Hardness | / | 6-7 |
Thermal Expansion Coefficient | 1/℃ | 0.5×10⁻⁶ (20-300℃) |
Dielectric Constant (1MHz) | / | 3.8-4.2 |
Hydrophilic Contact Angle | ° | <15 |
Standard Shelf Life | Month | 12 |
Our high-purity fused silica powder has a SiO₂ content of ≥99% with extremely low impurity levels, effectively avoiding adverse effects of trace impurities on the electrical and mechanical properties of finished products. Strict production control ensures stable chemical properties, maintaining excellent performance in harsh environments such as high temperature and high pressure, fully adapting to high-precision industrial production scenarios.
The D50 particle size of our hydrophilic fused silica powder covers 0.5-50μm, with fully customizable particle size distribution according to your application requirements. Precise particle size control meets the diverse needs of different production processes, from ultra-fine filling of electronic packaging to performance modification of high-performance coatings, providing targeted material solutions for your production.
Through professional surface hydrophilic modification, the product has a contact angle of less than 15°, with excellent compatibility with water-based and polar solvent systems. It can be uniformly dispersed in various formula systems without agglomeration and sedimentation, effectively improving formula uniformity, reducing production difficulty and enhancing the stability of finished products.
The product has an ultra-low thermal expansion coefficient, excellent high-temperature resistance and outstanding electrical insulation properties. It can effectively reduce the thermal stress of composite materials, improve the dimensional stability and insulation reliability of products, and is an ideal filler for high-end electronic materials and high-performance industrial products.
As the preferred fused silica powder for electronic packaging, this product is widely used in IC packaging, epoxy resin filling and semiconductor sealant production. It effectively reduces the thermal expansion coefficient of packaging materials, improves insulation performance and dimensional stability, extends the service life of electronic components, and meets the stringent requirements of the semiconductor industry for raw materials.
In industrial coatings and high-end inks, this product significantly improves the wear resistance, weather resistance and leveling performance of the coating film. Its excellent hydrophilicity ensures uniform dispersion in water-based coatings, making it an ideal functional additive for environmentally friendly industrial coatings, anti-corrosion coatings and high-precision printing inks.
When added to industrial adhesives and sealants, the product significantly enhances the thermal and electrical insulation properties of the material, reduces thermal stress during use, and improves the bonding strength and aging resistance of the adhesive layer. It is widely used in the production of electronic adhesives, structural adhesives and industrial sealants.
In precision ceramic and polymer composite production, this product can be used as a sintering aid and reinforcing filler, reducing the sintering temperature of ceramics, improving the mechanical strength and dimensional stability of composite materials, and is suitable for the production of high-performance precision ceramics and fiber-reinforced composite materials.
Our hydrophilic fused silica powder is treated with professional surface hydrophilic modification, with a contact angle of less than 15°. It has excellent compatibility with water-based and polar solvent systems, achieving uniform dispersion without agglomeration, effectively solving the dispersion problem of powder in water-based formulas.
Yes. The standard D50 particle size range of our product is 0.5-50μm, and we can provide fully customized particle size distribution solutions according to your specific industrial application and production process requirements.
All our products have passed SGS environmental protection testing, comply with EU ROHS green environmental protection standards, and our production has passed ISO9001 and ISO14001 certification, fully meeting the quality and compliance requirements of global industrial enterprises.
We recommend storing the product in a cool, dry and ventilated environment to avoid moisture absorption. The standard packaging is 25kg/bag, and we can also provide customized packaging solutions according to your needs. Under proper storage conditions, the shelf life of the product is 12 months.
For electronic component manufacturers, advanced material formulators and industrial production enterprises, our Hydrophilic Fused Silica Powder is a high-performance functional filler with industry-leading modification technology. Produced from high-purity quartz sand through high-temperature fusion, ultra-fine grinding and professional surface hydrophilic modification, this product features a purity of ≥99%, fully controllable particle size distribution, high surface activity and excellent dispersibility. It is a core raw material for high-end electronic packaging, high-performance coatings, industrial adhesives and advanced ceramics, providing reliable material support for global industrial enterprises to improve product performance and optimize production processes.
Parameter | Unit | Standard Value |
Silicon Dioxide (SiO₂) Content | % | ≥99 |
Particle Size (D50) | μm | 0.5-50 (customizable) |
Appearance | / | White ultra-fine powder |
Density | g/cm³ | 2.2 |
Moh's Hardness | / | 6-7 |
Thermal Expansion Coefficient | 1/℃ | 0.5×10⁻⁶ (20-300℃) |
Dielectric Constant (1MHz) | / | 3.8-4.2 |
Hydrophilic Contact Angle | ° | <15 |
Standard Shelf Life | Month | 12 |
Our high-purity fused silica powder has a SiO₂ content of ≥99% with extremely low impurity levels, effectively avoiding adverse effects of trace impurities on the electrical and mechanical properties of finished products. Strict production control ensures stable chemical properties, maintaining excellent performance in harsh environments such as high temperature and high pressure, fully adapting to high-precision industrial production scenarios.
The D50 particle size of our hydrophilic fused silica powder covers 0.5-50μm, with fully customizable particle size distribution according to your application requirements. Precise particle size control meets the diverse needs of different production processes, from ultra-fine filling of electronic packaging to performance modification of high-performance coatings, providing targeted material solutions for your production.
Through professional surface hydrophilic modification, the product has a contact angle of less than 15°, with excellent compatibility with water-based and polar solvent systems. It can be uniformly dispersed in various formula systems without agglomeration and sedimentation, effectively improving formula uniformity, reducing production difficulty and enhancing the stability of finished products.
The product has an ultra-low thermal expansion coefficient, excellent high-temperature resistance and outstanding electrical insulation properties. It can effectively reduce the thermal stress of composite materials, improve the dimensional stability and insulation reliability of products, and is an ideal filler for high-end electronic materials and high-performance industrial products.
As the preferred fused silica powder for electronic packaging, this product is widely used in IC packaging, epoxy resin filling and semiconductor sealant production. It effectively reduces the thermal expansion coefficient of packaging materials, improves insulation performance and dimensional stability, extends the service life of electronic components, and meets the stringent requirements of the semiconductor industry for raw materials.
In industrial coatings and high-end inks, this product significantly improves the wear resistance, weather resistance and leveling performance of the coating film. Its excellent hydrophilicity ensures uniform dispersion in water-based coatings, making it an ideal functional additive for environmentally friendly industrial coatings, anti-corrosion coatings and high-precision printing inks.
When added to industrial adhesives and sealants, the product significantly enhances the thermal and electrical insulation properties of the material, reduces thermal stress during use, and improves the bonding strength and aging resistance of the adhesive layer. It is widely used in the production of electronic adhesives, structural adhesives and industrial sealants.
In precision ceramic and polymer composite production, this product can be used as a sintering aid and reinforcing filler, reducing the sintering temperature of ceramics, improving the mechanical strength and dimensional stability of composite materials, and is suitable for the production of high-performance precision ceramics and fiber-reinforced composite materials.
Our hydrophilic fused silica powder is treated with professional surface hydrophilic modification, with a contact angle of less than 15°. It has excellent compatibility with water-based and polar solvent systems, achieving uniform dispersion without agglomeration, effectively solving the dispersion problem of powder in water-based formulas.
Yes. The standard D50 particle size range of our product is 0.5-50μm, and we can provide fully customized particle size distribution solutions according to your specific industrial application and production process requirements.
All our products have passed SGS environmental protection testing, comply with EU ROHS green environmental protection standards, and our production has passed ISO9001 and ISO14001 certification, fully meeting the quality and compliance requirements of global industrial enterprises.
We recommend storing the product in a cool, dry and ventilated environment to avoid moisture absorption. The standard packaging is 25kg/bag, and we can also provide customized packaging solutions according to your needs. Under proper storage conditions, the shelf life of the product is 12 months.