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Our High Purity Spherical Silica Powder is a top-tier functional filler manufactured via advanced flame fusion technology, with strict process control to achieve ultra-high SiO₂ purity of ≥99.6% and a near-perfect spherical structure with sphericity ≥97%. With a precisely customizable particle size range (D50 0.5-50μm), this 99.6% spherical silica powder delivers exceptional fluidity, ultra-low thermal expansion coefficient, and outstanding electrical insulation, making it an indispensable material for high-end industrial manufacturing and high-performance composite production. Designed for industrial clients with strict performance requirements, our spherical silica filler for semiconductors undergoes full batch testing with Malvern laser particle size analyzers, with each shipment accompanied by a Certificate of Analysis (COA) to guarantee consistent parameter compliance.
Parameter | Standard Specification |
SiO₂ Purity | ≥99.6% |
Particle Size (D50) | 0.5μm-50μm (fully customizable) |
Sphericity | ≥97% |
Whiteness | ≥92% |
Density | 2.65 g/cm³ |
Mohs Hardness | 7 |
Volume Resistivity | >10⊃1;⁶ Ω·cm |
Thermal Expansion Coefficient | 0.5×10⁻⁶ /K |
The uniform spherical structure of our high sphericity silica powder minimizes inter-particle friction, enabling a filling rate of up to 80%+ in resin and plastic systems while significantly lowering mixed viscosity. This optimizes processing performance and reduces production costs for manufacturing clients.
This flame fusion spherical silica powder enhances the hardness, wear resistance, and impact strength of composite materials, with exceptional acid and alkali corrosion resistance. Its ultra-low thermal expansion coefficient ensures dimensional stability even in extreme temperature fluctuations, suitable for harsh industrial environments.
With ultra-high volume resistivity, our spherical silica powder for electronic encapsulation delivers excellent insulation and low dielectric loss, fully meeting the strict requirements of high-voltage and high-frequency electronic applications.
We offer professional particle size grading and surface modification (silane coupling agent treatment) to tailor our 0.5-50μm spherical silica powder to your specific formulation and application needs.
Widely used in IC chip encapsulants, epoxy molding compounds (EMC), and copper-clad laminate (CCL) fillers, serving as a core material for advanced electronic manufacturing.
Reduces dielectric loss in high-frequency substrates, ensuring stable signal transmission for 5G communication equipment.
Enhances the wear resistance, weather resistance, and surface gloss of premium coatings for industrial and automotive applications.
Acts as a sintering aid for precision ceramics to improve densification, and optimizes the rheology and mechanical strength of high-grade adhesives and sealants.
Our standard minimum order quantity for bulk production is 1 ton, while free pre-production samples are available for industrial buyers to verify performance before formal orders.
Yes. We support full customization of particle size distribution (D50 0.5-50μm), as well as professional surface modification via silane coupling agent treatment to match your formulation requirements.
Our production facility is fully compliant with the ISO 9001 quality management system, and all products have passed SGS testing, meeting EU ROHS environmental protection standards.
Standard lead time is 15-30 days, which can be adjusted according to your order volume and customization requirements.
Our High Purity Spherical Silica Powder is a top-tier functional filler manufactured via advanced flame fusion technology, with strict process control to achieve ultra-high SiO₂ purity of ≥99.6% and a near-perfect spherical structure with sphericity ≥97%. With a precisely customizable particle size range (D50 0.5-50μm), this 99.6% spherical silica powder delivers exceptional fluidity, ultra-low thermal expansion coefficient, and outstanding electrical insulation, making it an indispensable material for high-end industrial manufacturing and high-performance composite production. Designed for industrial clients with strict performance requirements, our spherical silica filler for semiconductors undergoes full batch testing with Malvern laser particle size analyzers, with each shipment accompanied by a Certificate of Analysis (COA) to guarantee consistent parameter compliance.
Parameter | Standard Specification |
SiO₂ Purity | ≥99.6% |
Particle Size (D50) | 0.5μm-50μm (fully customizable) |
Sphericity | ≥97% |
Whiteness | ≥92% |
Density | 2.65 g/cm³ |
Mohs Hardness | 7 |
Volume Resistivity | >10⊃1;⁶ Ω·cm |
Thermal Expansion Coefficient | 0.5×10⁻⁶ /K |
The uniform spherical structure of our high sphericity silica powder minimizes inter-particle friction, enabling a filling rate of up to 80%+ in resin and plastic systems while significantly lowering mixed viscosity. This optimizes processing performance and reduces production costs for manufacturing clients.
This flame fusion spherical silica powder enhances the hardness, wear resistance, and impact strength of composite materials, with exceptional acid and alkali corrosion resistance. Its ultra-low thermal expansion coefficient ensures dimensional stability even in extreme temperature fluctuations, suitable for harsh industrial environments.
With ultra-high volume resistivity, our spherical silica powder for electronic encapsulation delivers excellent insulation and low dielectric loss, fully meeting the strict requirements of high-voltage and high-frequency electronic applications.
We offer professional particle size grading and surface modification (silane coupling agent treatment) to tailor our 0.5-50μm spherical silica powder to your specific formulation and application needs.
Widely used in IC chip encapsulants, epoxy molding compounds (EMC), and copper-clad laminate (CCL) fillers, serving as a core material for advanced electronic manufacturing.
Reduces dielectric loss in high-frequency substrates, ensuring stable signal transmission for 5G communication equipment.
Enhances the wear resistance, weather resistance, and surface gloss of premium coatings for industrial and automotive applications.
Acts as a sintering aid for precision ceramics to improve densification, and optimizes the rheology and mechanical strength of high-grade adhesives and sealants.
Our standard minimum order quantity for bulk production is 1 ton, while free pre-production samples are available for industrial buyers to verify performance before formal orders.
Yes. We support full customization of particle size distribution (D50 0.5-50μm), as well as professional surface modification via silane coupling agent treatment to match your formulation requirements.
Our production facility is fully compliant with the ISO 9001 quality management system, and all products have passed SGS testing, meeting EU ROHS environmental protection standards.
Standard lead time is 15-30 days, which can be adjusted according to your order volume and customization requirements.