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Our low thermal expansion fused silica micro powder is a high-performance amorphous silica filler engineered for industrial manufacturers requiring extreme dimensional stability, high temperature resistance, and exceptional material purity. Produced via a fully enclosed production line compliant with ISO9001-2015 standards, this product is manufactured through high-purity quartz sand arc melting, ultrasonic jet milling, multi-stage precision classification, and magnetic iron removal, ensuring batch-to-batch consistency for large-scale industrial production.
With an ultra-low coefficient of thermal expansion (CTE) of only 0.5×10^-6 /ºC (25-300ºC) — just 1/5 that of conventional silica powder — this material drastically improves the dimensional stability of composite materials even under extreme temperature fluctuations. It is the preferred high-performance filler for industrial sectors with strict requirements for thermal stability, high purity, and high-frequency performance, supporting full customization of particle size and specifications to meet unique production needs.
Parameter | Technical Specification |
|---|---|
Purity | ≥99% (Measured: 99.2%-99.8%) |
Particle Size (D50) | 0.5μm-50μm (Custom grading available) |
Thermal Expansion Coefficient | 0.5×10-6/ºC (25-300ºC) |
Dielectric Constant | 3.8-4.1 (at 1MHz) |
Mohs Hardness | 7 |
Appearance | White ultrafine powder, free of visible impurities |
Moisture Content | ≤0.1% |
The industry-leading low CTE minimizes dimensional changes of composite materials under extreme temperature shifts, eliminating warping and deformation that plague conventional silica fillers, critical for precision components.
With 99%+ SiO2 purity and total Fe, K, Na, and other metal ion content below 100ppm, this product eliminates ionic contamination risks for high-sensitivity electronic and aerospace applications.
Strictly graded via laser particle analyzer, the particle size is fully customizable within the 0.5-50μm range, with adjustable D10/D50/D90 specifications to match unique processing and formulation requirements.
With dielectric loss below 0.001 in high-frequency environments, it is an ideal filler for 5G communication components, maintaining stable signal transmission with minimal interference.
With a softening point above 1600ºC, it maintains stable performance in high-temperature sintering and thermal cycling processes, suitable for harsh aerospace and industrial operating conditions.
Aerospace heat-resistant coatings: Enhances thermal stability and dimensional retention of aerospace coating systems under extreme temperature fluctuations
High-end electronic packaging materials: Ideal for IC substrates and EMC encapsulants requiring high purity and low ionic contamination
5G high-frequency PCB manufacturing: Delivers stable dielectric performance for high-frequency circuit board fillers
Precision optical glass additives: Improves thermal stability and optical consistency of precision optical components
Special ceramic sintering aids: Enhances sintering performance and high-temperature resistance of advanced ceramic materials
Yes, we offer full customization of D10, D50, and D90 particle size specifications within the 0.5μm to 50μm range, with strict laser grading to ensure consistent distribution across every batch.
We offer free sample testing and dedicated technical consultation to help industrial clients validate product performance in their specific formulations and production processes.
Our production is fully compliant with ISO9001-2015 standards, and all products have passed SGS environmental testing, meeting EU ROHS green environmental protection requirements.
Our standard packaging is 25kg per bag, with fully customizable packaging options available to meet your storage and production handling needs.
Our low thermal expansion fused silica micro powder is a high-performance amorphous silica filler engineered for industrial manufacturers requiring extreme dimensional stability, high temperature resistance, and exceptional material purity. Produced via a fully enclosed production line compliant with ISO9001-2015 standards, this product is manufactured through high-purity quartz sand arc melting, ultrasonic jet milling, multi-stage precision classification, and magnetic iron removal, ensuring batch-to-batch consistency for large-scale industrial production.
With an ultra-low coefficient of thermal expansion (CTE) of only 0.5×10^-6 /ºC (25-300ºC) — just 1/5 that of conventional silica powder — this material drastically improves the dimensional stability of composite materials even under extreme temperature fluctuations. It is the preferred high-performance filler for industrial sectors with strict requirements for thermal stability, high purity, and high-frequency performance, supporting full customization of particle size and specifications to meet unique production needs.
Parameter | Technical Specification |
|---|---|
Purity | ≥99% (Measured: 99.2%-99.8%) |
Particle Size (D50) | 0.5μm-50μm (Custom grading available) |
Thermal Expansion Coefficient | 0.5×10-6/ºC (25-300ºC) |
Dielectric Constant | 3.8-4.1 (at 1MHz) |
Mohs Hardness | 7 |
Appearance | White ultrafine powder, free of visible impurities |
Moisture Content | ≤0.1% |
The industry-leading low CTE minimizes dimensional changes of composite materials under extreme temperature shifts, eliminating warping and deformation that plague conventional silica fillers, critical for precision components.
With 99%+ SiO2 purity and total Fe, K, Na, and other metal ion content below 100ppm, this product eliminates ionic contamination risks for high-sensitivity electronic and aerospace applications.
Strictly graded via laser particle analyzer, the particle size is fully customizable within the 0.5-50μm range, with adjustable D10/D50/D90 specifications to match unique processing and formulation requirements.
With dielectric loss below 0.001 in high-frequency environments, it is an ideal filler for 5G communication components, maintaining stable signal transmission with minimal interference.
With a softening point above 1600ºC, it maintains stable performance in high-temperature sintering and thermal cycling processes, suitable for harsh aerospace and industrial operating conditions.
Aerospace heat-resistant coatings: Enhances thermal stability and dimensional retention of aerospace coating systems under extreme temperature fluctuations
High-end electronic packaging materials: Ideal for IC substrates and EMC encapsulants requiring high purity and low ionic contamination
5G high-frequency PCB manufacturing: Delivers stable dielectric performance for high-frequency circuit board fillers
Precision optical glass additives: Improves thermal stability and optical consistency of precision optical components
Special ceramic sintering aids: Enhances sintering performance and high-temperature resistance of advanced ceramic materials
Yes, we offer full customization of D10, D50, and D90 particle size specifications within the 0.5μm to 50μm range, with strict laser grading to ensure consistent distribution across every batch.
We offer free sample testing and dedicated technical consultation to help industrial clients validate product performance in their specific formulations and production processes.
Our production is fully compliant with ISO9001-2015 standards, and all products have passed SGS environmental testing, meeting EU ROHS green environmental protection requirements.
Our standard packaging is 25kg per bag, with fully customizable packaging options available to meet your storage and production handling needs.