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High-Purity, Low-Impurity Industrial-Grade Spherical Silica Micro Powder
High-Purity, Low-Impurity Industrial-Grade Spherical Silica Micro Powder High-Purity, Low-Impurity Industrial-Grade Spherical Silica Micro Powder

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High-Purity, Low-Impurity Industrial-Grade Spherical Silica Micro Powder

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High-Purity, Low-Impurity Industrial-Grade Spherical Silica Micro Powder is a high-performance inorganic non-metallic material manufactured through advanced processing technology. With its unique spherical structure, ultra-high purity (SiO2 content ≥99.6%), and extremely low impurity levels, the product exhibits exceptional flowability, dispersibility, thermal stability, and chemical stability. It is widely used in electronic packaging, high-end coatings, polymer composites, ceramics, adhesives, and other industrial fields, serving as an ideal functional filler to enhance product performance.
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Spherical silica powder

High-Purity, Low-Impurity Industrial-Grade Spherical Silica Micro Powder is a high-performance inorganic non-metallic material manufactured through advanced processing technology. With its unique spherical structure, ultra-high purity (SiO2 content ≥99.6%), and extremely low impurity levels, the product exhibits exceptional flowability, dispersibility, thermal stability, and chemical stability. It is widely used in electronic packaging, high-end coatings, polymer composites, ceramics, adhesives, and other industrial fields, serving as an ideal functional filler to enhance product performance.

Key Features


High Purity & Low Impurities

  • SiO2 purity ≥99.6%, with impurity elements (e.g., Fe, Na, Cl-) controlled at ppm levels, ensuring material stability and reliability.


  • Spherical Morphology

    • Low coefficient of thermal expansion (CTE) and high-temperature resistance (up to 1600°C), ideal for high-temperature packaging and composite materials.


    • Chemical Inertness

    • Resistant to acids, alkalis, and corrosion, compatible with most resin and plastic systems, extending end-product lifespan.

    • Perfect spherical particles with uniform size distribution (customizable between 0.5-50μm), enhancing packing density and flowability while reducing friction.

    • Superior Thermal Properties


Product Application

  • Electronic Packaging: Integrated circuits (IC), chip encapsulation, enhancing thermal conductivity and mechanical strength.

  • Polymer Composites: Epoxy resin and silicone modification, improving crack resistance and dimensional stability.

  • High-End Coatings & Inks: Enhancing coating hardness, wear resistance, and surface gloss.

    Customization Service
    Customizable particle size distribution and surface treatments (e.g., hydrophobic modification) for diverse industrial applications.


Project

Unit

Typical values

Appearance

/

White powder

Density

kg/m3

2.59×103

Mohs hardness

/

five

Dielectric constant

/

5.0(1MHz)

Dielectric loss

/

0.003(1MHz)

Linear expansion coefficient 1/K 3.8×10-6


Soft composite silicon micro powder can be classified into specifications and matched according to customer requirements based on the following characteristics:

Project

Related indicators

Explain

Chemical Composition

SiO2 content, etc

Having a stable chemical composition to ensure consistent performance

Ion Impurity

Na+, Cl -, etc

Can be as low as 5ppm or below

Particle Size Distribution

D50

D50=0.5-10 µ m optional

Particle size distribution

Adjustments can be made based on typical distributions as required, including multimodal distributions, narrow distributions, etc
Surface Characteristics Hydrophobicity, oil absorption value, etc Different functional treatment agents can be selected according to customer requirements


+8618168153275
+86-181-6815-3275

CONTACT US

Tel: +86-181-6815-3275
Emai: sales@silic-st.com
WhatsApp: +8618168153275
Add: No. 8-2, Zhenxing South Road, High-tech Development Zone, Donghai County, Jiangsu Province

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