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Spherical silica powder
High-Purity, Low-Impurity Industrial-Grade Spherical Silica Micro Powder is a high-performance inorganic non-metallic material manufactured through advanced processing technology. With its unique spherical structure, ultra-high purity (SiO2 content ≥99.6%), and extremely low impurity levels, the product exhibits exceptional flowability, dispersibility, thermal stability, and chemical stability. It is widely used in electronic packaging, high-end coatings, polymer composites, ceramics, adhesives, and other industrial fields, serving as an ideal functional filler to enhance product performance.
High Purity & Low Impurities
SiO2 purity ≥99.6%, with impurity elements (e.g., Fe, Na, Cl-) controlled at ppm levels, ensuring material stability and reliability.
Spherical Morphology
Low coefficient of thermal expansion (CTE) and high-temperature resistance (up to 1600°C), ideal for high-temperature packaging and composite materials.
Chemical Inertness
Resistant to acids, alkalis, and corrosion, compatible with most resin and plastic systems, extending end-product lifespan.
Perfect spherical particles with uniform size distribution (customizable between 0.5-50μm), enhancing packing density and flowability while reducing friction.
Superior Thermal Properties
Product Application
Electronic Packaging: Integrated circuits (IC), chip encapsulation, enhancing thermal conductivity and mechanical strength.
Polymer Composites: Epoxy resin and silicone modification, improving crack resistance and dimensional stability.
High-End Coatings & Inks: Enhancing coating hardness, wear resistance, and surface gloss.
Customization Service
Customizable particle size distribution and surface treatments (e.g., hydrophobic modification) for diverse industrial applications.
Project | Unit | Typical values |
Appearance | / | White powder |
Density | kg/m3 | 2.59×103 |
Mohs hardness | / | five |
Dielectric constant | / | 5.0(1MHz) |
Dielectric loss | / | 0.003(1MHz) |
Linear expansion coefficient | 1/K | 3.8×10-6 |
Soft composite silicon micro powder can be classified into specifications and matched according to customer requirements based on the following characteristics:
Project | Related indicators | Explain |
Chemical Composition | SiO2 content, etc | Having a stable chemical composition to ensure consistent performance |
Ion Impurity | Na+, Cl -, etc | Can be as low as 5ppm or below |
Particle Size Distribution | D50 | D50=0.5-10 µ m optional |
Particle size distribution | Adjustments can be made based on typical distributions as required, including multimodal distributions, narrow distributions, etc | |
Surface Characteristics | Hydrophobicity, oil absorption value, etc | Different functional treatment agents can be selected according to customer requirements |
Spherical silica powder
High-Purity, Low-Impurity Industrial-Grade Spherical Silica Micro Powder is a high-performance inorganic non-metallic material manufactured through advanced processing technology. With its unique spherical structure, ultra-high purity (SiO2 content ≥99.6%), and extremely low impurity levels, the product exhibits exceptional flowability, dispersibility, thermal stability, and chemical stability. It is widely used in electronic packaging, high-end coatings, polymer composites, ceramics, adhesives, and other industrial fields, serving as an ideal functional filler to enhance product performance.
High Purity & Low Impurities
SiO2 purity ≥99.6%, with impurity elements (e.g., Fe, Na, Cl-) controlled at ppm levels, ensuring material stability and reliability.
Spherical Morphology
Low coefficient of thermal expansion (CTE) and high-temperature resistance (up to 1600°C), ideal for high-temperature packaging and composite materials.
Chemical Inertness
Resistant to acids, alkalis, and corrosion, compatible with most resin and plastic systems, extending end-product lifespan.
Perfect spherical particles with uniform size distribution (customizable between 0.5-50μm), enhancing packing density and flowability while reducing friction.
Superior Thermal Properties
Product Application
Electronic Packaging: Integrated circuits (IC), chip encapsulation, enhancing thermal conductivity and mechanical strength.
Polymer Composites: Epoxy resin and silicone modification, improving crack resistance and dimensional stability.
High-End Coatings & Inks: Enhancing coating hardness, wear resistance, and surface gloss.
Customization Service
Customizable particle size distribution and surface treatments (e.g., hydrophobic modification) for diverse industrial applications.
Project | Unit | Typical values |
Appearance | / | White powder |
Density | kg/m3 | 2.59×103 |
Mohs hardness | / | five |
Dielectric constant | / | 5.0(1MHz) |
Dielectric loss | / | 0.003(1MHz) |
Linear expansion coefficient | 1/K | 3.8×10-6 |
Soft composite silicon micro powder can be classified into specifications and matched according to customer requirements based on the following characteristics:
Project | Related indicators | Explain |
Chemical Composition | SiO2 content, etc | Having a stable chemical composition to ensure consistent performance |
Ion Impurity | Na+, Cl -, etc | Can be as low as 5ppm or below |
Particle Size Distribution | D50 | D50=0.5-10 µ m optional |
Particle size distribution | Adjustments can be made based on typical distributions as required, including multimodal distributions, narrow distributions, etc | |
Surface Characteristics | Hydrophobicity, oil absorption value, etc | Different functional treatment agents can be selected according to customer requirements |