The ultra-fine stable dispersed spherical silica micro-powder is a high-performance inorganic powder material prepared through advanced processes. It has a unique spherical morphology, ultra-fine particle size (sub-micron to nano level), and excellent dispersion stability. The surface of this product is specially modified and can be widely applied in fields such as electronic packaging, polymer composite materials, coatings, adhesives, ceramics, etc., 6.significantly improving the mechanical properties, thermal conductivity, insulation, and processing fluidity of end products.
The ultra-fine stable dispersed spherical silica micro-powder is a high-performance inorganic powder material prepared through advanced processes. It has a unique spherical morphology, ultra-fine particle size (sub-micron to nano level), and excellent dispersion stability. The surface of this product is specially modified and can be widely applied in fields such as electronic packaging, polymer composite materials, coatings, adhesives, ceramics, etc., 6.significantly improving the mechanical properties, thermal conductivity, insulation, and processing fluidity of end products.
Core Features
1.Spherical Structure: High roundness of particles and smooth surface reduce stress concentration and enhance the fluidity and filling rate of materials. 2.Ultra-fine Particle Size: The D50 particle size range is controllable (0.5-50μm), with uniform distribution, providing a larger specific surface area and interfacial bonding force. 3.High Dispersibility: Surface modification treatment with excellent anti-agglomeration performance enables long-term stable dispersion in both water-based and oil-based systems. 4.Low Oil Absorption Value: Reduces the amount of matrix resin used, lowers the formulation cost, and improves the processing performance at the same time. 5.High Purity: The SiO2 content is ≥99.6%, with extremely low impurity content, meeting the requirements of high-end electronic applications. Functional Adaptability: Customizable surface hydrophobic/hydrophilic treatment, particle size classification, and conductive/insulating functionalization.
Application Fields
Electronic Packaging: Chip packaging adhesives, epoxy molding compounds, improving thermal conductivity and reducing the coefficient of thermal expansion. Composite Materials: Enhances the mechanical properties and wear resistance of engineering plastics and rubbers. Coatings/Inks: Improves the hardness, scratch resistance, and leveling property of the coating. Adhesives: Optimizes the bonding strength and reduces the curing shrinkage rate. Ceramic Materials: Promotes sintering densification and improves the mechanical strength of ceramic products. Thermal Conductive Interface Materials: Applied in high-efficiency thermal conductive scenarios such as 5G heat sinks and LED heat dissipation substrates.
Project
Unit
Typical values
Appearance
/
White powder
Density
kg/m3
2.59×103
Mohs hardness
/
five
Dielectric constant
/
5.0（1MHz）
Dielectric loss
/
0.003（1MHz）
Linear expansion coefficient
1/K
3.8×10-6
Soft composite silicon micro powder can be classified into specifications and matched according to customer requirements based on the following characteristics:
Project
Related indicators
Explain
Chemical Composition
SiO2 content, etc
Having a stable chemical composition to ensure consistent performance
Ion Impurity
Na+, Cl -, etc
Can be as low as 5ppm or below
Particle Size Distribution
D50
D50=0.5-10 µ m optional
Particle size distribution
Adjustments can be made based on typical distributions as required, including multimodal distributions, narrow distributions, etc
Surface Characteristics
Hydrophobicity, oil absorption value, etc
Different functional treatment agents can be selected according to customer requirements
Spherical silica powder
The ultra-fine stable dispersed spherical silica micro-powder is a high-performance inorganic powder material prepared through advanced processes. It has a unique spherical morphology, ultra-fine particle size (sub-micron to nano level), and excellent dispersion stability. The surface of this product is specially modified and can be widely applied in fields such as electronic packaging, polymer composite materials, coatings, adhesives, ceramics, etc., 6.significantly improving the mechanical properties, thermal conductivity, insulation, and processing fluidity of end products.
Core Features
1.Spherical Structure: High roundness of particles and smooth surface reduce stress concentration and enhance the fluidity and filling rate of materials. 2.Ultra-fine Particle Size: The D50 particle size range is controllable (0.5-50μm), with uniform distribution, providing a larger specific surface area and interfacial bonding force. 3.High Dispersibility: Surface modification treatment with excellent anti-agglomeration performance enables long-term stable dispersion in both water-based and oil-based systems. 4.Low Oil Absorption Value: Reduces the amount of matrix resin used, lowers the formulation cost, and improves the processing performance at the same time. 5.High Purity: The SiO2 content is ≥99.6%, with extremely low impurity content, meeting the requirements of high-end electronic applications. Functional Adaptability: Customizable surface hydrophobic/hydrophilic treatment, particle size classification, and conductive/insulating functionalization.
Application Fields
Electronic Packaging: Chip packaging adhesives, epoxy molding compounds, improving thermal conductivity and reducing the coefficient of thermal expansion. Composite Materials: Enhances the mechanical properties and wear resistance of engineering plastics and rubbers. Coatings/Inks: Improves the hardness, scratch resistance, and leveling property of the coating. Adhesives: Optimizes the bonding strength and reduces the curing shrinkage rate. Ceramic Materials: Promotes sintering densification and improves the mechanical strength of ceramic products. Thermal Conductive Interface Materials: Applied in high-efficiency thermal conductive scenarios such as 5G heat sinks and LED heat dissipation substrates.
Project
Unit
Typical values
Appearance
/
White powder
Density
kg/m3
2.59×103
Mohs hardness
/
five
Dielectric constant
/
5.0（1MHz）
Dielectric loss
/
0.003（1MHz）
Linear expansion coefficient
1/K
3.8×10-6
Soft composite silicon micro powder can be classified into specifications and matched according to customer requirements based on the following characteristics:
Project
Related indicators
Explain
Chemical Composition
SiO2 content, etc
Having a stable chemical composition to ensure consistent performance
Ion Impurity
Na+, Cl -, etc
Can be as low as 5ppm or below
Particle Size Distribution
D50
D50=0.5-10 µ m optional
Particle size distribution
Adjustments can be made based on typical distributions as required, including multimodal distributions, narrow distributions, etc
Surface Characteristics
Hydrophobicity, oil absorption value, etc
Different functional treatment agents can be selected according to customer requirements
