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Sphaerica Silica pulveris
summus puritas, humilis-impuritas Industrial-gradus sphaericam Silica Micro Pulvis est summus perficientur inorganic non-metallicis materia fabrica per provectus processus technology. Cum suis unique sphaerica structuram, ultra-excelsum puritatem (Sio2 content ≥99.6%), et maxime humilis immunditia campester, in productum exhibet exhibet eximia floscal, dispersibilitatem, scelerisque stabilitatem et eget. Est late in electronic packaging, summus finem coatings, Polymer composites, Ceramics, adhesives, et alia industriae agri, servientes ut an idealis eget filler ad augendae uber perficientur.
Altus puritas & humilis impudicitiis
Sio2 puritatem ≥99.6%, cum immunditia elementa (eg, Fe, NA, CL-) regit ad PPM campester, cursus materiae stabilitatem et reliability.
Sphaerica Morphologia
Humilis coefficiens scelerisque expansion (cte) et summus temperatus resistentia (usque ad MDC ° C), ideal in summus temperatus packaging et composita materiae.
Chemical inertness
Rudicra acida, alkalis, et corrosio, compatible cum maxime resinae et plastic systems, extendens finem-productum lifespan.
Perfect sphaericae particulas et uniformis mole distribution (Customizable inter 0.5-50μm), enhancing sarcina density et floscal cum reducing friction.
Superior scelerisque proprietatibus
Product Application
Electronic packaging : Integrated Circuitus (IC), chip encapsulation, enhancing scelerisque conductivity et mechanica vires.
Polymer Composites : Epoxy resinae et silicone modificatio, improvidus resistentia et dimensional stabilitatem.
High-finem coatings & Inks : enhancing coating duritia, gerunt resistentia, et superficies Glossa.
Customization Service
Fusce particula magnitudine distribution et superficiem treatments (eg, hydrophobic modificatio) pro diversis industriae applications.
Project | Unitas | Typical values |
Species | / | Alba pulveris |
Densitas | kg / m3 | 2.59 × CIII |
Mohs duritiam | / | quinque |
Dielectric constant | / | 5.0 (1mhz) |
Differtur Differt | / | 0.003 (1mhz) |
Linearibus expansion coefficientem | I / k | 3,8 × 10-6 |
Mollis compositum Silicon microfer potest classificatis in cubits et matched secundum Lorem requisitis secundum sequentes characteres:
Project | Related Indicatores | Explano |
Chemical compositionem | Sio2 contentus, etc. | Habens stabile chemical compositionem ut consistent perficientur |
Ion impuritas | Na +, Cl -, etc. | Potest esse humilis ut 5PPM vel infra |
Particula magnitudine distribution | D50 | D50 = 0.5-10 μ M libitum |
Particula magnitudine distribution | Referendo potest fieri secundum typicam distributiones quod requiritur, inter multimodal distributiones, angusta distributiones, etc. | |
Superficies characteres | Hydrophobicity, oleum effusio valorem, etc. | Diversis muneris curatio agentia potest electus secundum elit requisita |
Sphaerica Silica pulveris
summus puritas, humilis-impuritas Industrial-gradus sphaericam Silica Micro Pulvis est summus perficientur inorganic non-metallicis materia fabrica per provectus processus technology. Cum suis unique sphaerica structuram, ultra-excelsum puritatem (Sio2 content ≥99.6%), et maxime humilis immunditia campester, in productum exhibet exhibet eximia floscal, dispersibilitatem, scelerisque stabilitatem et eget. Est late in electronic packaging, summus finem coatings, Polymer composites, Ceramics, adhesives, et alia industriae agri, servientes ut an idealis eget filler ad augendae uber perficientur.
Altus puritas & humilis impudicitiis
Sio2 puritatem ≥99.6%, cum immunditia elementa (eg, Fe, NA, CL-) regit ad PPM campester, cursus materiae stabilitatem et reliability.
Sphaerica Morphologia
Humilis coefficiens scelerisque expansion (cte) et summus temperatus resistentia (usque ad MDC ° C), ideal in summus temperatus packaging et composita materiae.
Chemical inertness
Rudicra acida, alkalis, et corrosio, compatible cum maxime resinae et plastic systems, extendens finem-productum lifespan.
Perfect sphaericae particulas et uniformis mole distribution (Customizable inter 0.5-50μm), enhancing sarcina density et floscal cum reducing friction.
Superior scelerisque proprietatibus
Product Application
Electronic packaging : Integrated Circuitus (IC), chip encapsulation, enhancing scelerisque conductivity et mechanica vires.
Polymer Composites : Epoxy resinae et silicone modificatio, improvidus resistentia et dimensional stabilitatem.
High-finem coatings & Inks : enhancing coating duritia, gerunt resistentia, et superficies Glossa.
Customization Service
Fusce particula magnitudine distribution et superficiem treatments (eg, hydrophobic modificatio) pro diversis industriae applications.
Project | Unitas | Typical values |
Species | / | Alba pulveris |
Densitas | kg / m3 | 2.59 × CIII |
Mohs duritiam | / | quinque |
Dielectric constant | / | 5.0 (1mhz) |
Differtur Differt | / | 0.003 (1mhz) |
Linearibus expansion coefficientem | I / k | 3,8 × 10-6 |
Mollis compositum Silicon microfer potest classificatis in cubits et matched secundum Lorem requisitis secundum sequentes characteres:
Project | Related Indicatores | Explano |
Chemical compositionem | Sio2 contentus, etc. | Habens stabile chemical compositionem ut consistent perficientur |
Ion impuritas | Na +, Cl -, etc. | Potest esse humilis ut 5PPM vel infra |
Particula magnitudine distribution | D50 | D50 = 0.5-10 μ M libitum |
Particula magnitudine distribution | Referendo potest fieri secundum typicam distributiones quod requiritur, inter multimodal distributiones, angusta distributiones, etc. | |
Superficies characteres | Hydrophobicity, oleum effusio valorem, etc. | Diversis muneris curatio agentia potest electus secundum elit requisita |