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Sphaerica Silica pulveris
ultra-denique firmum dispersit sphaericam Silica micro-pulveris est summus perficientur inorganicis pulveris materia paratus per provectus processus. Is est a unique sphaerica Insecta, Ultra-denique particula magnitudine (sub-micron ad Nano campester) et praeclarus dispersionem stabilitatem. In superficies huius productum est specialiter modificatur et potest late applicari in agros ut electronic packaging, polymer composita materiae, coatings, adhesiving, Ceramics proprietatibus, 6.signeming in mechanica proprietatibus, in finem products, et processui floriditate, in finem products, et processui floriditate, in finem products, et processui floriditate, in finem products, et processui floriditatem, in finem products, et processui floriditatem, in finem products, et processui floriditatem, in finem products, et processui floriditate, in finem products, et processui floriditate, in finem products et processui et finem products.
1.Pherical structuram: High Round Courtness Particulae et lenis superficies redigendum accentus concentration et augendae et fluiditatem et implens rate of materiae.
2.ultra-denique particula magnitudine: et D50 particulam amplitudo range est controllable (0.5-50μm), cum uniformis distribution, providing maior specifica superficiem area et interfacial vinculum vi.
3.High dispersibility, superficiem modificatio curatio est optimum anti-agglomeration perficientur dat longa-term stabilis dispersionem in utroque aqua-fundatur et oleum-fundatur ratio.
4.low oleum effusio valorem: reduces moles matrix resina usus, dimittit formula cost et amplio processus perficientur simul.
5.High Puritas: et Sio2 Content is ≥99.6%, cum maxime humilis immunditia contentus, occurrens ad necessitates summus finem electronic applications.
Eget adaptability: Fusce superficies Hydrophobic / Hydrophilic curatio, particula Size: et PROLIXUS / insulating functionalization.
Applicationem agri
Electronic packaging: chip packaging adhesives, epoxy coronam componit, improving scelerisque conductivity et reducendo coefficientem scelerisque expansion.
Composita materiae: Enhances ad mechanica proprietatibus et gerunt resistentia de ipsum plastics et rildbers.
Coatings / inks: amplio duritiem, scalpere resistentia, et adtritio proprietas de coating.
Adhesives: Optimizes ad vinculum vires et reduces ad curationes DECREMENTUM Rate.
Ceramic Materials: Promotes Renault Densificatio et amplio mechanica robur Ceramic products.
PROCURATIO interface materiae: applicantur in altus-efficientiam scelerisque PROLIXUS missionibus talis ut 5G calor demergit et ducitur calor dissipationem subiecta.
Project | Unitas | Typical values |
Species | / | Alba pulveris |
Densitas | kg / m3 | 2.59 × CIII |
Mohs duritiam | / | quinque |
Dielectric constant | / | 5.0 (1mhz) |
Differtur Differt | / | 0.003 (1mhz) |
Linearibus expansion coefficientem | I / k | 3,8 × 10-6 |
Mollis compositum Silicon microfer potest classificatis in cubits et matched secundum Lorem requisitis secundum sequentes characteres:
Project | Related Indicatores | Explano |
Chemical compositionem | Sio2 contentus, etc. | Habens stabile chemical compositionem ut consistent perficientur |
Ion impuritas | Na +, Cl -, etc. | Potest esse humilis ut 5PPM vel infra |
Particula magnitudine distribution | D50 | D50 = 0.5-10 μ M libitum |
Particula magnitudine distribution | Referendo potest fieri secundum typicam distributiones quod requiritur, inter multimodal distributiones, angusta distributiones, etc. | |
Superficies characteres | Hydrophobicity, oleum effusio valorem, etc. | Diversis muneris curatio agentia potest electus secundum elit requisita |
Sphaerica Silica pulveris
ultra-denique firmum dispersit sphaericam Silica micro-pulveris est summus perficientur inorganicis pulveris materia paratus per provectus processus. Is est a unique sphaerica Insecta, Ultra-denique particula magnitudine (sub-micron ad Nano campester) et praeclarus dispersionem stabilitatem. In superficies huius productum est specialiter modificatur et potest late applicari in agros ut electronic packaging, polymer composita materiae, coatings, adhesiving, Ceramics proprietatibus, 6.signeming in mechanica proprietatibus, in finem products, et processui floriditate, in finem products, et processui floriditate, in finem products, et processui floriditate, in finem products, et processui floriditatem, in finem products, et processui floriditatem, in finem products, et processui floriditatem, in finem products, et processui floriditate, in finem products, et processui floriditate, in finem products et processui et finem products.
1.Pherical structuram: High Round Courtness Particulae et lenis superficies redigendum accentus concentration et augendae et fluiditatem et implens rate of materiae.
2.ultra-denique particula magnitudine: et D50 particulam amplitudo range est controllable (0.5-50μm), cum uniformis distribution, providing maior specifica superficiem area et interfacial vinculum vi.
3.High dispersibility, superficiem modificatio curatio est optimum anti-agglomeration perficientur dat longa-term stabilis dispersionem in utroque aqua-fundatur et oleum-fundatur ratio.
4.low oleum effusio valorem: reduces moles matrix resina usus, dimittit formula cost et amplio processus perficientur simul.
5.High Puritas: et Sio2 Content is ≥99.6%, cum maxime humilis immunditia contentus, occurrens ad necessitates summus finem electronic applications.
Eget adaptability: Fusce superficies Hydrophobic / Hydrophilic curatio, particula Size: et PROLIXUS / insulating functionalization.
Applicationem agri
Electronic packaging: chip packaging adhesives, epoxy coronam componit, improving scelerisque conductivity et reducendo coefficientem scelerisque expansion.
Composita materiae: Enhances ad mechanica proprietatibus et gerunt resistentia de ipsum plastics et rildbers.
Coatings / inks: amplio duritiem, scalpere resistentia, et adtritio proprietas de coating.
Adhesives: Optimizes ad vinculum vires et reduces ad curationes DECREMENTUM Rate.
Ceramic Materials: Promotes Renault Densificatio et amplio mechanica robur Ceramic products.
PROCURATIO interface materiae: applicantur in altus-efficientiam scelerisque PROLIXUS missionibus talis ut 5G calor demergit et ducitur calor dissipationem subiecta.
Project | Unitas | Typical values |
Species | / | Alba pulveris |
Densitas | kg / m3 | 2.59 × CIII |
Mohs duritiam | / | quinque |
Dielectric constant | / | 5.0 (1mhz) |
Differtur Differt | / | 0.003 (1mhz) |
Linearibus expansion coefficientem | I / k | 3,8 × 10-6 |
Mollis compositum Silicon microfer potest classificatis in cubits et matched secundum Lorem requisitis secundum sequentes characteres:
Project | Related Indicatores | Explano |
Chemical compositionem | Sio2 contentus, etc. | Habens stabile chemical compositionem ut consistent perficientur |
Ion impuritas | Na +, Cl -, etc. | Potest esse humilis ut 5PPM vel infra |
Particula magnitudine distribution | D50 | D50 = 0.5-10 μ M libitum |
Particula magnitudine distribution | Referendo potest fieri secundum typicam distributiones quod requiritur, inter multimodal distributiones, angusta distributiones, etc. | |
Superficies characteres | Hydrophobicity, oleum effusio valorem, etc. | Diversis muneris curatio agentia potest electus secundum elit requisita |