This product is manufactured from high-purity quartz sand through high-temperature melting, ultra-fine grinding, and precision classification processes. It boasts a purity of over 99%, controllable particle size distribution (adjustable D50 range of 0.5μm-50μm), low thermal expansion coefficient, and excellent chemical stability. Widely used in high-end electronics, specialty ceramics, coatings, adhesives, and other fields, it serves as a key functional filler for high-performance materials.
This product is manufactured from high-purity quartz sand through high-temperature melting, ultra-fine grinding, and precision classification processes. It boasts a purity of over 99%, controllable particle size distribution (adjustable D50 range of 0.5μm-50μm), low thermal expansion coefficient, and excellent chemical stability. Widely used in high-end electronics, specialty ceramics, coatings, adhesives, and other fields, it serves as a key functional filler for high-performance materials.
Key Parameters
Parameter
Value/Description
Purity
≥99%
Particle Size (D50)
0.5μm-50μm (custom grading available)
Morphology
Angular
Whiteness
≥92%
Density
2.2 g/cm³
Mohs Hardness
7
Thermal Expansion Coefficient
0.5×10-6/ºC (20-1000ºC)
Dielectric Constant
3.8 (1MHz)
Product Advantages
High Purity Assurance - Rigorous raw material selection and pollution-free production ensure ≥99% purity, meeting stringent industry requirements for semiconductors and photovoltaics. Precise Particle Size Control - Real-time laser particle size monitoring, adjustable D50 range of 0.5-50μm, supports customized particle size distribution. Stable Performance - Low impurities (Fe, Al, and other metal content <100ppm), low oil absorption (20-30g/100g), and high batch-to-batch consistency. Versatile Applications - Combines reinforcement, insulation, heat resistance, and corrosion resistance, significantly enhancing composite material performance.
Typical Applications
Electronic Materials: IC packaging fillers, PCB substrates, electronic adhesives
In-house 2,000-ton/year production capacity ensures stable supply Professional laboratory supports application testing and solution development Extensive experience in silicon material production, serving leading industry clients
Product Overview
This product is manufactured from high-purity quartz sand through high-temperature melting, ultra-fine grinding, and precision classification processes. It boasts a purity of over 99%, controllable particle size distribution (adjustable D50 range of 0.5μm-50μm), low thermal expansion coefficient, and excellent chemical stability. Widely used in high-end electronics, specialty ceramics, coatings, adhesives, and other fields, it serves as a key functional filler for high-performance materials.
Key Parameters
Parameter
Value/Description
Purity
≥99%
Particle Size (D50)
0.5μm-50μm (custom grading available)
Morphology
Angular
Whiteness
≥92%
Density
2.2 g/cm³
Mohs Hardness
7
Thermal Expansion Coefficient
0.5×10-6/ºC (20-1000ºC)
Dielectric Constant
3.8 (1MHz)
Product Advantages
High Purity Assurance - Rigorous raw material selection and pollution-free production ensure ≥99% purity, meeting stringent industry requirements for semiconductors and photovoltaics. Precise Particle Size Control - Real-time laser particle size monitoring, adjustable D50 range of 0.5-50μm, supports customized particle size distribution. Stable Performance - Low impurities (Fe, Al, and other metal content <100ppm), low oil absorption (20-30g/100g), and high batch-to-batch consistency. Versatile Applications - Combines reinforcement, insulation, heat resistance, and corrosion resistance, significantly enhancing composite material performance.
Typical Applications
Electronic Materials: IC packaging fillers, PCB substrates, electronic adhesives
In-house 2,000-ton/year production capacity ensures stable supply Professional laboratory supports application testing and solution development Extensive experience in silicon material production, serving leading industry clients
