Availability: | |
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Quantity: | |
Product Application:
Copper clad laminates, ink coatings, adhesives, electronic packaging, composite materials, etc.
Project | Unit | Typical Values |
Appearance | / | White Powder |
Density | kg/m³ | 2.58x103 |
Mohs Hardness | / | 5 |
Dielectric Constant | 8r | 6.62 |
Dielectric Loss | tg8 | 0.0011 |
Linear Expansion Coefficient | 1/K | 0.8x10-6 |
Thermal Conductivity | w/K-m | 0.8 |
Product Application:
Copper clad laminates, ink coatings, adhesives, electronic packaging, composite materials, etc.
Project | Unit | Typical Values |
Appearance | / | White Powder |
Density | kg/m³ | 2.58x103 |
Mohs Hardness | / | 5 |
Dielectric Constant | 8r | 6.62 |
Dielectric Loss | tg8 | 0.0011 |
Linear Expansion Coefficient | 1/K | 0.8x10-6 |
Thermal Conductivity | w/K-m | 0.8 |