Products

You are here: Home » Products » Alumina Powder » Alumina Powder for Electronic Ceramic Substrates

Alumina Powder for Electronic Ceramic Substrates

This product is a high-purity aluminum oxide powder (Al2O3), specially developed for high-end electronic applications such as electronic ceramic substrates, circuit boards, and insulating devices. It features high purity, excellent sintering activity, and stable dielectric properties, ensuring high strength, high thermal conductivity, and superior insulation for ceramic substrates. It is suitable for harsh electronic environments such as high-frequency circuits, power modules, and LED packaging.

Availability:

Quantity:



Inquire Add to Basket

Product Description

Product Description
This product is a high-purity aluminum oxide powder (Al ₂O ₃), specially developed for high-end electronic applications such as electronic ceramic substrates, circuit boards, and insulating devices. It features high purity, excellent sintering activity, and stable dielectric properties, ensuring high strength, high thermal conductivity, and superior insulation for ceramic substrates. It is suitable for harsh electronic environments such as high-frequency circuits, power modules, and LED packaging.

Core Advantages
High purity (≥99%) - Low sodium and potassium content to avoid electron migration issues
Optimized particle size distribution (2-50μm) - Balances sintering density and molding performance
High sintering activity - Reduces sintering temperature and energy consumption
Excellent dielectric properties - Suitable for high-frequency circuit applications
High thermal conductivity (20-30 W/m·K) - Improves heat dissipation efficiency of electronic devices
Strict quality control - Batch-to-batch stability within ±1%

Typical Applications
Electronic ceramic substrates: HTCC/LTCC substrates, circuit carrier boards
Power module packaging: Insulating substrates for IGBT and SiC modules
RF devices: 5G filters, antenna substrates
LED packaging: COB packaging ceramic bases
Sensor ceramics: Insulating components for pressure/temperature sensors

Process Support
Pre-sintered powder available (reduces sintering shrinkage)
Surface modification supported (improves tape casting performance)
Customizable particle size distribution (meets different molding process requirements)

Packaging and Transportation
Standard packaging: 25kg/bag (moisture-proof aluminum foil bag + cardboard drum)
Special packaging: Vacuum packaging available upon request

Why Choose Us?
▪ Certified to ISO9001/IATF16949 quality management systems

▪ Monthly production capacity of 200 tons ensures stable supply

Inquiry Tips
Free samples available (shipping costs to be borne by the recipient)
TDS/MSDS/test reports (TDS/MSDS/test reports available)

Quality Index

Serial Number	Project	Unit	Index
Serial Number	Project	Unit	YJ-A	YJ-B
1	AL₂O₃	%≥	99.5	99.5
2	SiO₂	%≤	0.10	0.10
3	Fe₂O₃	%≤	0.03	0.04
4	Na₂O	%≤	0.10	0.20
5	Caustic soda	%≤	1.0	1.0
6	α-AL₂O₃	%≥	96.0	95.0
7	True proportion	%≥g/cm3	3.96	3.94
8	Particle size%	≤2um	≥90	≥85
8	Particle size%	D50um	≥0.60	≥0.80