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Aluminum Hydroxide Powder for Ccl
Aluminum Hydroxide Powder for Ccl Aluminum Hydroxide Powder for Ccl

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Aluminum Hydroxide Powder for Ccl

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Specially engineered for copper clad laminate (CCL) applications, our high-performance aluminum hydroxide powder delivers exceptional flame retardancy, high purity, and stable thermal decomposition properties. With ultrafine particle size distribution (D50 0.5-20μm), it ensures uniform dispersion in resin systems, significantly enhancing the flame retardant rating and dielectric properties of CCL while maintaining excellent processing fluidity.
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Product Description:

Specially engineered for copper clad laminate (CCL) applications, our high-performance aluminum hydroxide powder delivers exceptional flame retardancy, high purity, and stable thermal decomposition properties. With ultrafine particle size distribution (D50 0.5-20μm), it ensures uniform dispersion in resin systems, significantly enhancing the flame retardant rating  and dielectric properties of CCL while maintaining excellent processing fluidity.

Specifications:

Parameter Value
Chemical Formula Al(OH)3
Particle Size (D50) 0.5-20μm (customizable)
Purity ≥99.5%
Whiteness ≥95%
Decomposition Temperature ≥200°C
Moisture Content ≤0.3%
Item Unit Typical Values
Exterior / white powder
Density kg/m³ 2.65 ×103
Moh's hardness / 4
Coefficient of linear expansion 1/k 14×10-6
PH / 7
Oil factor g/100g 31

 


Key Advantages


Superior Flame Retardancy

  • Endothermic decomposition releases water vapor to dilute flammable gases, significantly improving CCL's flame resistance.

Low Dielectric Loss

  • High purity with minimal impurities ensures stable signal transmission in high-frequency circuits.

Excellent Dispersibility

  • Ultrafine spherical/near-spherical particles reduce resin system viscosity and improve processability.

Eco-Friendly & Safe

  • Halogen-free flame retardant compliant with RoHS/REACH standards, ideal for premium electronic materials.

Customization Available

  • Surface modification (silane coupling agent treatment) option to enhance resin interfacial bonding.

Applications


  • Copper Clad Laminates (CCL): FR-4, high-frequency CCL, halogen-free CCL

  • Electronic Packaging Materials: Semiconductor substrates, IC carriers

  • Other Flame Retardant Composites: PCB solder mask, electronic adhesives

Why Choose Our Product?


  1. CCL-Optimized Formula: Particle size and surface characteristics tailored for CCL applications to prevent filler agglomeration.

  2. Strict Quality Control: Each batch includes ICP test reports to guarantee ultra-low metal ion content (Na+, Cl-, etc.).

  3. Technical Support: Provides flame retardancy test data and formulation recommendations to facilitate product upgrades.

Packaging & Storage


  • Packaging: 25kg/bag (customizable)

  • Storage: Keep in cool, dry place (recommended humidity ≤60%)

Success Cases


Already adopted by multiple premium CCL manufacturers in China, helping clients achieve UL certification and improve production yield.





Serial Number Project Unit Indicators
1

AL(OH)3

% ≥

99.6

2

Al2O3

% ≥

64

3

SiO2

%<

0.04

4

Fe2O3

%<

0.02

5 Na2O

%<

0.3

6

Whiteness ratio

% ≥

93

7 Caustic soda % 34.5±0.5

An excellent manufacturing enterprise

The company has 20 patents, the company has passed ISO9001 and ISO14001 certification, and has been recognized as a national high-tech enterprise

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+8618936720888
+86-189-3672-0888

CONTACT US

Tel: +86-189-3672-0888
Emai: sales@silic-st.com
WhatsApp: +8618936720888
Add: No. 8-2, Zhenxing South Road, High-tech Development Zone, Donghai County, Jiangsu Province

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