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Aluminum Hydroxide Powder for Thermal Conductive Materials
Aluminum Hydroxide Powder for Thermal Conductive Materials Aluminum Hydroxide Powder for Thermal Conductive Materials

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Aluminum Hydroxide Powder for Thermal Conductive Materials

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This product is a high thermal conductivity aluminum hydroxide powder (ATH), specially developed for high-end applications such as electronic packaging, thermal interface materials (TIM), and LED heat dissipation. It features excellent thermal conductivity (1.5-2.5 W/m·K), high insulation (volume resistivity ≥1014 Ω·cm), and flame retardancy (UL94 V-0), significantly enhancing the thermal management performance of composite materials while maintaining lightweight properties.
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Product Description:


This product is a high thermal conductivity aluminum hydroxide powder (ATH), specially developed for high-end applications such as electronic packaging, thermal interface materials (TIM), and LED heat dissipation. It features excellent thermal conductivity (1.5-2.5 W/m·K), high insulation (volume resistivity ≥1014 Ω·cm), and flame retardancy (UL94 V-0), significantly enhancing the thermal management performance of composite materials while maintaining lightweight properties.

Specifications:

Parameter Value
Chemical Formula Al(OH)3
Particle Size (D50) 1-20μm (customizable)
Thermal Conductivity 1.5-2.5 W/m·K
Purity ≥99.5%
Whiteness ≥95%
Moisture Content ≤0.3%
Loss on Ignition 34.5±1%
Volume Resistivity ≥1014Ω·cm
Flame Rating UL94 V-0
Item Unit Typical Values
Exterior / white powder
Density kg/m³ 2.65 ×103
Moh's hardness / 4
Coefficient of linear expansion 1/k 14×10-6
Oil factor g/100g 31

 

Key Advantages


High Thermal Conductivity: Optimized particle morphology for improved heat transfer
Dual Functionality: Combines thermal conduction and flame retardancy (low smoke, non-toxic)
High Insulation: Ideal for insulating electronic components
Easy Processing: Low oil absorption (≤31ml/100g), compatible with resins/silicone oils
Customizable: Adjustable particle size (1-50μm), surface modification (silane coupling agent)


Typical Applications


  • Electronic Packaging: IC encapsulation, 5G base station thermal pads

  • Thermal Interface Materials (TIM): Thermal grease, gel fillers

  • LED Heat Dissipation: Lamp housing, heat sink composites

  • New Energy Batteries: Flame-retardant thermal coatings for power batteries

  • High-End Plastics: Thermal conductive engineering plastics (PA, PBT, etc.)


Why Choose Us?


Electronic-Grade Purity: Heavy metal content ≤10ppm, compliant with RoHS/REACH
Technical Support: Formula optimization and application testing assistance
Stable Supply: Free samples available


Packaging & Storage


  • Standard Packaging: 25kg/bag (customizable)

  • Storage Conditions: Keep in a cool, dry place to avoid moisture absorption


An excellent manufacturing enterprise

The company has 20 patents, the company has passed ISO9001 and ISO14001 certification, and has been recognized as a national high-tech enterprise

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+8618936720888
+86-189-3672-0888

CONTACT US

Tel: +86-189-3672-0888
Emai: sales@silic-st.com
WhatsApp: +8618936720888
Add: No. 8-2, Zhenxing South Road, High-tech Development Zone, Donghai County, Jiangsu Province

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